209359 ⎘
Details relating to semiconductor or other solid state devices covered by the group; Structural electrical arrangements for semiconductor devices not otherwise provided for; Impedance arrangements; High-frequency adaptations High-frequency electrical connections
Sub-classes:METHOD FOR MANUFACTURING A VERTICAL RF BIPOLAR TRANSISTOR, VERTICAL RF BIPOLAR TRANSISTOR, AND SEMICONDUCTOR DEVICE
#2INTEGRATED CIRCUIT DEVICE INCLUDING A MULTI-CHIP PACKAGE
#3VERTICAL CIRCUIT DIE WITH LATERAL SIDE METAL
#4HETEROGENEOUS INTEGRATION OF RADIO FREQUENCY TRANSISTOR CHIPLETS HAVING INTERCONNECTION TUNING CIRCUITS
#5HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
#6PACKAGE STRUCTURE HAVING AIR GAP
#7RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
#8STIFFENER MEMBER WITH ONE OR MORE VIAS
#9Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuits
#10SUPERCONDUCTING DEVICE WITH MULTIPLE THERMAL SINKS
#11MICROWAVE INTEGRATED CIRCUIT AND MANUFACTURING METHOD OF THE SAME
#12SWITCH CAPACITANCE CANCELLATION CIRCUIT
#13SEMICONDUCTOR DEVICE AND POWER AMPLIFIER INCLUDING THE SAME
#14RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A RADIO FREQUENCY SEMICONDUCTOR DEVICE
#15RADIOFREQUENCY FILTER AND MANUFACTURING METHOD THEREOF
#16SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#17Multi-component modules (MCMs) including configurable electromagnetic isolation (EMI) shield structures and related methods
#18PHASE-CHANGE MATERIAL (PCM) RADIO FREQUENCY (RF) SWITCHING DEVICE WITH AIR GAP
#19CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#20TRANSISTOR DIE WITH PRIMARY AND ANCILLARY TRANSISTOR ELEMENTS
#21ELECTRONIC CIRCUIT DEVICE
#22Semiconductor device package and method of manufacturing the same
#23Radio frequency packages containing multilevel power substrates and associated fabrication methods
#24STRUCTURE TO TRANSITION BETWEEN A TRANSMISSION LINE CONDUCTOR AND A SOLDER BALL
#25SWITCHES IN BULK SUBSTRATE
#26DUAL SIDED MOLDED PACKAGE WITH VARYING INTERCONNECT PAD SIZES AND VARYING EXPOSED SOLDERABLE AREA
#27SEMICONDUCTOR PACKAGE INCLUDING ELECTROMAGNETIC SHIELD STRUCTURE
#28SEMICONDUCTOR DEVICE
#29MULTI-FINGER RF nFET HAVING BURIED STRESSOR LAYER AND ISOLATION TRENCHES BETWEEN GATES
#30ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
#31CHIP PACKAGING STRUCTURE
#32Chip package including substrate having through hole and redistribution line
#33High performance semiconductor device
#34SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#35Switch capacitance cancellation circuit
#36Switches in bulk substrate
#37Interconnect structure for insertion loss reduction in signal transmission and method thereof
#38RADIO FREQUENCY MODULE
#39Apparatus and method for providing a scalable ball grid array (BGA) assignment and a PCB circuit trace breakout pattern for RF chip interfaces
#40Multi-component modules (MCMs) including configurable electro-magnetic isolation (EMI) shield structures, and related methods
#41Superconducting device having a plurality of thermal sink layers and a plurality of ground planes
#42Lead frame for hermetic RF chip package embedded with impedance matching function
#43Semiconductor device package and method of manufacturing the same
#44Chip package and manufacturing method thereof
#45Chip package including substrate inclined sidewall and redistribution line
#46Electronic devices including electrically insulated load electrodes
#47Spring electrode
#48High-frequency module
#49Etch barrier for microelectronic packaging conductive structures
#50Flexible impedance network system
#51Semiconductor device
#52Compensation network for high speed integrated circuits
#53Superconducting device with multiple thermal sinks
#54Integration of self-biased magnetic circulators with microwave devices
#55Interposer circuit
#56Semiconductor package, semiconductor device and method for packaging semiconductor device
#57Switching device
#58Electronic package and electronic device having the electronic package
#59Microelectronic assemblies having front end under embedded radio frequency die
#60Resistance and capacitance balancing systems and methods
#61Intra-package interference isolation
#62Thermally isolated ground planes with a superconducting electrical coupler
#63Arc-resistant crackstop
#64Device and method for manufacturing the device
#65Semiconductor package device and method of manufacturing the same
#66Radio frequency switch circuit and apparatus having built-in coupler
#67Semiconductor package device and method of manufacturing the same
#68Wireless package with antenna connector and fabrication method thereof
#69Semiconductor package integrated with memory die
#70Radio frequency switch circuit and apparatus having built-in coupler
#71Switchable die seal connection
#72Electronic device
#73CHIP CARRIER HAVING VARIABLY-SIZED PADS
#74Scattering parameter calibration to a semiconductor layer
#75Antenna assembly for wafer level packaging
#76Integrated circuit card
#77Radio frequency integrated circuit module
#78Device with a conductive feature formed over a cavity and method therefor
#79SYSTEM, APPARATUS, AND METHOD FOR SEMICONDUCTOR PACKAGE GROUNDS
#80Transmission line implementation in wafer-level packaging
#81Multiple point gas delivery apparatus for etching materials
#82SEMICONDUCTOR DEVICE
#83Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#84Integrated electronic device including an interposer structure and a method for fabricating the same
#85Apparatus and methods for reducing impact of high RF loss plating
#86Methods to fabricate a radio frequency integrated circuit
#87Apparatus and methods for reducing impact of high RF loss plating
#88Electronic components assembly
#89Magnetic integration double-ended converter
#90Apparatus and methods for reducing impact of high RF loss plating
#91Wire bond pad system and method
#92Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuits
#93Packaging of semiconductor device with antenna and heat spreader
#94Electrical-device adhesive barrier
#95Grounded die seal integrated circuit structure for RF circuits
#96Single-ended mixer with reduced loss
#97Patterned conductive epoxy heat-sink attachment in a monolithic microwave integrated circuit (MMIC)