High-bandwidth ramp-stack chip package

Semiconductor packages including heat slugs

PoP precursor with interposer for top package bond pad pitch compensation

Encapsulant cavity integrated circuit package system and method of fabrication thereof

Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same

SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING ELECTRICAL CONNECTION WITHOUT USING WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME

Method for the low-temperature pressure sintering of electronic units to heat sinks

Semiconductor device

Method for packaging semiconductor dies having through-silicon vias

Semiconductor Device and Method of Forming Conductive TSV in Peripheral Region of Die Prior to Wafer Singulaton

MULTI-CHIP PACKAGE STRUCTURE SUITABLE FOR MULTI-PROCESSOR SYSTEM HAVING MEMORY LINK ARCHITECTURE

Integrated circuit package system employing device stacking and method of manufacture thereof

Electronic component used for wiring and method for manufacturing the same

HEAT SPREADER FOR SEMICONDUCTOR PACKAGE

Semiconductor package having discrete components and system containing the package

Power semiconductor module and method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor device and method of fabrication

IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods

Leadframe having delamination resistant die pad

Semiconductor device

Method for exposing and cleaning insulating coats from metal contact surfaces

Near chip scale package integration process

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Electronic circuit device

Multilayer dielectric substrate and semiconductor package

RESIN VARNISH USED FOR ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

Solder interconnect pads with current spreading layers

Simplified multichip packaging and package design

Lighting device, display, and method for manufacturing the same

Semiconductor optical interconnection device and semiconductor optical interconnection method

Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof

Package structure

Semiconductor Chip Secured to Leadframe by Friction

LEAD FRAME, AND ELECTRONIC PART USING THE SAME

Lead frame routed chip pads for semiconductor packages

Leadframe, leadframe type package and lead lane

Method of assembling a multi-component electronic package

Light-emitting device and manufacturing method thereof

Methods for producing an ultrathin semiconductor circuit

Method of manufacturing semiconductor device

Coil transducer isolator packages

Linked semiconductor module unit and electronic circuit-integrated motor vehicle device using same

Radio-frequency system in package including antenna

Power module and vehicle-mounted inverter using the same

PACKAGE PROCESS AND PACKAGE STRUCTURE

Semiconductor device including two heat sinks and method of manufacturing the same

Semiconductor package and method of forming the same

Near chip scale semiconductor packages

Semiconductor package structure and package method thereof

Semiconductor device with embedded interconnect pad

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

Integrated circuit package system using heat slug

Integrated Direct Conversion Detector Module

METHAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF

Methods of operating electronic devices, and methods of providing electronic devices

ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

MEMORY CARD

Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof

Adhesive film for semiconductor and semiconductor device using the adhesive film

Semiconductor package with substrate having single metal layer and manufacturing methods thereof

Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof

Wafer level stack structure for system-in-package and method thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONTACT PADS AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof

Integrated circuit packaging system with a dual substrate package and method of manufacture thereof

Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof

Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same

Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure

Lead frame design to improve reliability

Semiconductor package having substrate with solder ball connections and method of fabricating the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND METHOD OF MANUFACTURING THE SAME

Semiconductor device having a sealing resin and method of manufacturing the same

Electronic device package and method of manufacture

Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof

Integrated circuit package having a castellated heatspreader

Integrated circuit package stacking system with redistribution and method of manufacture thereof

SEMICONDUCTOR PACKAGE, STACK MODULE, CARD, AND ELECTRONIC SYSTEM

Package-on-package technology for fan-out wafer-level packaging

Integrated circuit packaging system with a stack package and method of manufacture thereof

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Enhanced integrated circuit package

Electronic device and method for fabricating the same

Processes and structures for beveled slope integrated circuits for interconnect fabrication

Image sensor package and image sensing module using same

Processes and structures for IC fabrication

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

Method and apparatus for no lead semiconductor package

Manufacturing method of a lead frame

In-package microelectronic apparatus, and methods of using same

INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USING THE INTERPOSER SUBSTRATE, MANUFACTURING METHOD OF INTERPOSER SUBSTRATE, AND MANUFACTURING METHOD OF LSI CHIP

High Frequency Wiring Board, Package for Housing Electronic Component, Electronic Device, and Communication Apparatus

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

Integrated package

Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support

Semiconductor die attachment method using non-conductive screen print and dispense adhesive

Optical module and method for manufacturing same

Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module

Phosphor activated with europium, light emitting device using the same and method of manufacturing the phosphor

Packaged electronic devices having die attach regions with selective thin dielectric layer

Integrated circuit packaging system with interposer interconnections and method of manufacture thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of forming IPD structure using smooth conductive layer and bottom-side conductive layer

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME

Semiconductor package with position member

Semiconductor device and method of manufacturing the same

Power semiconductor device and method for its production

Solid state switch arrangement

Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device

Semiconductor chip package with post electrodes

SEMICONDUCTOR PACKAGE USING CONDUCTIVE PLUG TO REPLACE SOLDER BALL

QUAD FLAT PACKAGE STRUCTURE HAVING EXPOSED HEAT SINK, ELECTRONIC ASSEMBLY AND MANUFACTURING METHODS THEREOF

Method for fabrication of a semiconductor device and structure

Arrangement for energy conditioning

Substrate for electrical device

Semiconductor device with an improved solder joint

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

LID FOR A FUNCTIONAL PART AND A PROCESS FOR ITS MANUFACTURE

Heat sink and assembly or module unit

Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor

Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor

Circuit board having bypass pad

Semiconductor die having a redistribution layer

Stackable Package Having Embedded Interposer and Method for Making the Same

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

COPPER PLATE BONDING FOR HIGH PERFORMANCE SEMICONDUCTOR PACKAGING

Integrated circuit packaging system with leads and transposer and method of manufacture thereof

Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame

Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor

Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package

Die down ball grid array packages and method for making same

Power semiconductor module including substrates spaced from each other

Techniques for packaging multiple device components

Mold lock on heat spreader

High power ceramic on copper package

SEMICONDUCTOR DEVICE

Massively parallel interconnect fabric for complex semiconductor devices

Molded housing used in force fit method

Semiconductor bond pad patterns and method of formation

Methodology for processing a panel during semiconductor device fabrication

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

IC card with terminals for direct access to internal components

Method for manufacturing a rigid power module suited for high-voltage applications

Electronic component for surface mounting

System and method for multi-chip module die extraction and replacement

Substrate for a microelectronic package and method of fabricating thereof

Leadframe

Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference

Method for Mounting Flip Chip and Substrate Used Therein

Method of fabricating stacked semiconductor structure

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

Interposer substrate including capacitor for adjusting phase of signal transmitted in same interposer substrate

INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND SUBSTRATE PROCESSING METHOD

Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof

Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof

SEMICONDUCTOR MODULE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Microelectronic packages and methods therefor

Power semiconductor module comprising a connection device with internal contact spring connection elements

Stacked semiconductor package and method of manufacturing thereof

Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof

Package-on-package interconnect stiffener

Semiconductor die package and method for making the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package to remove power noise using ground impedance

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS

Manufacturing method of bottom substrate of package

Semiconductor optical communication module and manufacturing method thereof

Semiconductor package having underfill agent dispersion

Semiconductor element, method for manufacturing the same, and mounting structure having the semiconductor element mounted thereon

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Method of manufacturing semiconductor device

Stacked memory device including a pre-decoder/pre-driver sandwiched between a plurality of inter-decoders/inter-drivers

Stacked multichip package

Packaged microelectronic devices and associated systems

Through-hole contacts in a semiconductor device

Semiconductor device and method of forming a thin wafer without a carrier

Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof

Integrated circuit packaging system having dual sided connection and method of manufacture thereof

Integrated circuit packaging system with package stacking and method of manufacture thereof

Integrated circuit packaging system with stacked configuration and method of manufacture thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST TYPE INTERCONNECTOR AND METHOD OF MANUFACTURE THEREOF

Semiconductor module and camera module mounting said semiconductor module

Multilayer wiring substrate having a castellation structure

Light-emitting devices

Integrated circuit packaging system with interposer and method of manufacture thereof

Film-like adhesive, adhesive sheet, and semiconductor device using same

Semiconductor package

Power module

Light emitting device, light emitting system comprising the same, and method of fabricating thereof

Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Methods and systems for packaging integrated circuits

SEMICONDUCTOR DEVICE

Stack type semiconductor package apparatus

Semiconductor package

Integrated circuit packaging system with layered packaging and method of manufacture thereof

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die

Semiconductor device and semiconductor package having the same

Making a semiconductor device having conductive through organic vias

SEMICONDUCTOR PACKAGE SUBSTRATE INCLUDING FUSES, SEMICONDUCTOR DEVICE PACKAGE, SEMICONDUCTOR MODULE AND ELECTRONIC APPARATUS INCLUDING THE SAME

Photoelectric Transmitting or Receiving Device and Manufacturing Method Thereof

Semiconductor device and method for manufacturing the same

Multiple layer strain gauge

Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die

Method for manufacturing capacitor embedded in interposer

Microelectronic packages and methods therefor

WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE WIRING BOARD COMPOSITE BODY AND THE SEMICONDUCTOR DEVICE

Thee-dimensional integrated semiconductor device and method for manufacturing same

INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND PACKAGING METHOD THEREOF

Flexible packaging for chip-on-chip and package-on-package technologies

Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Multi-die semiconductor package with heat spreader

Semiconductor device

Semiconductor device including spacer element

Integrated circuit package-in-package system and method for making thereof

Semiconductor Packaging with Integrated Passive Componentry

WIRING MEMBER, METAL COMPONENT WITH RESIN AND RESIN SEALED SEMICONDUCTOR DEVICE, AND PROCESSES FOR PRODUCING THEM

BONDING METHOD AND BONDING DEVICE

Method for manufacturing integrated circuit device having antenna conductors

Method of fabricating a semiconductor package with mold lock opening

Light emitting diode package and manufacturing method thereof

Semiconductor device

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE USING THE SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE

Routable array metal integrated circuit package

Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof

RF-IC PACKAGING METHOD AND CIRCUITS OBTAINED THEREBY

Semiconductor device having a junction FET and a MISFET for control

Wireless communication device integrated into a single package

Reversible leadless package and methods of making and using same

Component-containing module

Semiconductor device

Lead frame

Lead frame

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Light receiving or light emitting semiconductor module

Electronic device and lead frame

Semiconductor device and method of forming through vias with reflowed conductive material

Integrated circuit package having integrated faraday shield

Chip and Transmitter for Wireless Communication System

Moisture-proof device, moisture-proof IC, and method for increasing moisture-proof capability of IC

Semiconductor device and method of forming through vias with reflowed conductive material

Semiconductor device having wiring layers with power-supply plane and ground plane

Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure

Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers

Circuit carrier and semiconductor package using the same

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device with stacked semiconductor chips

Ultra wideband hermetically sealed surface mount technology for microwave monolithic integrated circuit package

Optical semiconductor device encapsulated with silicone resin

Lead frame assembly, package structure and LED package structure

Fully reflective and highly thermoconductive electronic module and method of manufacturing the same

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

Semiconductor device with additional power supply paths

Semiconductor package with ribbon with metal layers

Micro Ball Feeding Method

Semiconductor device

Package-on-package system with through vias and method of manufacture thereof

Chip package and manufacturing method thereof

Electronic component device, and method of manufacturing the same

PACKAGE SUBSTRATE STRUCUTRE WITH CAVITY AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Method for fabricating semiconductor packages with discrete components

Method of fabricating light emitting device

Thermoplastic material

Carrier assembly for an integrated circuit

III-nitride devices and circuits

Electronic component

Layered chip package with wiring on the side surfaces

Semiconductor assembly with one metal layer after base metal removal

Integrated circuit package system including shield

Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

Implantable microelectronic device and method of manufacture

ELECTRICAL DEVICE HAVING A POWER SOURCE WITH A MAGNETIC CAPACITOR AS AN ENERGY STORAGE DEVICE

Semiconductor Device and a Method of Manufacturing the Same

Thermally enhanced semiconductor package

Package-on-package using through-hole via die on saw streets

MULTI-CHIP SEMICONDUCTOR DEVICES HAVING CONDUCTIVE VIAS AND METHODS OF FORMING THE SAME

LEADFRAME FOR SEMICONDUCTOR PACKAGES

Semiconductor chip package

Integrated Circuit Package for Magnetic Capacitor

Light emitting device

Light Emitting Diode Unit, Display Apparatus Having the Same and Manufacturing Method of the Same

Simple radio frequency integrated circuit (RFIC) packages with integrated antennas

Electronic packages with fine particle wetting and non-wetting zones

Method of manufacturing semiconductor device

Chip package without core and stacked chip package structure

CHIP PACKAGE WITHOUT CORE AND STACKED CHIP PACKAGE STRUCTURE

Semiconductor device