209364 ⎘
Details relating to semiconductor or other solid state devices covered by the group; Structural electrical arrangements for semiconductor devices not otherwise provided for; Impedance arrangements; High-frequency adaptations; High-frequency electrical connections; Waveguides, e.g. microstrip line, strip line, coplanar line Transition between different waveguide types
METHOD OF FABRICATING A FLIP-CHIP ENHANCED QUAD FLAT NO-LEAD ELECTRONIC DEVICE WITH CONDUCTOR BACKED COPLANAR WAVEGUIDE TRANSMISSION LINE FEED IN MULTILEVEL PACKAGE SUBSTRATE
#2SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNELS AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
#3STRIPLINE MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) INTERCONNECT ON RECESSED LOW TEMPERATURE CO-FIRED CERAMIC (LTCC)
#4Integrated Waveguides for Semiconductor Technology
#5Interposers with Millimeter-Wave Transitions
#6SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL SUBSTRATE INTEGRATED WAVEGUIDE TRANSITION AND HORIZONTAL GROUNDED COPLANAR WAVEGUIDE TRANSITION
#7MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL WAVEGUIDE TRANSITION
#8Semiconductor devices comprising a radar semiconductor chip and associated production methods
#9SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNELS AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
#10FLIP-CHIP ENHANCED QUAD FLAT NO-LEAD ELECTRONIC DEVICE WITH CONDUCTOR BACKED COPLANAR WAVEGUIDE TRANSMISSION LINE FEED IN MULTILEVEL PACKAGE SUBSTRATE
#11Microwave integrated circuit
#12Display device and method for manufacturing display device
#13Antenna apparatus with integrated antenna array and low loss multi-layer interposer
#14Fan-out transition structure for transmission of mm-Wave signals from IC to PCB via chip-scale packaging
#15Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structure
#16Microwave integrated circuit
#17Package with side-radiating wave launcher and waveguide
#18Semiconductor devices comprising a radar semiconductor chip and associated production methods
#19RF power amplifier pallet
#20Display device and method for manufacturing display device
#21Packaging structure comprising at least one transition forming a contactless interface
#22Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structure
#23Circularly-polarized dielectric waveguide launch for millimeter-wave data communication
#24High frequency module
#25Scalable phased array package
#26Scalable phased array package
#27HIGH-FREQUENCY AMPLIFIER UNIT AND HIGH-FREQUENCY POWER AMPLIFICATION APPARATUS
#28WAVEGUIDE DEVICE MODULE AND MICROWAVE MODULE
#29Transition arrangement comprising a contactless transition or connection between an SIW and a waveguide or an antenna
#30Wireless interconnects on flexible cables between computing platforms
#31Extremely High Frequency Electronic Component
#32Waveguide and semiconductor packaging
#33Method of manufacturing a package for embedding one or more electronic components
#34Package structure including a package substrate having an integrated waveguide coupled to first and second integrated circuits, where the package substrate is mounted to an application board
#35Waveguide including first and second metal plates and having a slotted feed to waveguide transition disposed in the first metallic plate
#36Semiconductor wafer including an integrated waveguide for communicating signals between first and second integrated circuit dies
#37High-frequency semiconductor amplifier
#38High-frequency semiconductor amplifier
#39Method for manufacturing a waveguide including a semi-conducting junction
#40Millimeter wave bands semiconductor package
#41Millimeter wave bands semiconductor package
#42On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures
#43Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system
#44Integrated-circuit module with waveguide transition element
#45Waveguide and semiconductor packaging
#46High frequency high isolation multichip module hybrid package
#47Electronic package for millimeter wave semiconductor dies
#48High frequency transition matching in an electronic package for millimeter wave semiconductor dies
#49Surface mountable microwave signal transition block for microstrip to perpendicular waveguide transition
#50Coplaner waveguide transition
#51Package and high frequency terminal structure for the same
#52Microelectronic assembly with an embedded waveguide adapter and method for forming the same
#53Method of manufacturing a package for embedding one or more electronic components
#54System and method for integrated waveguide packaging
#55Package and high frequency terminal structure for the same
#56High frequency amplifier
#57Transition from a chip to a waveguide port
#58High-frequency circuit package and high-frequency circuit device
#59Package for housing semiconductor element and semiconductor device using the same
#60Integrated antenna and chip package and method of manufacturing thereof
#61Microelectronic assembly with an embedded waveguide adapter and method for forming the same
#62High frequency amplifier
#63Microwave module
#64SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM
#65Simple radio frequency integrated circuit (RFIC) packages with integrated antennas
#66High-frequency circuit board, high-frequency circuit module, and radar apparatus
#67Integrated high performance package systems for mm-wave array applications
#68Integrated antenna and chip package and method of manufacturing thereof
#69System and method for integrated waveguide packaging
#70Multilayer dielectric substrate and semiconductor package
#71Memory Packages Having Stair Step Interconnection Layers
#72Microwave communication package
#73Low-loss interface
#74Tapered dielectric and conductor structures and applications thereof
#75Semiconductor chip mounting board with multiple ports
#76Millimeter waveband transceiver, radar and vehicle using the same
#77High frequency line-to-waveguide converter and high frequency package
#78Multilayer dielectric substrate and semiconductor package
#79Thickness tapered substrate launch
#80Memory packages having stair step interconnection layers
#81High-frequency circuit
#82Integrated circuit and method for manufacturing same
#83Tapered dielectric and conductor structures and applications thereof
#84Method of fabricating the routing of electrical signals