Regensburg
Germany
206
2025-11-06
The entities that hold a legal rights for patent applications filed by inventor Meyer Thorsten:
Thorsten Meyer from Regensburg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
TRANSISTOR PACKAGE WITH AREAL INTERNAL INTERCONNECT
#2 | 2025-10-23LEAD FRAME AND CLIP FRAME FOR MOLDED SEMICONDUCTOR PACKAGES, AND RELATED METHODS OF MANUFACTURING
#3 | 2025-05-22INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
#4 | 2025-02-20RADIATION SOURCE DEVICE
#5 | 2024-12-12SEMICONDUCTOR DIE SHIELDING STRUCTURE
#6 | 2024-08-08A SEMICONDUCTOR TRANSISTOR PACKAGE HAVING ELECTRICAL CONTACT LAYERS AND A METHOD FOR FABRICATING THE SAME
#7 | 2024-06-06METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A PIN IN THE FORM OF A DRILLING SCREW
#8 | 2024-05-16SUBSTRATE ARRANGEMENT AND METHODS FOR PRODUCING A SUBSTRATE ARRANGEMENT
#9 | 2024-03-28CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM
#10 | 2024-02-01MULTI-PHASE POWER CONVERTER
#11 | 2024-01-25SEMICONDUCTOR PACKAGE AND METHOD
#12 | 2023-06-22Radiation source device
#13 | 2023-06-08LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCTURED CENTRAL PAD
#14 | 2023-06-01Semiconductor package with metal posts from structured leadframe
#15 | 2023-04-20SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THEREOF
#16 | 2023-02-16SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
#17 | 2023-01-26Integrated circuit package having wirebonded multi-die stack
#18 | 2022-09-22Semiconductor Device Comprising a Semiconductor Die and a Carrier both Covered by a Parylene Coating
#19 | 2022-09-08Semiconductor device having contact trenches extending from opposite sides of a semiconductor body
#20 | 2022-05-26Package with elevated lead and structure extending vertically from encapsulant bottom
#21 | 2022-05-19Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereof
#22 | 2022-04-21Vertical inductor for WLCSP
#23 | 2022-01-06Semiconductor device package comprising a pin in the form of a drilling screw
#24 | 2021-10-21Predictive chip-maintenance
#25 | 2021-06-03Semiconductor device including an electrical contact with a metal layer arranged thereon
#26 | 2021-06-03SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
#27 | 2021-04-15Package with separate substrate sections
#28 | 2021-02-11Flat lead package formation method
#29 | 2021-01-07Processing of one or more carrier bodies and electronic components by multiple alignment
#30 | 2020-12-10Method for fabricating a semiconductor flip-chip package
#31 | 2020-12-03Vertical inductor for WLCSP
#32 | 2020-11-19Batch manufacture of packages by sheet separated into carriers after mounting of electronic components
#33 | 2020-10-29Semiconductor device with bond pad extensions formed on molded appendage
#34 | 2020-08-27Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
#35 | 2020-08-27Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
#36 | 2020-06-25Multi-purpose non-linear semiconductor package assembly line
#37 | 2020-06-25Semiconductor panels, semiconductor packages, and methods for manufacturing thereof
#38 | 2020-04-21Stacked die semiconductor package with electrical interposer
#39 | 2020-01-16Semiconductor package with plastic waveguide
#40 | 2019-11-28Integrated circuit packages
#41 | 2019-10-03Semiconductor package system
#42 | 2019-08-22Package comprising carrier with chip and component mounted via opening
#43 | 2019-07-18Semiconductor device having an antenna arranged over an active main surface of a semiconductor die
#44 | 2019-07-18Vertical inductor for WLCSP
#45 | 2019-07-04EPLB/EWLB BASED POP FOR HBM OR CUSTOMIZED PACKAGE STACK
#46 | 2019-05-16Reinforcement for electrical connectors
#47 | 2019-04-04Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement
#48 | 2018-12-27Electronic device including redistribution layer pad having a void
#49 | 2018-11-01INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
#50 | 2018-10-04Microelectronic package having a passive microelectronic device disposed within a package body
#51 | 2018-09-20Method of embedding WLCSP components in E-WLB and E-PLB
#52 | 2018-07-12Integrated circuit package having wirebonded multi-die stack
#53 | 2018-07-05Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
#54 | 2018-06-07Wearable electronic devices and components thereof
#55 | 2018-04-05Multi-purpose non-linear semiconductor package assembly line
#56 | 2018-04-05Flexible band wearable electronic device
#57 | 2017-11-30Integrated circuit package configurations to reduce stiffness
#58 | 2017-11-02Package with vertical interconnect between carrier and clip
#59 | 2017-10-26Semiconductor Devices with On-Chip Antennas and Manufacturing Thereof
#60 | 2017-10-05SEMICONDUCTOR DEVICE INCLUDING A MEMS DIE
#61 | 2017-08-03Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
#62 | 2017-07-20Multi-layer package
#63 | 2017-06-22Wireless in-chip and chip to chip communication
#64 | 2017-06-22Electronic component and methods of manufacturing the same
#65 | 2017-06-08Connector block with two sorts of through connections, and electronic device comprising a connector block
#66 | 2017-05-25Conductive paths through dielectric with a high aspect ratio for semiconductor devices
#67 | 2017-05-04Method for producing a power semiconductor module
#68 | 2017-04-13Integrated circuit package
#69 | 2017-03-02Radio die package with backside conductive plate
#70 | 2017-01-10Hybrid exposure for semiconductor devices
#71 | 2016-12-29Semiconductor package with integrated magnetic field sensor
#72 | 2016-12-29Semiconductor device and method of manufacture thereof
#73 | 2016-12-29SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#74 | 2016-12-29Vertical inductor for WLCSP
#75 | 2016-12-29Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto
#76 | 2016-12-08Three dimensional structures within mold compound
#77 | 2016-12-08Microelectronic package having a passive microelectronic device disposed within a package body
#78 | 2016-11-24Conductive paths through dielectric with a high aspect ratio for semiconductor devices
#79 | 2016-11-24Semiconductor device including at least one element
#80 | 2016-10-06Integrated circuit package configurations to reduce stiffness
#81 | 2016-09-29Package on package architecture and method for making
#82 | 2016-09-22Method of embedding WLCSP components in e-WLB and e-PLB
#83 | 2016-09-22Integrated circuit package having wirebonded multi-die stack
#84 | 2016-09-22Semiconductor device
#85 | 2016-09-22Wearable electronic devices and components thereof
#86 | 2016-09-08Package-on-package stacked microelectronic structures
#87 | 2016-08-18Antenna on ceramics for a packaged die
#88 | 2016-07-14SENSOR HIERARCHY
#89 | 2016-07-14Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
#90 | 2016-06-30Chip package-in-package
#91 | 2016-06-09Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
#92 | 2016-05-26Methods of forming stacked microelectronic dice embedded in a microelectronic substrate
#93 | 2016-02-18System and process for fabricating semiconductor packages
#94 | 2016-01-14High density chip-to-chip connection
#95 | 2015-11-19Bulk acoustic wave resonator tuner circuits
#96 | 2015-10-01ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC COMPONENTS
#97 | 2015-10-01Passive electrical devices with a polymer carrier
#98 | 2015-09-24Stress buffer layer for integrated microelectromechanical systems (MEMS)
#99 | 2015-09-17Integrated circuit package
#100 | 2015-09-17Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip
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