209362 ⎘
Details relating to semiconductor or other solid state devices covered by the group; Structural electrical arrangements for semiconductor devices not otherwise provided for; Impedance arrangements; High-frequency adaptations; High-frequency electrical connections; Vertical connections, e.g. vias Coaxial feed-throughs in active or passive substrates
Vertical interconnect micro-component and method for producing a vertical interconnect micro-component
#2COAXIAL THROUGH-INSULATOR VIA (TIV) WITH LATERAL METAL FOOTING CONNECTION FOR CHIPLET POWER SIGNAL CONNECTION
#3RF COAX THROUGH GLASS VIAS
#4NOVEL POWER ARCHITECTURE WITH DUAL CORE ADVANCE SUBSTRATE
#5COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD FOR 3D INTEGRATED CIRCUITS
#6RF BRIDGE
#7SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#8AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POWER AMPLIFIER DIE
#9HYBRID CHIP CARRIER PACKAGE
#10VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
#11SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR
#12PACKAGED POWER AMPLIFIER DEVICE
#13SEMICONDUCTOR PACKAGE, BASE STATION, MOBILE DEVICE AND METHOD FOR FORMING A SEMICONDUCTOR PACKAGE
#14SEMICONDUCTOR DEVICE WITH MULTIPLE DIES
#15A MULTI-LAYERED STRUCTURE HAVING ANTIPAD FORMATIONS
#16INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS
#17INTEGRATED INTERPOSER FOR RF APPLICATION
#18ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
#19TRANSISTOR
#20Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits
#21Semiconductor devices comprising a radar semiconductor chip and associated production methods
#22ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#23ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#24POWER AMPLIFIER MODULES AND SYSTEMS CONTAINING ELECTROMAGNETIC BANDGAP ISOLATION ARRAYS
#25SEMICONDUCTOR PACKAGE STRUCTURE HAVING ANTENNA ARRAY
#26ANTENNA SUBSTRATE AND ELECTRONIC DEVICE INCLUDING THE SAME
#27WIRING BOARD AND SEMICONDUCTOR PACKAGE
#28SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#29FLIP-CHIP ENHANCED QUAD FLAT NO-LEAD ELECTRONIC DEVICE WITH CONDUCTOR BACKED COPLANAR WAVEGUIDE TRANSMISSION LINE FEED IN MULTILEVEL PACKAGE SUBSTRATE
#30FLIP-CHIP BALL GRID ARRAY-TYPE INTEGRATED CIRCUIT PACKAGE FOR VERY HIGH FREQUENCY OPERATION
#31Crosstalk cancelation structures having metal layers between signal lines semiconductor packages
#32Low capacitance through substrate via structures
#33Substrate comprising interconnects in a core layer configured for skew matching
#34Semiconductor device having integrated antenna and method therefor
#35Power amplification device
#36Interposer
#37Single layer radio frequency integrated circuit package and related low loss grounded coplanar transmission line
#38Tank circuit structure and method of making the same
#39High Density Three-dimensional Integrated Capacitors
#40Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits
#41Methods and apparatus for via last through-vias
#42Semiconductor package and method of manufacturing the same
#43Cryptographic device arranged to compute a target block cipher
#44Tank circuit structure and method of making the same
#45Semiconductor devices comprising a radar semiconductor chip and associated production methods
#46Compound via RF transition structure in a multilayer high-density interconnect
#47Low capacitance through substrate via structures
#48Electronic assembly and electronic system with impedance matched interconnect structures
#49Methods and apparatus for via last through-vias
#50Coaxial-interconnect structure for a semiconductor component
#51High density three-dimensional integrated capacitors
#52Traveling-wave switch with multiple source nodes
#53Semiconductor package and method of manufacturing the same
#54Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices
#55Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on an inter die fabric on package
#56Tile for an active electronically scanned array (AESA)
#57Electronic device package using a substrate side coaxial interface
#58Tooling for coupling multiple electronic chips
#59Embedded millimeter-wave phased array module
#60Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits
#61Low capacitance through substrate via structures
#62Electronic device, assembly and methods of manufacturing an electronic device including a vertical trench capacitor and a vertical interconnect
#63Field effect transistor having loop distributed field effect transistor cells
#64Tooling for coupling multiple electronic chips
#65High density three-dimensional integrated capacitors
#66HIGH CONDUCTIVITY HIGH FREQUENCY VIA FOR ELECTRONIC SYSTEMS
#67Tank circuit structure and method of making the same
#68Package substrate comprising capacitor, redistribution layer and discrete coaxial connection
#69Low ohmic loss radial superlattice conductors
#70Method of making a semiconductor device having a functional capping
#71High density three-dimensional integrated capacitors
#72Semiconductor device and method of manufacturing semiconductor device
#73System-in-packages having vertically-interconnected leaded components and methods for the fabrication thereof
#74Embedded millimeter-wave phased array module
#75Semiconductor device and method of fabricating the same
#76High-frequency circuit package and sensor module
#77Interlayer communications for 3D integrated circuit stack
#78Inductive capacitive structure and method of making the same
#79Multi-function and shielded 3D interconnects
#80Method for forming through-silicon via (TSV) with diffused isolation well
#81High density three-dimensional integrated capacitors
#82Transistor outline housing and method for producing same
#83Non-cylindrical conducting shapes in multilayer laminated substrate cores
#84Microelectronic assembly with impedance controlled wirebond and conductive reference element
#85Noise attenuation wall
#86High-frequency package
#87Method and design of an RF thru-via interconnect
#88High density three-dimensional integrated capacitors
#89Interlayer communications for 3D integrated circuit stack
#90Methods and apparatus for via last through-vias
#91Multilayer printed wiring board
#92Through substrate via with embedded decoupling capacitor
#93Method and structure for through-silicon via (TSV) with diffused isolation well
#94Barrier structure
#95Method of making a semiconductor device having a functional capping
#96High density three-dimensional integrated capacitors
#97Multilayer printed wiring board
#98High density three-dimensional integrated capacitors
#99Multi-function and shielded 3D interconnects
#100Through-substrate via waveguides
#101Multilevel interconnection system
#102MULTILAYER PRINTED WIRING BOARD
#103PATTERNED CONTACT
#104Inverse chip connector
#105Multimode signaling on decoupled input/output and power channels
#106Pin-type chip tooling
#107Rigid-backed, membrane-based chip tooling
#108Microwave circuit package
#109Semiconductor device providing a first electrical conductor and a second electrical conductor in one through hole and method for manufacturing the same
#110Package for housing semiconductor element and semiconductor device using the same
#111High-frequency circuit package and sensor module
#112Wiring substrate and semiconductor apparatus including the wiring substrate
#113High-frequency circuit package and sensor module
#114Contact-based encapsulation
#115Via structure integrated in electronic substrate
#116Microelectronic assembly with impedance controlled wirebond and conductive reference element
#117Method and apparatus for packaging circuit devices
#118Microelectronic assembly with impedance controlled wirebond and conductive reference element
#119Multimode signaling on decoupled input/output and power channels
#120Multilayer printed wiring board
#121Through silicon via with embedded decoupling capacitor
#122Semiconductor substrate and methods for the production thereof
#123Integrated circuit packaging system and method of manufacture thereof
#124Receive circuit for connectors with variable complex impedance
#125Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly utilizing ball grid array (BGA) technology
#126Microelectronic assembly with impedance controlled wirebond and conductive reference element
#127Coaxial through chip connection
#128Barrier structures and methods for through substrate vias
#129Electrically shielded through-wafer interconnect
#130Method of stacking semiconductor chips including forming an interconnect member and a through electrode
#131Ultra wideband system-on-package
#132MICROPACKAGING METHOD AND DEVICES
#133SHIELDED WIREBOND
#134Multimode signaling on decoupled input/output and power channels
#135TRENCH ISOLATION FOR REDUCED CROSS TALK
#136Low Inductance Ball Grid Array Device Having Chip Bumps on Substrate Vias
#137Multilayer printed wiring board
#138Method and apparatus for packaging circuit devices
#139Chip carrier and fabrication method
#140Vertical transitions, printed circuit boards therewith and semiconductor packages with the printed circuit boards and semiconductor chip
#141Ceramic substrate grid structure for the creation of virtual coax arrangement
#142Ceramic substrate grid structure for the creation of virtual coax arrangement
#143Multilayer printed wiring board
#144LOW LOSS RADIO FREQUENCY SIGNAL COMMUNICATION WITHIN A PACKAGE, A BOARD AND/OR A WAVE GUIDE
#145Method for forming a packaged semiconductor device
#146Optoelectronic device chip having a composite spacer structure and method making same
#147Packaging methods for imager devices
#148Embedded waveguide and embedded electromagnetic shielding
#149STRESS AND COLLAPSE RESISTANT INTERCONNECT FOR MOUNTING AN INTEGRATED CIRCUIT PACKAGE TO A SUBSTRATE
#150Flip chip shielded RF I/O land grid array package
#151Ceramic substrate grid structure for the creation of virtual coax arrangement
#152Method manufacturing wiring substrate
#153Vertical electrical device
#154Via structure
#155Shielding noisy conductors in integrated passive devices
#156Chip carrier and fabrication method
#157Optoelectronic device chip having a composite spacer structure and method making same
#158Through substrate, interposer and manufacturing method of through substrate
#159Chip carrier and fabrication method
#160POWER SUPPLY STRUCTURE FOR HIGH POWER CIRCUIT PACKAGES
#161RF and MMIC stackable micro-modules
#162Shielded through-via
#163Facility and method for high-performance circuit board connection
#164CHIP CONNECTOR
#165Tooling for coupling multiple electronic chips
#166Back-to-front via process
#167Packaged chip having features for improved signal transmission on the package
#168Coaxial through chip connection
#169Semiconductor device and method of manufacturing the same
#170Pin-type chip tooling
#171Lead pin, circuit, semiconductor device, and method of forming lead pin
#172Integrated circuit with improved component interconnections
#173Integrated circuit arrangement having a plurality of conductive structure levels and capacitor, and a method for producing the integrated circuit arrangement
#174Surface level control systems and material recycling systems for use with programmable material consolidation apparatus
#175Optical module with can package
#176Integrated conductor arrangement and corresponding production method
#177OPTIMIZATION OF THROUGH PLANE TRANSITIONS
#178System, method and apparatus for routing signals from an integrated circuit using thickfilm and printed circuit interconnects
#179Coaxial through chip connection
#180Post-attachment chip-to-chip connection
#181Rigid-backed, membrane-based chip tooling
#182Through chip connection
#183Inverse chip connector
#184Chip connector
#185Profiled contact
#186Patterned contact
#187Contact-based encapsulation
#188Membrane-based chip tooling
#189High-frequency semiconductor device and method of manufacturing the same
#190Shielding noisy conductors in integrated passive devices
#191Multilayer printed wiring board
#192Multilayer printed wiring board
#193Ball coax interconnect
#194Suspended transmission line structures in back end of line processing
#195Semiconductor device with micro connecting elements and method for producing the same
#196High frequency conductors for packages of integrated circuits
#197Electronic device, assembly and methods of manufacturing an electronic device including a vertical trench capacitor and a vertical interconnect
#198Multi-layer printed circuit board comprising a through connection for high frequency applications
#199Radio frequency (RF) circuit board topology
#200Radar-transceiver for microwave and millimetre applications
#201Surface-mounted microwave package and corresponding mounting with a multilayer circuit
#202Method for shielding printed circuit board circuits
#203Insulative coatings for apertures of semiconductor device components and semiconductor device components including insulative coatings
#204Semiconductor device providing a first electrical conductor and a second electrical conductor in one through hole and method for manufacturing the same
#205Systems for forming insulative coatings for via holes in semiconductor devices
#206Method of forming suspended transmission line structures in back end of line processing
#207Radio frequency (RF) circuit board topology
#208Wiring substrate, manufacturing method thereof, and semiconductor device
#209RF and MMIC stackable micro-modules
#210Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same
#211Circuit device
#212Stereolithographic method for forming insulative coatings for via holes in semiconductor devices
#213Semiconductor package structure and method for manufacturing the same
#214Circuit component built-in module and method for manufacturing the same
#215High frequency laminated component and its manufacturing method
#216Low cost millimeter wave integrated LTCC package and method of manufacturing
#217Coaxial connector feed-through for multi-level interconnected semiconductor wafers
#218Silicon transformer balun
#219Embedded coaxial wire and method of manufacture