Housing body and method for production thereof

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A HEAT SPREADER

Four MOSFET full bridge module

Half-bridge electronic device with common heat sink on mounting surface

Light emitting elements, light emitting devices including light emitting elements and methods of manufacturing such light emitting elements and/or device

In situ-built pin-grid arrays for coreless substrates, and methods of making same

Method and apparatuses for integrated circuit substrate manufacture

Stack package having flexible conductors

Semiconductor Device and Method of Forming a Wafer Level Package Structure Using Conductive Via and Exposed Bump

Integrated heater on MEMS cap for wafer scale packaged MEMS sensors

Package substrate having die pad with outer raised portion and interior recessed portion

Backside-illuminated image sensor having a supporting substrate

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Die attached to a support member by a plurality of adhesive members

Method for manufacturing a through hole electrode substrate

Method for producing an infrared light detector

SEMICONDUCTOR DEVICE WITH ENCAPSULATED ELECTRICAL CONNECTION ELEMENTS AND FABRICATION PROCESS THEREOF

Enhanced WLP for superior temp cycling, drop test and high current applications

POP PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps

Semiconductor package having electrode on side surface, and semiconductor device

DC/DC CONVERTOR POWER MODULE PACKAGE INCORPORATING A STACKED CONTROLLER AND CONSTRUCTION METHODOLOGY

Integrated circuit packaging system with a lead and method of manufacture thereof

Integrated circuit packaging system with exposed vertical interconnects and method of manufacture thereof

Semiconductor device and manufacturing method

Photoelectric Transmitting Or Receiving Device And Manufacturing Method Thereof

Die backside standoff structures for semiconductor devices

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

APPARATUS AND METHOD FOR TREATING A SUBSTRATE

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADS AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with laser hole and method of manufacture thereof

Semiconductor package

Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof

Integrated circuit packaging system with support structure and method of manufacture thereof

Power module package and system module having the same

Semiconductor package for MEMS device and method of manufacturing same

Method of Manufacturing a semiconductor module and device for the same

Semiconductor package

Chip with sintered connections to package

STACKED SEMICONDUCTOR DEVICE

Solder alloys and arrangements

Implantable microelectronic device and method of manufacture

Semiconductor device and driving apparatus including semiconductor device

Multilayered board semiconductor device with BGA package

Exposed interconnect for a package on package system

Electrical connection for chip scale packaging

Electronic device including a packaging substrate having a trench

SEMICONDUCTOR PACKAGE WITH PRE-SOLDERED GROOVES IN LEADS

HIGH-FREQUENCY MODULE MANUFACTURING METHOD

Semiconductor device, semiconductor package, and electronic device

SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME

Light emitting device, light emitting system having the same, and fabricating method of the light emitting device and the light emitting system

MODULE MANUFACTURING METHOD

Distributed semiconductor device methods, apparatus, and systems

Memory device and fabricating method thereof

Amplifier component comprising a compensation element

Electrically-cooled power module

Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method

Semiconductor device and stacked-type semiconductor device

Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

Integrated circuit packaging system with vertical interconnects and method of manufacture thereof

Stacked power semiconductor device using dual lead frame and manufacturing method

Methods for forming assemblies and multi-chip modules including stacked semiconductor dice

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Shielded electronic components and method of manufacturing the same

Common drain exposed conductive clip for high power semiconductor packages

Multi-transistor exposed conductive clip for high power semiconductor packages

Thermally enhanced semiconductor package with exposed parallel conductive clip

Integrated circuit package system with internal stacking module

Semiconductor devices including stress relief structures

Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer

Circuit board having bypass pad

METHOD FOR PROCESSING CIRCUIT IN PACKAGE

EMBEDDED CHIP PACKAGE

Integrated circuit packaging system with interconnect and method of manufacture thereof

Semiconductor device and a manufacturing method thereof

Method of producing semiconductor module and semiconductor module

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Power semiconductor module

Universal chip carrier and method

Method of producing semiconductor device with patterned photosensitive adhesive

Integrated circuit packaging system with formed interconnects and method of manufacture thereof

Integrated circuit packaging system with electrical interface and method of manufacture thereof

Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die

Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die

Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof

Electronic device packaging structure

Col-based semiconductor package including electrical connections through a single layer leadframe

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated passive component

MEMS component and a semiconductor component in a common housing having at least one access opening

Vertical power transistor die packages and associated methods of manufacturing

Package structure

EPOXY COATING ON SUBSTRATE FOR DIE ATTACH

Semiconductor device and method of forming wafer level die integration

Apparatus and method for embedding components in small-form-factor, system-on-packages

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP

Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POP

Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion

Semiconductor device

POWER SUPPLY MODULE AND PACKAGING AND INTEGRATING METHOD THEREOF

Integrated circuit chip package and manufacturing method thereof

Semiconductor device and manufacturing method of the same

Power amplifier

Integrated circuit package system employing mold flash prevention technology

Multi-chip module with stacked face-down connected dies

Stacked chip-on-board module with edge connector

Method of assembling semiconductor device including insulating substrate and heat sink

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER

Integrated circuit with electromagnetic communication

Contact and contactless differential I/O pads for chip-to-chip communication and wireless probing

ASSEMBLY OF STACKED DEVICES WITH SEMICONDUCTOR COMPONENTS

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution

DEVICE PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Packaging an electronic device

SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODS

Circuit board structure and packaging structure comprising the circuit board structure

Interconnect-use electronic component and method for producing same

Method for making circuit board

Compact low-flare solid-state imaging apparatus and electronic system comprising a compact low-flare solid-state imaging apparatus

ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND PRODUCTION METHOD THEREOF

Exposed die package for direct surface mounting

Microstructure device comprising a face to face electromagnetic near field coupling between stacked device portions and method of forming the device

PHOSPHOR AND LIGHT-EMITTING DEVICE

MONOLITHIC INTEGRATED CAPACITORS FOR HIGH-EFFICIENCY POWER CONVERTERS

Packaged electronic devices having die attach regions with selective thin dielectric layer

Stacked package, method of fabricating stacked package, and method of mounting stacked package fabricated by the method

Integrated circuit package including miniature antenna

Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device

Method for manufacturing semiconductor devices having a glass substrate

Semiconductor device

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

Sensor device and manufacturing method thereof

Semiconductor packages

Method of fabricating semiconductor die with through-hole via on saw streets and through-hole via in active area of die

Semiconductor device and method of forming pad layout for flipchip semiconductor die

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Integrated circuit packaging system with filled vias and method of manufacture thereof

Semiconductor device

Integrated circuit packaging system with interconnects and method of manufacture thereof

Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof

Integrated circuit packaging system with lead frame etching and method of manufacture thereof

Substrate for a microelectronic package and method of fabricating thereof

Magnetic integration double-ended converter

Techniques for packaging multiple device components

Integrated circuit packaging system with pads and method of manufacture thereof

Semiconductor Device and Method of Forming High Routing Density Interconnect Sites on Substrate

Apparatus for thermally enhanced semiconductor package

PACKAGE-ON-PACKAGE STRUCTURE

Semiconductor memory card

Folded leadframe multiple die package

Leadframe-based mold array package heat spreader and fabrication method therefor

Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof

Integrated circuit packaging system with an interposer substrate and method of manufacture thereof

Integrated circuit packaging system for electromagnetic interference shielding and method of manufacture thereof

Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die

Semiconductor laser mounting for improved frequency stability

Electronic device for switching currents and method for producing the same

Semiconductor device

ELECTRONIC DEVICE AND METHOD FOR PRODUCING A DEVICE

Power module for an automobile

Inserts for directing molding compound flow and semiconductor die assemblies

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM USING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Package and high frequency terminal structure for the same

Semiconductor device manufacturing method

METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE PACKAGE AND ELECTRONIC DEVICE PACKAGE

Carrier-free semiconductor package

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES

Semiconductor housing and method for the production of a semiconductor housing

Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof

Semiconductor package structure and manufacturing method thereof

Radiator and method of manufacturing radiator

Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint

Printed circuit board and semiconductor package using the same

Method for fabrication of configurable systems

Semiconductor device with resin mold

Electronic device with aerogel thermal isolation

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of forming vertical interconnect structure between semiconductor die and substrate

Semiconductor device and method of forming stress relief layer between die and interconnect structure

Semiconductor component and production method

Wire bond pad system and method

Semiconductor device having a bus configuration which reduces electromigration

Semiconductor packages and methods of packaging semiconductor devices

Mechanical coupling in a multi-chip module using magnetic components

Methods of forming a microshield on standard QFN package

Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same

Integrated circuit package with molded cavity

Multi-stack semiconductor integrated circuit device

Semiconductor package including multiple chips and separate groups of leads

Stacked multi-die electronic device with interposed electrically conductive strap

Semiconductor device packages having a side-by-side device arrangement and stacking functionality

Semiconductor package having substrate for high speed semiconductor package

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bump

Methods of fabricating semiconductor devices

Semiconductor device and method of confining conductive bump material with solder mask patch

Semiconductor device with stacked semiconductor chips

Semiconductor apparatus, manufacturing apparatus, and manufacturing method

MICROWAVE UNIT AND METHOD THEREFORE

Flexible circuit assembly without solder

Biocompatible packaging

Semiconductor Device and Method of Forming Narrow Interconnect Sites on Substrate with Elongated Mask Openings

Method for mounting a semiconductor chip on a carrier

Sensor arrangement and chip comprising additional fixing pins

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINAL LOCKS AND METHOD OF MANUFACTURE THEREOF

BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SINGLE-PACKAGE WIRELESS COMMUNICATION DEVICE

Assembly jig for a semiconductor device and assembly method for a semiconductor device

IC device having low resistance TSV comprising ground connection

Semiconductor device

Semiconductor device having a vertical interconnect structure using stud bumps

Embedded semiconductor die package and method of making the same using metal frame carrier

ELECTRONIC DEVICE HAVING STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Package-on-package using through-hole via die on saw streets

Semiconductor package with cantilever leads

SEMICONDUCTOR PACKAGES HAVING LEAD FRAMES

Semiconductor device

Integrated shunt resistor with external contact in a semiconductor package

Semiconductor device and method of forming stud bumps over embedded die

Rule-based semiconductor die stacking and bonding within a multi-die package

INPUT/OUTPUT CORE DESIGN AND METHOD OF MANUFACTURE THEREFOR

IC device having low resistance TSV comprising ground connection

Dual molded multi-chip package system

Manufacturing method of semiconductor device and semiconductor device

PACKAGE ON PACKAGE

Semiconductor device, method of manufacturing semiconductor device, and electronic device

Semiconductor structure with low resistance of substrate and low power consumption

STACKED DIE PACKAGES WITH FLIP-CHIP AND WIRE BONDING DIES

MRAM DEVICE AND METHOD OF ASSEMBLING SAME

Light-emitting devices

Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method

Area efficient through-hole connections

Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP

Packaged semiconductor device for high performance memory and logic

Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Device including two semiconductor chips and manufacturing thereof

Semiconductor chip module, semiconductor package having the same and package module

Accurate alignment for stacked substrates

Semiconductor device and method of manufacture thereof

Semiconductor device

Stacked half-bridge package with a current carrying layer

IC package and method for manufacturing the same

Semiconductor die package and method for making the same

Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars

METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD

Laser hammering technique for aligning members of a constructed array of optoelectronic devices

Vertical mount transient voltage suppressor array

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor

Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

Semiconductor packages having lead frames

Selective Deposition in the Fabrication of Electronic Substrates

Semiconductor device and method of forming IPD on molded substrate

Semiconductor package with semiconductor core structure and method of forming same

Packaging photon building blocks having only top side connections in an interconnect structure

Semiconductor packages and methods of fabricating the same

Substrate assembly provided with capacitive interconnections, and manufacturing method thereof

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Stacked-chip device

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Copper pillar full metal via electrical circuit structure

Semiconductor device

Semiconductor package and method of manufacturing the same

Chip assembly with frequency extending device

Leadless semiconductor package with routable leads, and method of manufacture

Stack type semiconductor package and method of fabricating the same

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

Semiconductor electronic device with an integrated device with an integrated galvanic isolator element and related assembly process

Hidden plating traces

Three-dimensional semiconductor device

Three-dimensional system-in-package package-on-package structure

Semiconductor device, and inspection method thereof

Dual-leadframe multi-chip package and method of manufacture

Package with a CMOS die positioned underneath a MEMS die

PACKAGE WITH A CMOS DIE POSITIONED UNDERNEATH A MEMS DIE

Semiconductor power device having a super-junction structure

Wiring board, semiconductor apparatus and method of manufacturing them

Power transistor output match network with high Q RF path and low Q low frequency path

Semiconductor package and package on package having the same

BGA package structure and method for fabricating the same

Elimination of RDL using tape base flip chip on flex for die stacking

Semiconductor device and method of manufacturing semiconductor device

SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT, AND MANUFACTURING METHOD OF JOINING STRUCTURE

Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures

Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages

FOUR MOSFET FULL BRIDGE MODULE

Device housing package and mounting structure

Integrated circuit packaging system with interposer

Semiconductor device with wireless communication

Packaged microelectronic devices recessed in support member cavities, and associated methods

Method for packaging semiconductor dies having through-silicon vias