Inventor profile of:

Ryu Nakano

City:

Tokyo

Country:

Japan

Published Applications:

18

Last publication date:

2023-02-09

Top Assignees for applications by Ryu Nakano

The entities that hold a legal rights for patent applications filed by inventor Nakano Ryu:

Recent patent applications by Nakano Ryu

Ryu Nakano from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-02-09
US20230040728A1
Electricity

SUBSTRATE PROCESSING METHOD AND APPARATUS

#2 | 2023-02-02
US20230031720A1
Electricity

METHODS FOR FORMING DOPED SILICON OXIDE THIN FILMS

#3 | 2020-12-10
US20200388487A1
Electricity

Methods for forming doped silicon oxide thin films

#4 | 2020-06-11
US20200185218A1
Electricity

Methods for forming doped silicon oxide thin films

#5 | 2019-08-22
US20190259611A1
Electricity

Substrate processing method and apparatus

#6 | 2019-06-06
US20190172708A1
Electricity

Methods for forming doped silicon oxide thin films

#7 | 2018-07-26
US20180211834A1
Electricity

Methods for forming doped silicon oxide thin films

#8 | 2017-11-23
US20170338111A1
Electricity

Methods for forming doped silicon oxide thin films

#9 | 2016-07-07
US20160196970A1
Electricity

Methods for forming doped silicon oxide thin films

#10 | 2015-05-28
US20150147875A1
Electricity

Methods for forming doped silicon oxide thin films

#11 | 2015-01-15
US20150017794A1
Electricity

Methods for forming doped silicon oxide thin films

#12 | 2014-12-18
US20140367359A1
Electricity

Method for controlling in-plane uniformity of substrate processed by plasma-assisted process

#13 | 2013-05-09
US20130115763A1
Electricity

Methods for forming doped silicon oxide thin films

#14 | 2009-06-18
US20090155488A1
Chemistry; metallurgy

SHOWER PLATE ELECTRODE FOR PLASMA CVD REACTOR

#15 | 2007-11-22
US20070266945A1
Chemistry; metallurgy

PLASMA CVD APPARATUS EQUIPPED WITH PLASMA BLOCKING INSULATION PLATE

#16 | 2007-06-21
US20070141273A1
Chemistry; metallurgy

Method of forming organosilicon oxide film and multilayer resist structure

#17 | 2006-06-29
US20060137610A1
Chemistry; metallurgy

Plasma processing apparatus with insulated gas inlet pore

#18 | 2006-03-02
US20060046519A1
Electricity

Method of forming fluorine-doped low-dielectric-constant insulating film

InventorID:

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