RESIN COMPOSITION AND LIGHTING FIXTURE COMPONENT MADE OF THE SAME

THREE DIMENSIONAL LIGHT EMITTING DIODE SYSTEMS, AND COMPOSITIONS AND METHODS RELATING THERETO

HEAT CONDUCTIVE COMPOSITE SUBSTRATE HAVING HEAT DISSIPATION PROPERTIES AND MANUFACTURING METHOD THEREOF

Power surface mount light emitting die package

Three dimensional light emitting diode systems, and compositions and methods relating thereto

LED mounting substrate

DOPED DIAMOND LED DEVICES AND ASSOCIATED METHODS

CHIP LED

Package Substrate and Method for Forming the Same

METAL SUBSTRATE FOR LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE

Silicon-based cooling package for light-emitting devices

LED array formed by interconnected and surrounded LED chips

LED ARRAY FORMED BY INTERCONNECTED AND SURROUNDED LED CHIPS

Solid state lighting component package with reflective layer

DIAMOND SEMICONDUCTOR DEVICES AND ASSOCIATED METHODS

LIGHT EMITTING DIODE DEVICE AND MANUFACTURING METHOD THEREOF

Package carrier and manufacturing method thereof

PACKAGE CARRIER

Die structure, manufacturing method and substrate thereof

Wafer for LED mounting, method for manufacturing same, and LED-mounted structure using the wafer

Light emitting chip and method for manufacturing the same

Ceramic illumination device

Electronic device submounts including substrates with thermally conductive vias

LED PACKAGE AND CHIP CARRIER THEREOF

DIE-BONDING MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICES AND OPTICAL SEMICONDUCTOR DEVICE USING SAME

LED chip

Method for manufacturing heat dissipation bulk of semiconductor device

Light emitting package

LIGHT EMITTING CHIP AND METHOD FOR MANUFACTURING THE SAME

Light emitting chip and method for manufacturing the same

High power ultraviolet light emitting diode with superlattice

Semiconductor light emitting device having an optical plate including a meniscus control structure and method of manufacturing

Metal substrate and light source device

LIGHT-EMITTING DIODE DEVICE

Light emitting diode and method of fabricating the same

Light-emitting diode lamp with low thermal resistance

Light emitting device and light unit using the same

LED device with improved thermal performance

Optoelectronic component, and method for the production of an optoelectronic component

MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES

LED chip assembly, LED package, and manufacturing method of LED package

LED PACKAGE

LED PACKAGE WITH STEPPED APERTURE

Bonding material, method, and structure

Light emitting apparatus and production method thereof

LIGHT-EMITTING MODULE AND ALTERNATING CURRENT LIGHT-EMITTING DEVICE

Metal laminated structure and method for producing the metal laminated structure

LIGHT EMITTING DEVICE AND ILLUMINATION DEVICE

POLYCRYSTALLINE METAL-BASED LED HEAT DISSIPATING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

LED light source with thermally conductive luminescent matrix

Light-Emitting Diode Package Assembly

LED PACKAGE STRUCTURE

Radiating substrate and method for manufacturing the radiating substrate, and luminous element package with the radiating substrate

Close-packed array of light emitting devices

LIGHT-EMITTING DIODE PACKAGE

Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material

Diamond insulated circuits and associated methods

Thermal management system for multiple heat source devices

Light emitting diode assembly and thermal control blanket and methods relating thereto

Structure of light-emitting diode (LED)

LED MODULE

Integrated Heat Conductive Light Emitting Diode (LED) White Light Source Module

Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate

Substrate Structure of LED (light emitting diode) Packaging and Method of the same

Vertical light emitting diodes (LED) having metal substrate and spin coated phosphor layer for producing white light

LED assembly and manufacturing method thereof

SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE

Vertical light emitting diode (VLED) die having electrode frame and method of fabrication

Substrate for mounting light-emitting element, production process thereof and light-emitting device

LIGHT EMITTING DIODE DEVICES AND MANUFACTURING METHOD THEREOF

Leadframe-based packages for solid state light emitting devices having heat dissipating regions in packaging

Light emitting device module and lighting system including the same

Light emitting module

Light emitting diode having a thermal conductive substrate and method of fabricating the same

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME

Composite substrate for LED light emitting element, method of production of same, and LED light emitting element

Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member

HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Side by side light emitting diode (LED) having separate electrical and heat transfer paths

Light emitting diode package having anodized insulation layer and fabrication method therefor

METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE

Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus

Vertical light-emitting diode

LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE LAMP, METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE

Light emitting device having plurality of light emitting cells and method of fabricating the same

Light-emitting diode chip package body and method for manufacturing same

Light emitting device and lighting apparatus

LIGHT EMITTING DIODE PACKAGE

Light Emitting Devices Using Connection Structures And Methods Of Manufacturing The Same

METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE

LIGHT-EMITTING DIODE (LED) STRUCTURE HAVING A WAVELENGTH-CONVERTING LAYER AND METHOD OF PRODUCING

SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE

Package for light emitting device

Package for light emitting device

THERMAL CONDUCTIVE SHEET, LIGHT-EMITTING DIODE MOUNTING SUBSTRATE, AND THERMAL CONDUCTIVE ADHESIVE SHEET

Solid state light emitting diode packages with leadframes and ceramic material

Light-emitting device, light-emitting module, and method for manufacturing light-emitting device

Semiconductor package and method of manufacturing the same

Heat dissipation by through silicon plugs

Semiconductor package with through silicon vias

SUBSTRATE FOR LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE

HIGH-POWER LED PACKAGE

Light-emitting device having a trench in a semiconductor layer

Light emitting diodes with enhanced thermal sinking and associated methods of operation

Light emitting diode wafer-level package with self-aligning features

Light emitting device package and light unit having the same

TRANSMISSIVE OPTICAL ELEMENTS INCLUDING PHOSPHOR PATTERNS THEREIN

Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

High thermal performance packaging for optoelectronics devices

High-reflection submount for light-emitting diode package and fabrication method thereof

Power surface mount light emitting die package

Power surface mount light emitting die package

Power surface mount light emitting die package

HEAT-DISSIPATING DEVICE HAVING A LAYERED FUNCTIONAL UNIT

LIGHT EMITTING DIODE AND LIGHT SOURCE MODULE HAVING SAME

Light emitting device and method of manufacturing the same

Light emitting device, light emitting device package, and lighting system

Light emitting device package and light unit having the same

PACKAGE STRUCTURE OF PHOTOELECTRONIC DEVICE AND FABRICATING METHOD THEREOF

Package of light emitting diode and method for manufacturing the same

Package of light emitting diode and method for manufacturing the same

HEAT/ELECTRICITY DISCRETE METAL CORE-CHIP ON BOARD MODULE

Semiconductor package

LED module

Manufacturing method for composite substrate

LED packaging method

Light source for lighting

Package for light emitting device

Method of forming vertical structure light emitting diode with heat exhaustion structure

LED DEVICE AND METHOD OF MANUFACTURING THE SAME

Substrate structrue for light-emitting diode

Semiconductor light emitting device

SUPPORTING SUBSTRATE FOR PREPARING SEMICONDUCTOR LIGHT-EMITTING DEVICE AND SEMICONDUCTOR LIGHT-EMITTING DEVICE USING SUPPORTING SUBSTRATES

Light output device

Systems and methods for managing heat from an LED

Power surface mount light emitting die package

Light emitting device package

Wavelength converted semiconductor light emitting device

LED chip

Mounting structure, and method of manufacturing mounting structure

METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE

HIGH THERMAL CONDUCTIVITY SUBSTRATE FOR A SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE

LED PACKAGE AND METHOD FOR FABRICATING THE SAME

Silicone based reflective underfill and thermal coupler

Housing for high-power LEDs

Ultra high thermal performance packaging for optoelectronics devices

Heat radiating structure and method for manufacturing the same

SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME

Method for fabricating a light emitting diode package structure

Light-emitting apparatus and luminaire

Light emitting diode assembly

HIGH BRIGHTNESS LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF

Diamond semiconductor devices and associated methods

Method forming a semiconductor light emitting device with perforations formed within

LED package structure for increasing heat-dissipating and light-emitting efficiency and method for manufacturing the same

Electronic device submounts with thermally conductive vias and light emitting devices including the same

Light-emitting diode lamp with low thermal resistance

PRESS-FORGED LED METAL HOUSING AND LED METAL PACKAGE USING THE SAME

Light emitting device and method for manufacturing the same

Semiconductor Substrates, Devices and Associated Methods

OPTICAL ELEMENT PACKAGE, SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND LIGHTING DEVICE

Light emitting diode package

Light emitting module with optically-transparent thermally-conductive element

Thin flat solid state light source module

LED light source, its manufacturing method, and LED-based photolithography apparatus and method

Semiconductor substrate having a flexible, heat resistant, graphite substrate

Light emitting package having screen layer

Heat releasing semiconductor package, method for manufacturing the same, and display apparatus including the same

Optoelectronic component

Carrier Structure for Electronic Components and Fabrication Method of the same

Metallic laminate and manufacturing method of light emitting diode package using the same

Power surface mount light emitting die package

Light Emitting Diode Package Structure

Light emitting diode and method of fabricating the same

Doped diamond LED devices and associated methods

AC LED package structure

Light emitting device and method of manufacturing the same

Light emitting diode and method of fabrication thereof

Light Emitting Device and Fabrication Thereof

COOLING BLOCK ASSEMBLY AND LED INCLUDING THE COOLING BLOCK

LED package with increased feature sizes

Light-emitting element mounting substrate, light-emitting element package, display device, and illumination device

Photoelectronic element and the manufacturing method thereof

Dissipation module for a light emitting device and light emitting diode device having the same

Diamond LED devices and associated methods

Arrangement comprising an optoelectronic component

Semiconductor light-emitting device

Light emitting device package

Semiconductor light emitting device and light emitting device package including the same

Electrically isolated vertical light emitting diode structure

LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THEREOF

Light emitting device

Semiconductor device and production method therefor

PACKAGE FOR ELECTRON ELEMENT AND ELECTRONIC COMPONENT

LED LIGHTING DEVICE

HEAT RADIATING MEMBER, CIRCUIT BOARD USING THE HEAT RADIATING MEMBER, ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE ELECTRONIC COMPONENT MODULE

LED lighting fixture

Chip package structure and method of fabricating the same

Solid metal block semiconductor light emitting device mounting substrates

Thermal diffusion sheet and method for mounting the same

Ceramic package for headlamp and headlamp modul having the same

Method for production of a plurality of semiconductor chips, and a semiconductor component

OPTOELECTRONIC DEVICE STRUCTURE

Varistor

LIGHT-EMITTING MODULE AND ILLUMINATION DEVICE

Lighting device which includes one or more solid state light emitting device

LIGHT EMITTING DIODE PACKAGE

LATERAL GRAPHENE HEAT SPREADERS FOR ELECTRONIC AND OPTOELECTRONIC DEVICES AND CIRCUITS

Flexible Thin-Type Light-Emitting-Diode Circuit Substrate and a Light-Emitting-Diode Lamp Strip

Package substrate and light emitting device using the same

HEAT-DISSIPATING RESIN COMPOSITION, SUBSTRATE FOR LED MOUNTING, REFLECTOR, AND SUBSTRATE FOR LED MOUNTING HAVING REFLECTOR PORTION

LED LIGHTING ASSEMBLY

Light-emitting module

Thermal conduction principle and device for intercrossed structure having different thermal characteristics

Semiconductor light emitting device

Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device

Method for manufacturing of light emitting device using GaN series III-V group nitride semiconductor material

Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus

Semiconductor device package including a paste member

LIGHT-EMITTING DEVICE MODULE WITH A SUBSTRATE AND METHODS OF FORMING IT

LED lamp module and fabrication method thereof

Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus

LIGHT EMITTING DIODE SYSTEM

Semiconductor light emitting device

LIGHT EMITTING DIODE DEVICE

Light emitting apparatus and semiconductor apparatus, and method for manufacturing the same

Light-emitting diode chip package body and method for manufacturing same

Optoelectronic semiconductor chip and method for producing it

Light emitting diode package assembly

OPTO-ELECTRONIC PACKAGE STRUCTURE HAVING SILICON-SUBSTRATE AND METHOD OF FORMING THE SAME

Structure of LED of high heat-conducting efficiency

Light emitting diode package structure and method for fabricating the same

Sub-mount, light emitting diode package and manufacturing method thereof

Alumina substrate and method of making an alumina substrate

Melting temperature adjustable metal thermal interface materials and packaged semiconductors including thereof

Light emitting diode package structure and method for fabricating the same

Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof

Semiconductor light-emitting device, light-emitting module and lighting unit

Submount for optical device and its manufacturing method

Methods of selecting one or more phase change materials to match a working temperature of a light-emitting diode to be cooled

Semiconductor die with reduced thermal boundary resistance

Heat transfer film, semiconductor device, and electronic apparatus

LED heat-radiating substrate and method for making the same

Light emitting device

Semiconductor light-emitting device, illuminator and method of manufacturing semiconductor light-emitting device

Light-emitting element mounting substrate, light source, lighting device, display device, traffic signal, and method of manufacturing light-emitting element mounting substrate

HIGH POWER LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF

Light emitting diode having a thermal conductive substrate and method of fabricating the same

Porcelain enamel substrate for mounting light emitting device and method of manufacturing the same, light emitting device module, illumination device, display unit and traffic signal

Nitride semiconductor light emitting device and method of manufacturing the same

Multilayer board and light-emitting module having the same

Light emitting diode package and fabrication method thereof

Solid metal block semiconductor light emitting device mounting substrates and packages

SOLID-STATE LIGHTING ELEMENT

Illumination device comprising a substrate plate and a heat sink

PACKAGE, SUBASSEMBLY AND METHODS OF MANUFACTURING THEREOF

LED chip thermal management and fabrication methods

Heat sink having enhanced heat dissipation capacity

Thermal module

High power LED module

Packaging carrier with high heat dissipation and method for manufacturing the same

Package structure of photoelectronic device and fabricating method thereof

Vertical topology light emitting device using a conductive support structure

LED package and fabricating method thereof

SEMICONDUCTOR LIGHT-EMITTING DEVICE HAVING A CURRENT-BLOCKING LAYER FORMED BETWEEN A SEMICONDUCTOR MULTILAYER FILM AND A METAL FILM AND LOCATED AT THE PERIPHERY. , METHOD FOR FABRICATING THE SAME AND METHOD FOR BONDING THE SAME

LED device and back panel of liquid crystal display

LIGHT EMITTING DIODE PACKAGE STRUCTURE

Heat radiation package and semiconductor device

Light emitting diode structure

Package structure for solid-state lighting devices and method of fabricating the same

Nitride based compound semiconductor light emitting device and method of manufacturing the same

Light emitting diode device

Package of light emitting diode and method for manufacturing the same

Manufacturing method of light emitting diode apparatus

LIGHT-EMITTING DIODE PACKAGE STRUCTURE

Light emitting diode devices and manufacturing method thereof

Solid state lighting device with heat-dissipating capability

LED packaging structure with aluminum board and an LED lamp with said LED packaging structure

LED packaging structure with aluminum board and an LED lamp with said LED packaging structure

SEMICONDUCTOR LIGHT EMITTING DEVICE, PROCESS FOR PRODUCING THE SAME, AND LED ILLUMINATING APPARATUS USING THE SAME

Semiconductor element and method of making the same

Doped diamond LED devices and associated methods

Light-emitting diode

High thermal conductivity substrate for a semiconductor device

SUBSTRATE FOR OPTICAL SEMICONDUCTOR

LED package with stepped aperture

Package assembly with heat dissipating structure

Light Emitting Diode Assembly

Package for light emitting device with metal base to conduct heat

Light emitting diode package

LED device and method by which it is produced

Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device

LED module

InGaAIN light-emitting device containing carbon-based substrate and method for making the same

PACKAGING METHOD TO MANUFACTURE PACKAGE FOR A HIGH-POWER LIGHT EMITTING DIODE

LED illumination system

PACKAGE STRUCTURE FOR LIGHT-EMITTING ELEMENTS

PACKAGE FOR A HIGH-POWER LIGHT EMITTING DIODE

Packaging method of LED of high heat-conducting efficiency and structure thereof