Multilayer ceramic electronic package with modulated mesh topology and alternating rods

Multilayer ceramic electronic package with modulated mesh topology

Electronic component module and manufacturing method thereof

Electronic package and method for manufacturing the same

Flex integrated antenna array

SEMICONDUCTOR MEMORY MODULE AND SEMICONDUCTOR MEMORY MODULE BOARD

Mmwave waveguide to waveguide connectors for automotive applications

Module mount interposer

Method of forming a solder bump structure

Semiconductor package mounted substrate

Methods and apparatus for package with interposers

Inter-board connection structure

Package substrate inductor having thermal interconnect structures

Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material

Circuit carrier board and manufacturing method thereof

Integrating system in package (SiP) with input/output (IO) board for platform miniaturization

Laser assisted solder bonding of direct conversion compound semiconductor detector

Memory system and storage device including printed circuit board where channel groups have both point to point topology and daisy chain topology

Device, system and method to mitigate signal noise in communications with a memory module

Electronic structure comprising a matrix array of electronic devices having improved thermal performances

Integrated circuit package substrate

Semiconductor module

Detection device for mobile phone camera module

PACKAGE STRUCTURE FOR ELECTRONIC ASSEMBLIES

Microelectronic assemblies having substrate-integrated perovskite layers

COMPOSITE STACKED INTERCONNECTS FOR HIGH-SPEED APPLICATIONS AND METHODS OF ASSEMBLING SAME

SOLDER PASTE AND SOLDER JOINT

Antenna structure with integrated coupling element and semiconductor package using the same

Microelectronic assemblies having front end under embedded radio frequency die

Optoelectronic circuit having one or more double-sided substrates

Cooling structure and mounting structure

Microwave antenna apparatus and package

Capacitor loop structure

SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE CONTAINING NON-HOMOGENEOUS DIELECTRIC LAYER

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME

Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate

Electronic package and method for fabricating the same

Circuit module

Scalable phased array package

Scalable phased array package

Warpage control for microelectronics packages

Ring-in-ring configurable-capacitance stiffeners and methods of assembling same

Vertical-side solder method and package for power GaN devices

Activate loading mechanism

Distributed multi-screen array for high density display

Reducing thermal cycling fatigue

SUBSTRATE WITH STRESS RELIEVING FEATURES

Ball grid array and land grid array assemblies fabricated using temporary resist

Electronic circuit unit, imaging unit, and endoscope

Frame embedded components

Ceramic electronic component

Contactors with signal pins, ground pins, and short ground pins

ALTERNATIVE CIRCUIT APPARATUS FOR LONG HOST ROUTING

Thermal conductivity for integrated circuit packaging

Electronic device and method of manufacturing the electronic device

CIRCUIT SYSTEM HAVING COMPACT DECOUPLING STRUCTURE

Electronic device having interference shielding structure

Mainboard assembly including a package overlying a die directly attached to the mainboard

Solder resist layer structures for terminating de-featured components and methods of making the same

Socket connector for an electronic package

Socket connector assembly for an electronic package

Cable socket connector assembly for an electronic

IRREVERSIBLE CIRCUIT ELEMENT, IRREVERSIBLE CIRCUIT DEVICE, AND METHOD FOR MANUFACTURING SAID ELEMENT AND DEVICE

Electronic package and method for fabricating the same

Semiconductor package with terminal pattern for increased channel density

Electronic packages with stacked sitffeners and methods of assembling same

Ring-in-ring configurable-capacitance stiffeners and methods of assembling same

Electronic device packaging

Composite substrate that prevents flexible print circuit board from peeling off from drive interconnect substrate

Shielding in electronic assemblies

PCB Assembly with Molded Matrix Core

Segmented via for vertical PCB interconnect

Semiconductor device

Glue dispensing method and circuit board

Information handling system interposer enabling specialty processor integrated circuit in standard sockets

Systems and methods for replaceable bail grid array (BGA) packages on board substrates

Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows

Wiring board, electronic apparatus, and method for manufacturing electronic apparatus

Methods of fluxless micro-piercing of solder balls, and resulting devices

Printed circuit boards

Surface mount multilayer coupling capacitor and circuit board containing the same

Printed circuit board and semiconductor package structure

Printed circuit board and semiconductor package structure

Printed circuit board and semiconductor package structure

Configuration element for printed circuit board assemblies

Electronic apparatus, and circuit board and control device thereof

Support structure and manufacture method thereof

Integrating system in package (SIP) with input/output (IO) board for platform miniaturization

Electronic assembly that includes a substrate bridge

Substrate apparatus and method of manufacturing the same

Printed circuit board structure including a closed cavity

Electronic component module, DC-DC converter, and electronic device

System-in-Package device ball map and layout optimization

Semiconductor device

Capacitor and board having the same

Dynamic mounting thermal management for devices on board

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

Data processing device

INTEGRATION OF SILICON PHOTONICS IC FOR HIGH DATA RATE

Surface structure method and apparatus associated with compute or electronic component packages

Information handling system interposer enabling specialty processor integrated circuit in standard sockets

Warpage control for microelectronics packages

Stacked module, stacking method, cooling/feeding mechanism, and stacked module mounting board

Printed circuit board with a recess to accommodate discrete components in a package

Semiconductor device

Circuit board and electronic device

Printed circuit board and electronic apparatus

Conductor path structure having a component received in a vibration-damped manner

Solder resist layer structures for terminating de-featured components and methods of making the same

PACKAGED RF CIRCUITS AND RADIO UNIT

Electronic component, electronic equipment, and method for manufacturing electronic component

Printed circuit board and electronic device

Array type discrete decoupling under BGA grid

Methods and apparatus for package with interposers

CONDUCTIVE BALL

Optoelectronic circuit having one or more double-sided substrates

Resin substrate, component mounted resin substrate, and method of manufacturing component mounted resin substrate

Configurable, encapsulated sensor module and method for making same

REDUCING THERMAL CYCLING FATIGUE

Reducing thermal cycling fatigue

Guiding board for a ball placement machine

SEMICONDUCTOR CHIP PACKAGE WITH CAVITY

Configurable semiconductor package

Cross-talk reduction for high speed signaling at ball grid array region and connector region

Printed circuit board and electric device

Composite electronic component and board having the same

Universal test mechanism for semiconductor device

Optical module and method of manufacturing optical module

Joining part and board unit

Three dimensional integrated circuit electrostatic discharge protection and prevention test interface

Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus

Solder alloy

EMI shielding structure

Circuit board and method for manufacturing the same

Microelectronic system including printed circuit board having improved power/ground ball pad array

Package to board interconnect structure with built-in reference plane structure

Integrated circuit package substrate

Dual-sided radio-frequency package with overmold structure

PCB assembly with molded matrix core

High-frequency module

Selective area heating for 3D chip stack

High frequency module, board equipped with antenna, and high frequency circuit board

Configuration element for printed circuit board assemblies

Semiconductor device, electronic device, method of manufacturing semiconductor device, and method of manufacturing electronic device

Printed wiring board, printed circuit board, and electronic device

Method of forming a solder bump structure

Connection verification technique

Component carrier with a bypass capacitance comprising dielectric film structure

Package-on-package structure with through molding via

UNDERLYING RECESSED COMPONENT PLACEMENT

Wiring board

Enhanced power distribution to application specific integrated circuits (ASICS)

Electrodeposited contact terminal for use as an electrical connector or semiconductor packaging substrate

Active heatsink lid

Electronic component device, method of mounting electronic component device on circuit board, and mounting structure of electronic component device on circuit board

Mounting structure and method for manufacturing same

Capacitive interconnect in a semiconductor package

Top-side connector interface for processor packaging

Wiring board including multiple wiring layers

Support structure and manufacture method thereof

Mounted structure of laminated capacitor, and method of mounting laminated capacitor

Module, method for manufacturing the same, and electronic device

ADAPTER PANEL AND MANUFACTURING METHOD AND ENCAPSULATION STRUCTURE THEREOF AND BONDING METHOD FOR THE ADAPTER PANEL

Apparatus and methods for multi-die packaging

Hybrid printed circuit assembly with low density main core and embedded high density circuit regions

Systems and methods for thermal management for high power density EMI shielded electronic devices

Surface-mountable power delivery bus board

EXTENDED PADS TO EASE REWORK FOR BTC AND BGA TYPE TECHNOLOGY

Electronic component and manufacturing method therefor

Display apparatus and electronic device

Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows

Ball height control in bonding process

Method of manufacturing cu core ball

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

Multilayer substrate

Rework grid array interposer with direct power

Development of the advanced component in cavity technology

Systems, methods and devices for a package securing system

Flex circuit for accessing pins of a chip carrier

Microelectronic system including printed circuit board having improved power/ground ball pad array

Package with SoC and integrated memory

Circuit board, display panel, and display device

ELECTRONIC DEVICE EQUIPPED WITH A HEAT SINK

SOLDER PASTE AND SOLDERING FLUX, AND MOUNTED STRUCTURE USING SAME

SYSTEM, APPARATUS AND METHOD FOR INTERCONNECTING CIRCUIT BOARDS

Package-on-package structure with through molding via

Data processing device

Data processing device

Printed wiring board assembly, electrical device, and method for assembling printed wiring board assembly

Radio frequency coupling and transition structure

Noise reduction board and electronic device

Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips

Methods and apparatus for package with interposers

CONDUCTIVE BALL

Circuit board and method for manufacturing the same

Electronic module having electromagnetic shielding structure and manufacturing method thereof

Circuit substrate, semiconductor package and process for fabricating the same

COMPONENT FOR THE PROTECTION OF SENSITIVE SIGNALS, CORRESPONDING DEVICE AND METHOD

Lead-free solder ball

Selective area heating for 3D chip stack

Selective area heating for 3D chip stack

Connection body, method for manufacturing a connection body, connecting method and anisotropic conductive adhesive agent

Printed wiring board

Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other

Void evaluation apparatus and void evaluation method in the solder

Semiconductor package, electronic device, and solder mounting method

Portable electronic device contact puck alignment

Partially depopulated interconnection arrays for packaged semiconductor devices and printed circuit boards

Circuit substrate and method for manufacturing the same

Coreless multi-layer circuit substrate with minimized pad capacitance

Wiring board and method for recognizing code information thereof

Package with SoC and integrated memory

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

Method of making an electrical connector having electrodeposited terminals

High-temperature cycling BGA packaging

Electronic module

Socket with routed contacts

Semiconductor device having connection terminal of solder

Semiconductor package, module substrate and semiconductor package module having the same

Dual-side reinforcement flux for encapsulation

Printed circuit board and manufacturing method thereof, and semiconductor package including the printed circuit board

Printed circuit board, ball grid array package and wiring method of printed circuit board

Printed circuit board having power/ground ball pad array

Ball grid array and land grid array assemblies fabricated using temporary resist

Package-on-package structure with through molding via

Direct injection molded solder process for forming solder bumps on wafers

Three dimensional integrated circuit electrostatic discharge protection and prevention test interface

Semiconductor device having markings and package on package including the same

DUAL-SIDED RADIO-FREQUENCY PACKAGE HAVING BALL GRID ARRAY

Electronic package design that facilitates shipping the electronic package

Capacitors for multilayer printed circuit boards

Systems for packaging electronic devices

Semiconductor modules and semiconductor packages

Printed circuit board assembly including conductive heat transfer

Semiconductor component, semiconductor-mounted product including the component, and method of producing the product

Semiconductor device

WIRING BOARD STRUCTURE AND METHOD OF MANUFACTURING WIRING BOARD STRUCTURE

Ball grid array formed on printed circuit board

Printed circuit board

Circuit substrate and method for manufacturing the same

Semiconductor device

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

Electronic Device, Test Board, and Semiconductor Device Manufacturing Method

Integrated circuit assemblies with molding compound

Integrated circuit with interface circuitry, and an interface cell for such interface circuitry

Companion integrated circuit having decoupling capacitor and mobile device having the same

PRINTED CIRCUIT BOARD, METHOD FOR MAUFACTURING THE SAME AND PACKAGE ON PACKAGE HAVING THE SAME

Semi-finished product for the production of a printed circuit board and method for producing the same

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing thereof

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE

Face-up substrate integration with solder ball connection in semiconductor package

ELECTRONIC APPARATUS

High-frequency circuit package and sensor module

Electrical connector

Method of connecting a semiconductor package to a board

Circuit board with integrated passive devices

Circuit component bridge device

Semiconductor device manufacturing method and semiconductor mounting substrate

Multi-dimensional integrated circuit structures and methods of forming the same

RADIO MODULE AND RELEVANT MANUFACTURING METHOD

Ball grid array system

Area array device connection structures with complimentary warp characteristics

Hybrid printed circuit assembly with low density main core and embedded high density circuit regions

Embedded packages having a connection joint group

Package with SoC and integrated memory

Integrated IC package

Solder bridging prevention structures for circuit boards and semiconductor packages

Partially depopulated interconnection arrays for packaged semiconductor devices and printed circuit boards

Mounting structure and method for manufacturing same

Semiconductor package and wiring board having the semiconductor package thereon

Method of forming a circuit board

Electrical connector and manufacturing method thereof

Socket with routed contacts

Bump electrode, board which has bump electrodes, and method for manufacturing the board

Bonding structure of electronic equipment

Dam structure for enhancing joint yield in bonding processes

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

Methods of fluxless micro-piercing of solder balls, and resulting devices

Substrate warpage control using external frame stiffener

High-frequency package

Circuit board for mounting electronic components

Display device

Electronic component inspection apparatus and method

Substrate comprising inorganic material that lowers the coefficient of thermal expansion (CTE) and reduces warpage

Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows

Integrated circuit package substrate

Method and System for Optimizing Routing Layers and Board Space Requirements for a Ball Grid Array Land Pattern

Circuit board and electronic device

Circuit substrate, semiconductor package and process for fabricating the same

Stack type semiconductor package

Area array device connection structures with complimentary warp characteristics

Solder in cavity interconnection technology

Stacked type semiconductor device and printed circuit board

Method of manufacturing semiconductor device capable of enhancing bonding strength between connection terminal and electrode

Passive cooling system integrated into a printed circuit board for cooling electronic components

Non-uniform substrate stackup

Methods and apparatus for package with interposers

Symmetrical hexagonal-based ball grid array pattern

Ball grid array and land grid array having modified footprint

Interconnect arrangement for hexagonal attachment configurations