Tokyo
Japan
188
2015-02-26
133
2015-10-27
These are the the leading inventors for applications assigned to ASM JAPAN K.K.:
ASM JAPAN K.K. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method of forming metal oxide hardmask
#2 | 2013-04-04 ✅ Patent 8,569,184 granted on 2013-10-29Method for forming single-phase multi-element film by PEALD
#3 | 2013-03-21UV Irradiation Apparatus Having UV Lamp-Shared Multiple Process Stations
#4 | 2013-01-31 ✅ Patent 8,551,892 granted on 2013-10-08Method for reducing dielectric constant of film using direct plasma of hydrogen
#5 | 2013-01-17 ✅ Patent 10,854,498 granted on 2020-12-01Wafer-supporting device and method for producing same
#6 | 2013-01-17Container Having Multiple Compartments Containing Liquid Material for Multiple Wafer-Processing Chambers
#7 | 2012-12-27 ✅ Patent 10,364,496 granted on 2019-07-30Dual section module having shared and unshared mass flow controllers
#8 | 2012-12-27 ✅ Patent 9,793,148 granted on 2017-10-17Method for positioning wafers in multiple wafer transport
#9 | 2012-12-06 ✅ Patent 9,312,155 granted on 2016-04-12High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules
#10 | 2012-11-22 ✅ Patent 8,563,443 granted on 2013-10-22Method of depositing dielectric film by ALD using precursor containing silicon, hydrocarbon, and halogen
#11 | 2012-11-01 ✅ Patent 8,592,005 granted on 2013-11-26Atomic layer deposition for controlling vertical film growth
#12 | 2012-10-18 ✅ Patent 8,298,951 granted on 2012-10-30Footing reduction using etch-selective layer
#13 | 2012-09-06 ✅ Patent 8,466,411 granted on 2013-06-18Calibration method of UV sensor for UV curing
#14 | 2012-08-30 ✅ Patent 8,415,259 granted on 2013-04-09Method of depositing dielectric film by modified PEALD method
#15 | 2012-08-23 ✅ Patent 8,329,599 granted on 2012-12-11Method of depositing dielectric film by ALD using precursor containing silicon, hydrocarbon, and halogen
#16 | 2012-08-02 ✅ Patent 8,465,811 granted on 2013-06-18Method of depositing film by atomic layer deposition with pulse-time-modulated plasma
#17 | 2012-06-28 ✅ Patent 8,901,016 granted on 2014-12-02Method of forming metal oxide hardmask
#18 | 2012-05-10 ✅ Patent 8,470,187 granted on 2013-06-25Method of depositing film with tailored comformality
#19 | 2012-04-26 ✅ Patent 8,845,806 granted on 2014-09-30Shower plate having different aperture dimensions and/or distributions
#20 | 2012-03-08 ✅ Patent 8,394,466 granted on 2013-03-12Method of forming conformal film having si-N bonds on high-aspect ratio pattern
#21 | 2012-02-02 ✅ Patent 8,669,185 granted on 2014-03-11Method of tailoring conformality of Si-containing film
#22 | 2011-09-08 ✅ Patent 8,241,991 granted on 2012-08-14Method for forming interconnect structure having airgap
#23 | 2011-06-30Method for Sealing Pores at Surface of Dielectric Layer by UV Light-Assisted CVD
#24 | 2011-04-14 ✅ Patent 8,129,291 granted on 2012-03-06Method of depositing dielectric film having Si-N bonds by modified peald method
#25 | 2011-01-20 ✅ Patent 8,334,219 granted on 2012-12-18Method of forming stress-tuned dielectric film having Si-N bonds by modified PEALD
#26 | 2010-11-18 ✅ Patent 7,842,622 granted on 2010-11-30Method of forming highly conformal amorphous carbon layer
#27 | 2010-11-02 ✅ Patent 7,825,040 granted on 2010-11-02Method for depositing flowable material using alkoxysilane or aminosilane precursor
#28 | 2010-10-07 ✅ Patent 8,197,915 granted on 2012-06-12Method of depositing silicon oxide film by plasma enhanced atomic layer deposition at low temperature
#29 | 2010-09-02 ✅ Patent 7,972,980 granted on 2011-07-05Method of forming conformal dielectric film having Si-N bonds by PECVD
#30 | 2010-07-29METHOD OF FORMING HARDMASK BY PLASMA CVD
#31 | 2010-07-22 ✅ Patent 7,919,416 granted on 2011-04-05Method of forming conformal dielectric film having Si-N bonds by PECVD
#32 | 2010-07-15 ✅ Patent 8,151,814 granted on 2012-04-10Method for controlling flow and concentration of liquid precursor
#33 | 2010-06-24 ✅ Patent 8,666,551 granted on 2014-03-04Semiconductor-processing apparatus equipped with robot diagnostic module
#34 | 2010-06-17METHOD OF FORMING LOW-K FILM HAVING CHEMICAL RESISTANCE
#35 | 2010-06-17Multiple-Substrate Transfer Apparatus and Multiple-Substrate Processing Apparatus
#36 | 2010-06-10 ✅ Patent 8,142,862 granted on 2012-03-27Method of forming conformal dielectric film having Si-N bonds by PECVD
#37 | 2010-06-10 ✅ Patent 8,765,233 granted on 2014-07-01Method for forming low-carbon CVD film for filling trenches
#38 | 2010-05-20 ✅ Patent 10,378,106 granted on 2019-08-13Method of forming insulation film by modified PEALD
#39 | 2010-05-20 ✅ Patent 8,647,722 granted on 2014-02-11Method of forming insulation film using plasma treatment cycles
#40 | 2010-04-29TWO-STEP FORMATION OF HYDROCARBON-BASED POLYMER FILM
#41 | 2010-04-29WAFER LIFT PINS SUSPENDED AND SUPPORTED AT UNDERSIDE OF SUSCEPTOR
#42 | 2010-04-15 ✅ Patent 7,972,961 granted on 2011-07-05Purge step-controlled sequence of processing semiconductor wafers
#43 | 2010-04-15 ✅ Patent 8,133,555 granted on 2012-03-13Method for forming metal film by ALD using beta-diketone metal complex
#44 | 2010-04-08IMPEDANCE MATCHING APPARATUS FOR PLASMA-ENHANCED REACTION REACTOR
#45 | 2010-03-04 ✅ Patent 8,084,104 granted on 2011-12-27Atomic composition controlled ruthenium alloy film formed by plasma-enhanced atomic layer deposition
#46 | 2010-02-25 ✅ Patent 7,832,353 granted on 2010-11-16Semiconductor manufacturing apparatus equipped with wafer inspection device and inspection techniques
#47 | 2010-02-11 ✅ Patent 7,945,345 granted on 2011-05-17Semiconductor manufacturing apparatus
#48 | 2010-01-21SEMICONDUCTOR PROCESSING APPARATUS HAVING ALL-ROUND TYPE WAFER HANDLING CHAMBER
#49 | 2010-01-14EXHAUST GAS TRAP FOR SEMICONDUCTOR PROCESSES
#50 | 2010-01-07METHOD OF FORMING FLUORINE-CONTAINING DIELECTRIC FILM
#51 | 2010-01-07WAFER-POSITIONING MECHANISM
#52 | 2009-12-03 ✅ Patent 8,053,036 granted on 2011-11-08Method for designing shower plate for plasma CVD apparatus
#53 | 2009-12-03 ✅ Patent 7,622,369 granted on 2009-11-24Device isolation technology on semiconductor substrate
#54 | 2009-12-03APPARATUS AND METHOD FOR IMPROVING PRODUCTION THROUGHPUT IN CVD CHAMBER
#55 | 2009-11-05 ✅ Patent 7,632,549 granted on 2009-12-15Method of forming a high transparent carbon film
#56 | 2009-10-08 ✅ Patent 7,963,736 granted on 2011-06-21Wafer processing apparatus with wafer alignment device
#57 | 2009-10-01METHOD FOR ACTIVATING REACTIVE OXYGEN SPECIES FOR CLEANING CARBON-BASED FILM DEPOSITION
#58 | 2009-09-24 ✅ Patent 7,993,462 granted on 2011-08-09Substrate-supporting device having continuous concavity
#59 | 2009-08-20 ✅ Patent 7,799,674 granted on 2010-09-21Ruthenium alloy film for copper interconnects
#60 | 2009-08-13 ✅ Patent 8,118,940 granted on 2012-02-21Clamping mechanism for semiconductor device
#61 | 2009-06-25TANDEM TYPE SEMICONDUCTOR-PROCESSING APPARATUS
#62 | 2009-06-18 ✅ Patent 8,003,174 granted on 2011-08-23Method for forming dielectric film using siloxane-silazane mixture
#63 | 2009-06-18 ✅ Patent 7,655,564 granted on 2010-02-02Method for forming Ta-Ru liner layer for Cu wiring
#64 | 2009-06-18SHOWER PLATE ELECTRODE FOR PLASMA CVD REACTOR
#65 | 2009-06-11 ✅ Patent 7,807,566 granted on 2010-10-05Method for forming dielectric SiOCH film having chemical stability
#66 | 2009-06-04 ✅ Patent 7,651,959 granted on 2010-01-26Method for forming silazane-based dielectric film
#67 | 2009-05-28 ✅ Patent 8,021,723 granted on 2011-09-20Method of plasma treatment using amplitude-modulated RF power
#68 | 2009-04-21 ✅ Patent 7,520,244 granted on 2009-04-21Plasma treatment apparatus
#69 | 2009-04-16METHOD FOR FORMING ULTRA-THIN BORON-CONTAINING NITRIDE FILMS AND RELATED APPARATUS
#70 | 2009-04-09 ✅ Patent 8,041,450 granted on 2011-10-18Position sensor system for substrate transfer robot
#71 | 2009-04-09SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR CURING MATERIAL WITH UV LIGHT
#72 | 2009-04-09SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR CURING MATERIALS WITH UV LIGHT
#73 | 2009-04-09METHOD OF SELF-CLEANING OF CARBON-BASED FILM
#74 | 2009-04-02METHOD FOR FORMING RUTHENIUM COMPLEX FILM USING Beta-DIKETONE-COORDINATED RUTHENIUM PRECURSOR
#75 | 2009-03-12 ✅ Patent 7,638,441 granted on 2009-12-29Method of forming a carbon polymer film using plasma CVD
#76 | 2009-03-05TECHNOLOGY OF DETECTING ABNORMAL OPERATION OF PLASMA PROCESS
#77 | 2009-03-05METHOD AND APPARATUS FOR MONITORING PLASMA-INDUCED DAMAGE USING DC FLOATING POTENTIAL OF SUBSTRATE
#78 | 2009-02-26 ✅ Patent 7,831,315 granted on 2010-11-09Method for controlling semiconductor-processing apparatus
#79 | 2009-01-22 ✅ Patent 7,501,292 granted on 2009-03-10Method for managing UV irradiation for curing semiconductor substrate
#80 | 2008-12-25METHOD OF FORMING RUTHENIUM FILM FOR METAL WIRING STRUCTURE
#81 | 2008-12-11 ✅ Patent 7,781,352 granted on 2010-08-24Method for forming inorganic silazane-based dielectric film
#82 | 2008-12-11 ✅ Patent 7,955,650 granted on 2011-06-07Method for forming dielectric film using porogen gas
#83 | 2008-12-09 ✅ Patent 7,462,245 granted on 2008-12-09Single-wafer-processing type CVD apparatus
#84 | 2008-12-04METHOD FOR FORMING AMORPHOUSE SILICON FILM BY PLASMA CVD
#85 | 2008-12-04PLASMA CVD APPARATUS HAVING NON-METAL SUSCEPTOR
#86 | 2008-09-25 ✅ Patent 7,763,869 granted on 2010-07-27UV light irradiating apparatus with liquid filter
#87 | 2008-09-11METHOD FOR INCREASING MECHANICAL STRENGTH OF DIELECTRIC FILM BY USING SEQUENTIAL COMBINATION OF TWO TYPES OF UV IRRADIATION
#88 | 2008-09-04 ✅ Patent 8,758,514 granted on 2014-06-24Cluster type semiconductor processing apparatus
#89 | 2008-07-24 ✅ Patent 7,833,353 granted on 2010-11-16Liquid material vaporization apparatus for semiconductor processing apparatus
#90 | 2008-06-26 ✅ Patent 7,712,370 granted on 2010-05-11Method of detecting occurrence of sticking of substrate
#91 | 2008-05-29METHOD OF FORMING RU FILM AND METAL WIRING STRUCTURE
#92 | 2008-05-22Coated aluminum material for semiconductor manufacturing apparatus
#93 | 2008-05-15 ✅ Patent 7,638,443 granted on 2009-12-29Method of forming ultra-thin SiN film by plasma CVD
#94 | 2008-03-27 ✅ Patent 7,718,553 granted on 2010-05-18Method for forming insulation film having high density
#95 | 2008-03-20 ✅ Patent 7,789,965 granted on 2010-09-07Method of cleaning UV irradiation chamber
#96 | 2008-03-06 ✅ Patent 7,690,881 granted on 2010-04-06Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
#97 | 2008-03-06 ✅ Patent 7,435,484 granted on 2008-10-14Ruthenium thin film-formed structure
#98 | 2008-02-14 ✅ Patent 8,080,282 granted on 2011-12-20Method for forming silicon carbide film containing oxygen
#99 | 2007-11-22PLASMA CVD APPARATUS EQUIPPED WITH PLASMA BLOCKING INSULATION PLATE
#100 | 2007-11-15THIN FILM FORMATION BY ATOMIC LAYER GROWTH AND CHEMICAL VAPOR DEPOSITION
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