LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DESIGN

PACKAGE, METHOD FOR FORMING A PACKAGE, CHIP CARD, AND METHOD FOR FORMING A CHIP CARD

DISPLAY MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

Semiconductor package with stress reduction design and method for forming the same

Device comprising a chip package and an overlap-free coil layout

Connection arrangement, component carrier and method of forming a component carrier structure

Removing unwanted flux from an integrated circuit package

Computer modules with small thicknesses and associated methods of manufacturing

Removing unwanted flux from an integrated circuit package

Component carrier and manufacturing method

Printed-circuit board, printed-wiring board, and electronic apparatus

Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device

Computer modules with small thicknesses and associated methods of manufacturing

Solder void reduction between electronic packages and printed circuit boards

Circuit board and circuit board assembly

Semiconductor package modules, memory cards including the same, and electronic systems including the same

Film material, electronic component using film material, and method for producing electronic component

CIRCUIT BOARD ASSEMBLY

Leadless chip carrier

Methods for performing extended wafer-level packaging (eWLP) and eWLP devices made by the methods

Mounting member, electronic component, and method for manufacturing module

Computer modules with small thicknesses and associated methods of manufacturing

Solder void reduction between electronic packages and printed circuit boards

Printed circuit board structure with heat dissipation function

Wiring substrate, electronic device, and electronic module

Method for assembling computer modules small in thickness

Electronic components on trenched substrates and method of forming same

Method and apparatus for attachment of integrated circuits

Electrical interconnects in an electronic contact lens

Wireless IC device and component for wireless IC device

Wireless IC device and component for wireless IC device

Manufacturing electronic device having contact elements with a specified cross section

Miniature Microwave Component for Surface-Mounting

METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRING BOARD FOR PROVIDING AN ELECTRONIC COMPONENT THEREIN

Electronic component

SEMICONDUCTOR PACKAGE AND IMPLEMENTATION STRUCTURE OF SEMICONDUCTOR PACKAGE

Arrangement of optoelectronic components

Electrical connection interfaces and methods for adjacently positioned circuit components

THIN WAFER DETECTORS WITH IMPROVED RADIATION DAMAGE AND CROSSTALK CHARACTERISTICS

IMAGE SENSOR MODULE FOR CAMERA DEVICE

Electronic component package, base of electronic component package, and junction structure of electronic component package and circuit substrate

PCB and camera module having the same

Semiconductor package

Wireless IC device

PRINTED CIRCUIT BOARD

Semiconductor device

Electronic components on trenched substrates and method of forming same

Surface mounting chip carrier module

SUSPENSION DESIGN FOR HIGH SHOCK PERFORMANCE SOLDERING BALL BONDING

Wiring substrate with a wire terminal

Semiconductor device

Computer modules with small thicknesses and associated methods of manufacturing

Wireless IC device and component for wireless IC device

Grid array packages

Stackable semiconductor device assemblies

Grid array packages and assemblies including the same

Semiconductor Package Leads Having Grooved Contact Areas

Interconnect System without Through-Holes

Suspension board with circuit

Suspension board with circuit

Suspension board with circuit having a light emitting device exposed from a surface thereof opposite to that on which a slider is mounted

Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly

Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device

Structure comprising opto-electric hybrid board and opto-electric package

Method and device for contacting, positioning and impinging a solder ball formation with laser energy

HEAT DISSIPATION MODULE FOR LIGHT EMITTING DIODE

Electronic device having contact elements with a specified cross section and manufacturing thereof

Surface mount device

Wireless IC device and component for wireless IC device

Chip having side protection terminal and package using the chip

Integrated circuit package module and method of the same

Wireless IC device

Mounting structure and method for mounting electronic component onto circuit board

Substrate for mounting electronic component and electronic apparatus including the substrate

IC chip mounting package provided with IC chip located in device hole formed within a package base member

Microwave Chip Supporting Structure

ELECTRONIC COMPONENT MODULE

Method for manufacturing multilayer printed wiring board

Method for manufacturing a multilayer printed wiring board for providing an electronic component therein

ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING

OC2 oriented connections 2

HEAD ASSEMBLY

Electrical connection interfaces and methods for adjacently positioned circuit components

Electrical module with specified ground-side connection of filter circuit shunt arms

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Microwave chip supporting structure

Manufacturing method for a dual interface card

SURFACE MOUNTED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Wireless IC device and component for wireless IC device

Imaging device

Semiconductor package

Suspension board with circuit

PRINTED WIRING BOARD AND ELECTRONIC APPARATUS

HGA suspension pad barrier for elimination of solder bridging defect

Method for manufacturing printed wiring board

Electronic components on trenched substrates and method of forming same

High density in-package microelectronic amplifier

PCB with soldering pad projections forming fillet solder joints and method of production thereof

METHOD FOR MOUNTING ELECTRONIC PARTS

Semiconductor device with side terminals

Image sensor module for camera device

Thermally insulating bonding pad structure for solder reflow connection

Lead frame package apparatus and method

Multilayer Wiring Board, and Electronic Module and Electronic Device Including the Multilayer Wiring Board

Approaches for manufacturing a head gimbal assembly

Method and Apparatus for Manufacturing Solder Mounting Structure

Semiconductor package and method for fabricating the same

Composite ceramic substrate

Quad flat no-lead chip carrier with standoff

Method and apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head

Semiconductor device and method of manufacturing semiconductor device

Photoelectric conversion module for direct optical interconnection and method of manufacturing the same

Soldering method and apparatus

Electronic components on trenched substrates and method of forming same

Electronic device and electronic component mounting method

Electronic components on trenched substrates and method of forming same

Interconnect for an electrical circuit substrate

Electronic components on trenched substrates and method of forming same

ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING SAME

QUAD FLAT NO-LEAD CHIP CARRIER WITH STAND-OFF

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME

LED package, method of fabricating the same, and backlight unit having the same

METHOD FOR DESIGNING A LEADLESS CHIP CARRIER

Microwave surface mount hermetically sealed package and method of forming the same

SOLDERING NOZZLE AND APPARATUS USING THE SAME

Printed circuit board and light sensing device using the same

Electronic component device and method of mounting electronic component

Thin wafer detectors with improved radiation damage and crosstalk characteristics

PRINTED CIRCUIT BOARD ASSEMBLY AND DISPLAY HAVING THE SAME

Package structure of memory card and manufacturing method thereof

Optical module producing method and apparatus

Optical module

Carriage assembly of a hard disk drive

ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING

Surface mounted electronic component

Circuit module with interposer and method for manufacturing the same

Wireless IC device and component for wireless IC device

Passive component and electronic component module

Surface mount attachment of components

Integrated circuit component with a surface-mount housing

Methods for providing and using grid array packages

STACKED BALL GRID ARRAY SEMICONDUCTOR PACKAGE

Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the same

Method of reworking magnetic head assembly in which electrode pad of magnetic head slider and electrode pad of suspension are soldered to each other

Quad flat no-lead chip carrier with stand-off

INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS

ELECTRONIC DEVICE MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

QFN housing having optimized connecting surface geometry

Application of electronic components in printed products

Electronic component, production method of electronic component, mounted structure of electronic component, and evaluation method of electronic component

Mounting structure for electronic component

Method of Packaging Electronic Component

Electrical transition for an RF component

Laminated ceramic capacitor

Electronic device having a groove partitioning functional and mounting parts from each other

Electronic device

Circuit board apparatus, circuit component reinforcing method and electronic device

Electronic component module

Semiconductor device

Low profile compliant leads

Low temperature co-fired ceramic module and method of manufacturing the same

BOARD-TO-BOARD CONNECTING STRUCTURE

Wireless IC device and component for wireless IC device

Interconnected IC packages with vertical SMT pads

Circuit board and electronic assembly

Wiring board and wiring board module

Electronic carrier board and package structure thereof

Method of forming a composite standoff on a circuit board

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Padless substrate for surface mounted components

SOLDERING METHOD AND APPARATUS

Magnetic head assembly bonding electrode pad of slider and electrode pad of flexible wiring substrate together by solder

MAGNETIC HEAD ASSEMBLY HAVING AuSn DISPERSION LAYER AND METHOD OF SOLDER BONDING

Soldering device and method for forming electrical solder connections in a disk drive unit

Three-dimensional printed circuit board

Printed circuit board

Head gimbal assembly, slider, and method of manufactuing a head gimbal assembly with reduced lead length

RFID inlays and methods of their manufacture

High frequency electronic component

Method of bonding metal ball for magnetic head assembly

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Method for production of a card with a double interface and microcircuit card obtained thus

Method and apparatus for soldering modules to substrates

Head gimbal assembly and magnetic disk drive with specific solder ball or slider pad and electrode stud dimensioning to produce reliable solder ball connection using laser energy

Apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head

Method for mounting an electronic component on a substrate

Soldering method, soldering device, bonding method, bonding device, and nozzle unit

Flip-chip adaptor package for bare die

Semiconductor device package

Apparatus including a dielectric mirror and method of reflecting radiation away from a portion of an apparatus

Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder mass

Land grid array package

MOUNTING STRUCTURE AND METHOD OF SURFACE-MOUNT CRYSTAL OSCILLATOR

Soldering method and apparatus

Electronic circuit board

Printed circuit board having reduced mounting height

Semiconductor package device having reduced mounting height and method for manufacturing the same

Head gimbal assembly provided with solder ball connecting structure allowing re-utilization of suspension

Cornerbond assembly comprising three-dimensional electronic modules

connection arrangement for micro lead frame plastic packages

Arrangement for contacting an integrated circuit in a package

Soldering method and apparatus

Method and apparatus for electrically coupling a slider to a wireless suspension substrate

Head gimbal assembly with flying height controller, disk drive unit using the same, and flying height adjusting method and system thereof

Surface-mounted microwave package and corresponding mounting with a multilayer circuit

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Smartcard and method for production of a smartcard

Microelectronic packages including solder bumps and AC-coupled interconnect elements

High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus

Method of removing lead-free solder from slider pad and magnetic disk drive

Terminal structure of multi-layer substrate and method for forming the same

Angular rate sensor having circuit board and package

Electrically anisotropically conductive hotmelt adhesive for implanting electrical modules in a card body

System and method for improving suspension-to-slider attachment in a hard disk drive

Surface mount attachment of components

Wireless substrate-like sensor

Wireless substrate-like sensor

Wireless substrate-like sensor

Rotating disk storage device and integrated wire head suspension assembly

Head/slider supporting structure having lead wire inclined relative to slider pad

Interconnect system without through-holes

Flip-chip adaptor package for bare die

Surface mounting of components

Module for radio-frequency applications

Electronic device and intermediate product of electronic device

System and method for improving solder joint reliability in an integrated circuit package

Method for electrical interconnection of angularly disposed conductive patterns

Stair step printed circuit board structures for high speed signal transmissions

Lens barrel and imaging apparatus

Buried solder bumps for AC-coupled microelectronic interconnects

Component connecting apparatus

Electronic package having controlled height stand-off solder joint