Cupertino, California
United States
35
2013-06-13
The entities that hold a legal rights for patent applications filed by inventor Bour David:
David Bour from Cupertino, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Vertical GaN-based metal insulator semiconductor FET
#2 | 2013-05-23Edge termination by ion implantation in GaN
#3 | 2012-12-13ENHANCED MAGNESIUM INCORPORATION INTO GALLIUM NITRIDE FILMS THROUGH HIGH PRESSURE OR ALD-TYPE PROCESSING
#4 | 2012-10-11MOCVD FABRICATION OF GROUP III-NITRIDE MATERIALS USING IN-SITU GENERATED HYDRAZINE OR FRAGMENTS THERE FROM
#5 | 2012-10-11PLASMA-ASSISTED MOCVD FABRICATION OF P-TYPE GROUP III-NITRIDE MATERIALS
#6 | 2012-09-20GROWTH OF III-V LED STACKS USING NANO MASKS
#7 | 2012-09-13SUBSTRATE CARRIER WITH MULTIPLE EMISSIVITY COEFFICIENTS FOR THIN FILM PROCESSING
#8 | 2012-04-05INTEGRATION OF CLUSTER MOCVD AND HVPE REACTORS WITH OTHER PROCESS CHAMBERS
#9 | 2012-03-01GAS DISTRIBUTION SHOWERHEAD WITH HIGH EMISSIVITY SURFACE
#10 | 2012-01-19p-GaN Fabrication Process Utilizing a Dedicated Chamber and Method of Minimizing Magnesium Redistribution for Sharper Decay Profile
#11 | 2011-12-22Method and apparatus for inducing turbulent flow of a processing chamber cleaning gas
#12 | 2011-12-22CLOSED LOOP MOCVD DEPOSITION CONTROL
#13 | 2011-08-25GROWTH OF MULTI-JUNCTION LED FILM STACKS WITH MULTI-CHAMBERED EPITAXY SYSTEM
#14 | 2011-03-24EPITAXIAL GROWTH OF COMPOUND NITRIDE SEMICONDUCTOR STRUCTURES
#15 | 2009-04-16MULTI-GAS CONCENTRIC INJECTION SHOWERHEAD
#16 | 2008-12-04NITRIDE OPTOELECTRONIC DEVICES WITH BACKSIDE DEPOSITION
#17 | 2008-08-28STRESS MEASUREMENTS DURING LARGE-MISMATCH EPITAXIAL PROCESSES
#18 | 2008-05-29Stress measurement and stress balance in films
#19 | 2008-05-29System and method for depositing a gaseous mixture onto a substrate surface using a showerhead apparatus
#20 | 2008-05-29IN-SITU DETECTION OF GAS-PHASE PARTICLE FORMATION IN NITRIDE FILM DEPOSITION
#21 | 2008-04-24SUBSTRATE SUPPORT STRUCTURE WITH RAPID TEMPERATURE CHANGE
#22 | 2008-02-28Hotwall reactor and method for reducing particle formation in GaN MOCVD
#23 | 2007-11-08Dislocation-specific lateral epitaxial overgrowth to reduce dislocation density of nitride films
#24 | 2007-11-08Parasitic particle suppression in growth of III-V nitride films using MOCVD and HVPE
#25 | 2007-11-08Dislocation-specific dielectric mask deposition and lateral epitaxial overgrowth to reduce dislocation density of nitride films
#26 | 2007-11-08UV activation of NH3 for III-N deposition
#27 | 2007-11-01Buffer-layer treatment of MOCVD-grown nitride structures
#28 | 2007-11-01Nitride optoelectronic devices with backside deposition
#29 | 2007-11-01MOCVD reactor without metalorganic-source temperature control
#30 | 2007-11-01MOCVD reactor with concentration-monitor feedback
#31 | 2007-10-18Dual-side epitaxy processes for production of nitride semiconductor structures
#32 | 2007-10-18Stacked-substrate processes for production of nitride semiconductor structures
#33 | 2007-10-18Double-sided nitride structures
#34 | 2007-10-18Epitaxial growth of compound nitride semiconductor structures
#35 | 2007-02-20Laser employing a zinc-doped tunnel-junction
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