Harry Hedler

Light Emission Measuring Device

PRECONCENTRATOR FOR ABSORBING/DESORBING AT LEAST ONE COMPONENT OF GAS

Method of manufacturing garnet interfaces and articles containing the garnets obtained therefrom

Infrared Sensor Having a Microstructure with a Plurality of Thermocouples and a Carrier Element

Infrared sensor, thermal imaging camera and method for producing a microstructure from thermoelectric sensor rods

Micromechanical measuring element and method for producing a micromechanical measuring element

Radiation detector and imaging system

Force transducer forming a capacitive load cell

Radiation detector and imaging system

INTEGRATED CIRCUIT WITH ELECTRICAL THROUGH-CONTACT AND METHOD FOR PRODUCING ELECTRICAL THROUGH-CONTACT

Device and system for selectively detecting gas components or concentrations of gas components in gas to be analyzed and method for operating such device

Micromechanical substrate for a diaphragm with a diffusion barrier layer

SILICON PHOTOMULTIPLIER AND RADIATION DETECTOR

ELECTRONIC DEVICE AND METHOD FOR PRODUCING A DEVICE

Thermoelement including a three-dimensional microstructure, and method for producing a thermoelement

THERMO-ELECTRIC ENERGY CONVERTER HAVING A THREE-DIMENSIONAL MICRO-STRUCTURE, METHOD FOR PRODUCING THE ENERGY CONVERTER AND USE OF THE ENERGY CONVERTER

Method for producing chip packages, and chip package produced in this way

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME WITH AN INTERPOSER SUBSTRATE

Component and method for producing a component

Packaging systems and methods

Through Substrate Conductors

Stacked Semiconductor Chips with Through Substrate Vias

Method for manufacturing a multichip module assembly

Chip arrangement and method of manufacturing a chip arrangement

Semiconductor component with improved contact pad and method for forming the same

Semiconductor chip with integrated via

Semiconductor device with an interconnect element and method for manufacture

Reduced-stress through-chip feature and method of making the same

INTEGRATED CIRCUIT DEVICE COMPRISING CONDUCTIVE VIAS AND METHOD OF MAKING THE SAME

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME

Method for manufacturing a wafer level package

Semiconductor packaging device

Integrated circuit, circuit system, and method of manufacturing

Carrier substrate and integrated circuit

Integrated circuit with re-route layer and stacked die assembly

METHOD FOR MAKING AN INTEGRATED CIRCUIT HAVING A VIA HOLE

METHOD FOR FABRICATING A CIRCUIT

Stacked die package

Solder pillar bumping and a method of making the same

Circuit board arrangement and method for producing a circuit board arrangement

Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly

Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly

Integrated circuit package with a heat dissipation device

Electronic device and method for producing a device

Semiconductor device with stacked chips and method for manufacturing thereof

Electrical through contact

Method for placing material onto a target board by means of a transfer board

Component and method for producing a component

Method for producing chip packages, and chip package produced in this way

METHOD FOR FABRICATING A MODULE HAVING AN ELECTRICAL CONTACT-CONNECTION

Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel

Semiconductor device and method for fabricating the semiconductor device

Intermediate connection for flip chip in packages

Three-dimensionally integrated electronic assembly

Process for producing a component module

Methods for aligning a device and for stacking two devices in an aligned manner and device for improved stacking

Method for fabricating a chip module and a device module fabricated therefrom

Electronic plug unit

Method of manufacturing a semiconductor structure having a wafer through-contact and a corresponding semiconductor structure

METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE

Manufacturing method for an electronic component assembly and corresponding electronic component assembly

Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device

Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions

Stacked die package

Integrated device and electronic system

Semiconductor module for making electrical contact with a connection device via a rewiring device

Semiconductor device

Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement

Semiconductor circuit module and method for fabricating semiconductor circuit modules

Flip-chip component

Method for fabricating semiconductor components

Electronic component comprising external surface contacts and a method for producing the same

Semiconductor and method for producing a semiconductor

Semiconductor apparatus having stacked semiconductor components

Semiconductor device with semiconductor components connected to one another

Semiconductor component having a CSP housing

Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement

Connection of integrated circuits

Flexible contact-connection device

Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions

Method of producing a semiconductor component having a compliant buffer layer

Method of producing an electronic component with flexible bonding

Integrated circuit with re-route layer and stacked die assembly

Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device

Process for producing a semiconductor chip

Method for producing an electronic device connected to a printed circuit board

Connection of integrated circuit to a substrate

Electronic component with flexible contacting pads and method for producing the electronic component

Method for producing a semiconductor device and corresponding semiconductor device

Method of producing an electronic component

Method for connecting circuit devices

Electronic component with flexible contacting pads and method for producing the electronic component

Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement

Compliant relief wafer level packaging

Method for producing a multichip module and multichip module

Semiconductor module and method for producing a semiconductor module

Electronic interface structures and methods

Method for producing an electronic component, especially a memory chip

Method producing a contact connection between a semiconductor chip and a substrate and the contact connection

Electronic component with a semiconductor chip and method of producing the electronic component