Semiconductor device, LED head and image forming apparatus

Embedded metal heat sink for semiconductor

Electronic component assembly with composite material carrier

LED chip packaging structure

Light emitting device and method for manufacturing the same

Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device

Semiconductor light-emitting device with metal support substrate

Fabrication of semiconductor devices for light emission

High-power light-emitting diode

Light emitting diode structure and manufacturing method thereof

Cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device

LED package, method of fabricating the same, and backlight unit having the same

Light emitting semi-conductor diode (with high light output)

CERAMIC LED PACKAGE

Optoelectronic device package and packaging method thereof

Luminescent ceramic for a light emitting device

Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices

Substrate for mounting light-emitting element and light-emitting element module

Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment

Melting temperature adjustable metal thermal interface materials and application thereof

Semiconductor device

Method for producing Group III-Group V vertical light-emitting diodes

Light emitting diode and wafer level package method, wafer level bonding method thereof, and circuit structure for wafer level package

Semiconductor-on-diamond devices and associated methods

LED PACKAGE AND MANUFACTURING METHOD THEREOF

Light emitting diode package structure

Porcelain enamel substrate for mounting light emitting device and method of manufacturing the same, light emitting device module, illumination device, display unit and traffic signal

Semiconductor device

Light emitting device

Method of fabricating vertical devices using a metal support film

LED module

LIGHT EMITTING DEVICE WITH HIGH HEAT-DISSIPATING CAPABILITY

Semiconductor light emitting device

Light Emitting Diode and Method of Making the Same

LED devices and associated methods

Electro-optical apparatus, manufacturing method thereof, and electronic instrument

Light emitting diode package and fabrication method thereof

LED light engine

SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME

SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME

SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME

SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME

Leadframe-based packages for solid state light emitting devices

High power solid-state lamp

Method for manufacturing heat sink of semiconductor device

Embedded metal heat sink for semiconductor device and method for manufacturing the same

Light emitting device having a metal can package for improved heat dissipation

Light emitting diode module

LIGHT EMITTING DIODE AND METHOD FOR IMPROVING LUMINESCENCE EFFICIENCY OF LIGHT EMITTING DIODE

Package for storing light emitting element and method for producing package for storing light emitting element

VERTICAL LED WITH EUTECTIC LAYER

Ceramic substrate for mounting a light emitting element and method for manufacturing the same

Light emitting device, lighting equipment or liquid crystal display device using such light emitting device

CHIP SEAT STRUCTUER FOR LIGHT-EMITTING CRYSTAL AND A PACKAGING STRUCTURE THEREOF

Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof

Light-emitting diode lamp with low thermal resistance

Light emitting diode package having anodized insulation layer and fabrication method therefor

Systems and methods for producing white-light light emitting diodes

Spread illuminating apparatus

Light emitting diode package, circuit board for light emitting diode package and method of manufacturing the same

LED ASSEMBLY AND MANUFACTURING METHOD

Light emitting device

Power surface mount light emitting die package

Light emitting device package and method of manufacturing the same

Power surface mount light emitting die package

Light emitting module and process thereof

Light emitting diode

Light emitting device and method for producing the same

Light emitting diode package

Power surface mount light emitting die package

Thermal conductive apparatus

Semiconductor device integrated with heat sink and method of fabricating the same

Light-emitting device and process for manufacturing the same

Light emitting diode unit

Semiconductor device package

Package structure for solid-state lighting devices and method of fabricating the same

Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module

LED with light transmissive heat sink

Microelectronic interconnect substrate and packaging techniques

Power package and fabrication method thereof

Radiation-emitting component provided with metallic injected-molded carrier

Light emitting device

Gallium nitride based semiconductor light emitting diode and method of manufacturing the same

Light emitting diode for emitting white light

THERMALLY CONDUCTIVE THERMOPLASTICS FOR DIE-LEVEL PACKAGING OF MICROELECTRONICS

Light emitting diode packaging structure

Methods and devices for cooling printed circuit boards

Led lighting source and led lighting apparatus

LED package and fabricating method thereof

Light emitting diodes with improved light collimation

Method of fabricating vertical devices using a metal support film

Light emitting diode package and method for making same

Method for manufacturing a light emitting device and a light emitting device manufactured therefrom

Light emitting diode package in backlight unit for liquid crystal display device

LIGHT EMITTING DIODE AND METHOD FOR IMPROVING LUMINESCENCE EFFICIENCY THEREOF

Coating process for a light-emitting diode (LED)

Light emitting diode with thermal spreading layer

Heat spreader for use with light emitting diode

Packaging base for semiconductor elements

Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels

Substrate for optical semiconductor

Vertical structure semiconductor light emitting device and method for manufacturing the same

High power light emitting diode package and fabrication method thereof

Array-type modularized light-emitting diode structure and a method for packaging the structure

Light-emitting diode and manufacturing method thereof

High heat dissipating LED having a porous material layer

High-efficiency light extraction structures and methods for solid-state lighting

Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same

Light emitting diode package and fabrication method thereof

Method for fabricating light-emitting device utilizing substrate transfer by laser decomposition

Semi-conductor die mount assembly

Light emitting diode package and fabrication method thereof

Method of making optical light engines with elevated LEDs and resulting product

Systems and methods for producing white-light emitting diodes

Systems and methods for removing operating heat from a light emitting diode

Light emitting diode with thermo-electric cooler

Solder for device package

Flip-chip bonding structure of light-emitting element using metal column

Light emitting diode package and process of making the same

Heat dissipating assembly for a heat element

Semiconductor device

Wide bandgap semiconductor layers on SOD structures

Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same

Vertical topology light emitting device

Method of fabricating vertical devices using a metal support film

LED package with structure and materials for high heat dissipation

LED module and method of packaging the same

Isotopically pure silicon-on-insulator wafers and methods of making same

Semiconductor light-emitting element assembly with a composite substrate

Semiconductor substrate structure

Semiconductor light emitting device and fabrication method of the same

Submount for light emitting diode and its manufacturing method

Surface mount LED

High heat dissipation LED device and its manufacturing method

Vertical nitride semiconductor light emitting diode

Metal base wiring board for retaining light emitting elements, light emitting source, lightning apparatus, and display apparatus

Semiconductor light-emitting device and method of manufacturing the same

Surface mountable light emitting diode assemblies packaged for high temperature operation

LED illumination system

Light emitting diode and method of making the same

Low thermal resistance light emitting diode

Luminescent ceramic for a light emitting device

LED heat-radiating substrate and method for making the same

Package array and package unit of flip chip LED

Light emitting diode

Light emitting apparatus

Light emitting diode having conductive substrate and transparent emitting surface

Opto-electronic assembly having an encapsulant with at least two different functional zones

Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips

Electro-optical apparatus, manufacturing method thereof, and electronic instrument

Lightemitting device and method of manufacturing the same

Semiconductor light emitting device and manufacturing method for the same

System and method for enhanced LED thermal conductivity

Methods of processing of gallium nitride

Light emitting diode and method of making the same

Light-emitting device having a compound substrate

Light emitting diode package structure

Light emitting device, method of manufacturing the same and lighting equipment

LED packaging structure

Display panel, display device and repair method thereof

High temperature optoelectronic devices for power electronics

High-power remote phosphor white LED heat-dissipation package

Manufacturing method of carbon nanotube composite for heat dissipation and LED light therewith

LED circuit structure

Flexible LED device and flexible LED panel

Method and apparatus to facilitate direct surface cooling of a chip within a 3D stack of chips using optical interconnect

Light emitting light string with enhanced heat dissipating efficiency

Light-emitting devices with integrated diamond

LED chip packaging with high performance thermal dissipation

High powered light emitter packages with compact optics