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Inventor profile of:

Eva Tois

City:

Espoo

Country:

Finland

Published Applications:

Last publication date:

2026-03-19

Top Assignees for applications by Eva Tois

The entities that hold a legal rights for patent applications filed by inventor Tois Eva:

ASM IP Holding B.V. 11 Almere, Netherlands
ASM International N.V. 7 Almere, Netherlands
ASM International N.V. 2 , Netherlands
ASM IP HOLDINGS B.V. 1 Almere, Netherlands
ASM International 1 Bilthoven, Netherlands
ASM IP Holding B.V. 1 Versterkerstraat, Netherlands

Recent patent applications by Tois Eva

Eva Tois from Espoo, FI has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-19

US20260082836A1

Electricity

METHOD AND APPARATUS FOR ETCHING A SURFACE

#2 | 2026-01-29

US20260028712A1

Chemistry; metallurgy

SIMULTANEOUS SELECTIVE DEPOSITION OF TWO DIFFERENT MATERIALS ON TWO DIFFERENT SURFACES

#3 | 2025-05-08

US20250149325A1

Electricity

METHOD OF CLEANING A SURFACE

#4 | 2025-03-20

US20250092515A1

Chemistry; metallurgy

SELECTIVE DEPOSITION OF MATERIAL COMPRISING SILICON AND OXYGEN USING PLASMA

#5 | 2025-01-30

US20250037988A1

Electricity

SILICON OXIDE DEPOSITION METHOD

#6 | 2024-09-19

US20240312790A1

Electricity

SELECTIVE ETCHING METHOD AND ETCHING ASSEMBLY

#7 | 2024-08-22

US20240282572A1

Electricity

SELECTIVE DEPOSITION OF METAL OXIDE

#8 | 2024-03-21

US20240096633A1

Electricity

METHODS AND ASSEMBLIES FOR SELECTIVELY DEPOSITING TRANSITION METALS

#9 | 2023-12-21

US20230407476A1

Chemistry; metallurgy

SELECTIVE DEPOSITION OF MATERIAL COMPRISING NOBLE METAL

#10 | 2023-05-04

US20230140812A1

Electricity

SELECTIVE THERMAL DEPOSITION METHOD

#11 | 2023-05-04

US20230140367A1

Chemistry; metallurgy

Selective deposition of material comprising silicon and oxygen using plasma

#12 | 2023-05-04

US20230139917A1

Chemistry; metallurgy

SELECTIVE DEPOSITION USING THERMAL AND PLASMA-ENHANCED PROCESS

#13 | 2023-03-30

US20230098114A1

Electricity

SELECTIVE DEPOSITION OF ORGANIC MATERIAL

#14 | 2022-10-27

US20220341040A1

Chemistry; metallurgy

Apparatuses for thin film deposition

#15 | 2022-03-17

US20220084817A1

Electricity

Silicon oxide deposition method

#16 | 2022-03-03

US20220068634A1

Electricity

Method of cleaning a surface

#17 | 2021-11-11

US20210351031A1

Electricity

Selective deposition using hydrophobic precursors

#18 | 2020-07-16

US20200224311A1

Chemistry; metallurgy

Organic reactants for atomic layer deposition

#19 | 2019-08-29

US20190267231A1

Electricity

Enhanced thin film deposition

#20 | 2018-05-10

US20180130666A1

Electricity

Enhanced thin film deposition

#21 | 2018-03-15

US20180073136A1

Chemistry; metallurgy

SELECTIVE DEPOSITION

#22 | 2018-01-11

US20180010247A1

Chemistry; metallurgy

Organic reactants for atomic layer deposition

#23 | 2017-11-09

US20170323776A1

Electricity

Selective deposition using hydrophobic precursors

#24 | 2017-02-02

US20170032956A1

Electricity

Methods for thin film deposition

#25 | 2017-02-02

US20170029947A1

Chemistry; metallurgy

Apparatuses for thin film deposition

#26 | 2016-08-04

US20160222504A1

Chemistry; metallurgy

Selective deposition

#27 | 2016-04-28

US20160118262A1

Electricity

Enhanced thin film deposition

#28 | 2013-07-18

US20130183445A1

Chemistry; metallurgy

Enhanced thin film deposition

#29 | 2011-05-05

US20110104906A1

Electricity

Method of growing oxide thin films

#30 | 2010-11-02

US10678766

Method of growing oxide thin films

#31 | 2010-08-10

US10148525

Atomic-layer-chemical-vapor-deposition of films that contain silicon dioxide

#32 | 2007-07-19

US20070163488A1

Electricity

Method of growing oxide thin films

#33 | 2007-06-28

US20070148350A1

Electricity

Enhanced thin film deposition

#34 | 2007-03-08

US20070054048A1

Chemistry; metallurgy

Extended deposition range by hot spots

InventorID:

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