206561 ⎘
Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging; Electron or ion microscopes; Scanning microscopes characterised by the application Measurement of surface topography
Sub-classes:BROAD ION BEAM DELAYERING APPARATUS WITH INTEGRATED IMAGING
#2Scanning Electron Microscope and Gradient Map Generation Method
#3AUTOMATED CHEMICAL SWITCHING FOR MATERIAL DELAYERING
#4METHOD AND SYSTEM FOR 3D RECONSTRUCTION OF WAFER STRUCTURE BY DIAGONAL MILLING
#5ENHANCED EDGE DETECTION USING DETECTOR INCIDENCE LOCATIONS
#6ASSESSMENT APPARATUS AND METHODS
#7CHARGED PARTICLE ASSESSMENT SYSTEM AND METHOD
#8Detection of Probabilistic Process Windows
#9INSPECTION APPARATUS AND METHOD
#10ELECTRON BEAM PROBING TECHNIQUES AND RELATED STRUCTURES
#11ANALYSIS METHOD, COMPUTER-READABLE MEDIUM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#12SYSTEM AND METHOD FOR GENERATING AND ANALYZING ROUGHNESS MEASUREMENTS AND THEIR USE FOR PROCESS MONITORING AND CONTROL
#13HIGH RESOLUTION, LOW ENERGY ELECTRON MICROSCOPE FOR PROVIDING TOPOGRAPHY INFORMATION AND METHOD OF MASK INSPECTION
#14Method of Dispositioning and Control of a Semiconductor Manufacturing Process
#15METHOD OF AUTOMATED DATA ACQUISITION FOR A TRANSMISSION ELECTRON MICROSCOPE
#16Systems and methods for thermally conditioning a wafer in a charged particle beam apparatus
#17SYSTEM AND METHOD FOR GENERATING AND ANALYZING ROUGHNESS MEASUREMENTS
#18SCREENING EDGE PLACEMENT UNIFORMITY WAFER STOCHASTICS
#19STROBOSCOPIC ELECTRON-BEAM SIGNAL IMAGE MAPPING
#20SYSTEM AND METHOD FOR DETERMINING AND/OR PREDICTING UNBIASED PARAMETERS ASSOCIATED WITH SEMICONDUCTOR MEASUREMENTS
#21Analyzing a sidewall of hole milled in a sample to determine thickness of a buried layer
#22Electron microscope and image generation method
#23Charged particle beam apparatus and image acquiring method
#24Scanning electron microscope and image generation method using scanning electron microscope
#25Charged particle beam device
#26Electron beam probing techniques and related structures
#27PATTERN MEASUREMENT SYSTEM AND PATTERN MEASUREMENT METHOD
#28System and method for generating and analyzing roughness measurements and their use for process monitoring and control
#29Inspection apparatus and method
#30System and methods for thermally conditioning a wafer in a charged particle beam apparatus
#31Detection of probabilistic process windows
#32Enabling scanning electron microscope imaging while preventing sample damage on sensitive layers used in semiconductor manufacturing processes
#33System and method for generating and analyzing roughness measurements
#34Edge detection system
#35Device and method for analyzing a defect of a photolithographic mask or of a wafer
#36System and method for predicting stochastic-aware process window and yield and their use for process monitoring and control
#37System and method for low-noise edge detection and its use for process monitoring and control
#38Electron beam probing techniques and related structures
#39System and method for generating and analyzing roughness measurements and their use for process monitoring and control
#40Method for SEM-guided AFM scan with dynamically varied scan speed
#41Use of electron beam scanning electron microscopy for characterization of a sidewall occluded from line-of-sight of the electron beam
#42System and method for generating and analyzing roughness measurements and their use for process monitoring and control
#43System and method for generating and analyzing roughness measurements and their use for process monitoring and control
#44Methods and apparatus for performing profile metrology on semiconductor structures
#45Apparatus and method for large-scale high throughput quantitative characterization and three-dimensional reconstruction of material structure
#46CHARGED PARTICLE BEAM APPARATUS
#47Inspection tool, lithographic apparatus, electron beam source and an inspection method
#48System and method for generating and analyzing roughness measurements
#49Image-forming device, and dimension measurement device
#50Systems and methods for thermally conditioning a wafer in a charged particle beam apparatus
#51Edge detection system
#523D defect characterization of crystalline samples in a scanning type electron microscope
#53Methods and apparatus for high throughput SEM and AFM for characterization of nanostructured surfaces
#54Charged particle beam apparatus and image acquisition method
#55System and method for performing failure analysis using virtual three-dimensional imaging
#56System and method for generating and analyzing roughness measurements
#57System and method for generating and analyzing roughness measurements
#58Endpointing for focused ion beam processing
#59System and method for generating and analyzing roughness measurements
#60Edge detection system
#61Image-forming device, and dimension measurement device
#62System and method for removing noise from roughness measurements
#63Methods and apparatus for high throughput SEM and AFM for characterization of nanostructured surfaces
#64Fiducial design for tilted or glancing mill operations with a charged particle beam
#65Multi-column spacing for photomask and reticle inspection and wafer print check verification
#66Charged particle beam apparatus, alignment method of charged particle beam apparatus, alignment program, and storage medium
#67Charged particle beam device
#68Composite charged particle beam apparatus and control method thereof
#69Scanning electron microscope
#70Device and method for analysing a defect of a photolithographic mask or of a wafer
#71Charged particle-beam device
#72Method for generating parameter pattern, ion implantation method and feed forward semiconductor manufacturing method
#73Endpointing for focused ion beam processing
#74DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD
#75Charged particle beam apparatus
#76Fiducial design for tilted or glancing mill operations with a charged particle beam
#77Method for pattern measurement, method for setting device parameters of charged particle radiation device, and charged particle radiation device
#78SECONDARY ELECTRON OPTICS AND DETECTION DEVICE
#79Using wafer geometry to improve scanner correction effectiveness for overlay control
#80Charged particle beam apparatus
#81Three-dimensional mapping using scanning electron microscope images
#82Scanning electron microscope system capable of measuring in-cell overlay offset using high-energy electron beam and method thereof
#83Charged particle beam apparatus
#84Automated slice milling for viewing a feature
#85Scanning electron microscope
#86Image-forming device, and dimension measurement device
#87Using wafer geometry to improve scanner correction effectiveness for overlay control
#88System and method of SEM overlay metrology
#89Multiple image metrology
#90Three-dimensional mapping using scanning electron microscope images
#91Sample analyzing apparatus and sample analyzing method
#92Three-dimensional mapping using scanning electron microscope images
#93METHOD OF DETERMINING THE CONCAVITY AND CONVEXITY ON SAMPLE SURFACE, AND CHARGED PARTICLE BEAM APPARATUS
#94METHOD AND SYSTEM FOR ENHANCING RESOLUTION OF A SCANNING ELECTRON MICROSCOPE
#95Pattern dimension measurement method and charged particle beam microscope used in same
#96Structure and method for determining a defect in integrated circuit manufacturing process
#97Sample surface inspection apparatus and method
#98Charged particle beam device and a method of operating a charged particle beam device
#99Automated slice milling for viewing a feature
#100Charged particle beam apparatus
#101METHOD FOR IDENTIFYING INDIVIDUAL VIRUSES IN A SAMPLE
#102Electron detection device and scanning electron microscope
#103Scanning electron microscope and method of imaging an object by using the scanning electron microscope
#104Electron beam exposure or system inspection or measurement apparatus and its method and height detection apparatus
#105Integrated circuit inspection system
#106Structure and method for determining a defect in integrated circuit manufacturing process
#107Sample dimension measuring method and scanning electron microscope
#108Electrostatic deflection control circuit and method of electronic beam measuring apparatus
#109Methods, systems and computer program products for measuring critical dimensions of fine patterns using scanning electron microscope pictures and secondary electron signal profiles
#110Scanning electron microscope and method of imaging an object by using the scanning electron microscope
#111Sample surface inspection apparatus and method
#112Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis
#113Method and apparatus for observing a specimen
#114Process monitoring system and method for processing a large number of sub-micron measurement targets
#115Electron beam exposure or system inspection or measurement apparatus and its method and height detection apparatus
#116Method and apparatus of measuring thin film sample and method and apparatus of fabricating thin film sample
#117Charged particle beam device and method for inspecting specimen
#118Pattern inspection method, pattern inspection apparatus, semiconductor device manufacturing method, and program
#119Method and apparatus of measuring pattern dimension and controlling semiconductor device process having an error revising unit
#120Pattern measuring method
#121Method and apparatus for observing a specimen
#122METHOD AND SYSTEM FOR ENHANCING RESOLUTION OF A SCANNING ELECTRON MICROSCOPE
#123Electrostatic deflection control circuit and method of electronic beam measuring apparatus
#124System and method for determining a cross sectional feature of a structural element using a reference structural element
#125Integrated circuit inspection system
#126Standard reference for metrology and calibration method of electron-beam metrology system using the same
#127Method for defect detection and process monitoring based on SEM images
#128Determining layer thickness using photoelectron spectroscopy
#129Computer program products for measuring critical dimensions of fine patterns using scanning electron microscope pictures and secondary electron signal profiles
#130Apparatus for measuring a three-dimensional shape
#131Focusing lens and charged particle beam device for titled landing angle operation
#132Process for monitoring measuring device performance
#133Electron spectroscopic metrology system
#134Method and apparatus for measuring three-dimensional shape of specimen by using SEM
#135Sample dimension measuring method and scanning electron microscope
#136Electron beam apparatus and method with surface height calculator and a dual projection optical unit
#137Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis
#138Pattern measuring method
#139Method for matching two measurement methods for measuring structure widths on a substrate
#140Image processing method, image processing apparatus and semiconductor manufacturing method
#141Standard reference for metrology and calibration method of electron-beam metrology system using the same
#142Electron beam system and electron beam measuring and observing method
#143Sample surface inspection apparatus and method
#144Method and apparatus for observing a specimen
#145Methods and systems for measuring critical dimensions of fine patterns using scanning electron microscope pictures and secondary electron signal profiles
#146Method of measuring pattern dimension and method of controlling semiconductor device process
#147Method of observing defects
#148Apparatus for inspecting three dimensional shape of a specimen and method of watching an etching process using the same
#149Systems and methods for characterizing a three-dimensional sample
#150Method and scanning electron microscope for measuring width of material on sample
#151Holes tilt angle measurement using FIB diagonal cut
#152Edge detection system