Munich
Germany
19
2025-06-19
The entities that hold a legal rights for patent applications filed by inventor Bacha Abdallah:
Abdallah Bacha from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION
#2 | 2025-04-03DIE PLACEMENT WITHIN A FORMED CAVITY ON A REDISTRIBUTION LAYER
#3 | 2025-04-03THERMAL INTERFACE MATERIAL ON A SURFACE OF A DIE IN A CAVITY
#4 | 2025-04-03VIAS THROUGH A DIE THAT ARE ELECTRICALLY ISOLATED FROM ACTIVE CIRCUITRY IN THE DIE
#5 | 2023-10-05THIN CLIENT FORM FACTOR ASSEMBLY
#6 | 2023-10-05THREE-DIMENSIONAL STACK COOLING WINGS
#7 | 2023-10-05INTERPOSERS FOR SEMICONDUCTOR DEVICES
#8 | 2023-10-05GLASS BRIDGE FOR CONNECTING DIES
#9 | 2023-10-05GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION
#10 | 2023-10-05HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS
#11 | 2023-09-21MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
#12 | 2023-09-21MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
#13 | 2023-09-21MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
#14 | 2023-09-07STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER
#15 | 2009-01-29Memory module
#16 | 2008-12-04Semiconductor memory arrangement
#17 | 2007-04-26Memory module with an electronic printed circuit board and a plurality of semiconductor chips of the same type
#18 | 2006-06-08Memory module with a clock signal regeneration circuit and a register circuit for temporarily storing the incoming command and address signals
#19 | 2005-05-17Method and device for time measurement on semiconductor modules employing the ball-grid-array technique
3866719 ⎘