Inventor profile of:

Eric GUIOT

City:

Goncelin

Country:

France

Published Applications:

18

Last publication date:

2024-08-08

Top Assignees for applications by Eric GUIOT

The entities that hold a legal rights for patent applications filed by inventor GUIOT Eric:

Recent patent applications by GUIOT Eric

Eric GUIOT from Goncelin, FR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-08-08
US20240266172A1
Electricity

SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE BONDING INTERFACE, AND ASSOCIATED MANUFACTURING METHOD

#2 | 2023-08-17
US20230260841A1
Electricity

Method for producing a composite structure comprising a thin layer of monocrystalline sic on a carrier substrate of polycrystalline SiC

#3 | 2021-06-24
US20210193853A1
Electricity

Engineered substrate with embedded mirror

#4 | 2016-02-25
US20160056318A1
Electricity

Advanced CPV solar cell assembly process

#5 | 2016-02-11
US20160043254A1
Electricity

Multiple transfer assembly process

#6 | 2014-01-30
US20140030877A1
Electricity

Process to dissolve the oxide layer in the peripheral ring of a structure of semiconductor-on-insulator type

#7 | 2012-04-19
US20120094496A1
Electricity

Process for locally dissolving the oxide layer in a semiconductor-on-insulator type structure

#8 | 2011-11-10
US20110275226A1
Electricity

PROCESS TO DISSOLVE THE OXIDE LAYER IN THE PERIPHERAL RING OF A STRUCTURE OF SEMICONDUCTOR-ON-INSULATOR TYPE

#9 | 2011-08-11
US20110193201A1
Electricity

METHOD TO FABRICATE AND TREAT A STRUCTURE OF SEMICONDUCTOR-ON-INSULATOR TYPE, ENABLING DISPLACEMENT OF DISLOCATIONS, AND CORRESPONDING STRUCTURE

#10 | 2011-07-28
US20110183493A1
Electricity

PROCESS FOR MANUFACTURING A STRUCTURE COMPRISING A GERMANIUM LAYER ON A SUBSTRATE

#11 | 2010-07-01
US20100167500A1
Electricity

METHOD OF RECYCLING AN EPITAXIED DONOR WAFER

#12 | 2010-04-22
US20100096733A1
Electricity

Process for fabricating a substrate comprising a deposited buried oxide layer

#13 | 2009-12-31
US20090325362A1
Electricity

METHOD OF RECYCLING AN EPITAXIED DONOR WAFER

#14 | 2007-05-10
US20070105246A1
Electricity

METHOD OF MANUFACTURING A MATERIAL COMPOUND WAFER

#15 | 2007-04-19
US20070087526A1
Electricity

Method of recycling an epitaxied donor wafer

#16 | 2005-12-15
US20050277269A1
Electricity

Method of manufacturing a material compound wafer

#17 | 2005-12-15
US20050277267A1
Electricity

Method for manufacturing a compound material wafer

#18 | 2005-06-16
US20050130393A1
Electricity

Method for improving the quality of heterostructure

InventorID:

631870 ⎘