209370 ⎘
Details relating to semiconductor or other solid state devices covered by the group; Structural electrical arrangements for semiconductor devices not otherwise provided for; Impedance arrangements; High-frequency adaptations for passive devices for decoupling, e.g. bypass capacitors
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE
#2NOVEL POWER ARCHITECTURE WITH DUAL CORE ADVANCE SUBSTRATE
#3BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
#4CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH-SPEED SIGNALS
#5THREE DIMENSIONAL METAL INSULATOR METAL CAPACITOR STRUCTURE
#6CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE
#7POWER MODULE, POWER CONVERSION DEVICE, AND VEHICLE
#8Chip-On-Wafer Assembly Containing A Decoupling Capacitor
#9ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE
#10MULTI CHIP FRONT END MODULE WITH SHIELDING VIAS
#11Cantilevered power planes to provide a return current path for high-speed signals
#12Capacitor die embedded in package substrate for providing capacitance to surface mounted die
#13Bonded structures with integrated passive component
#14DEEP TRENCH CAPACITOR (DTC) REGION IN SEMICONDUCTOR PACKAGE
#15Monolithic multi-I region diode limiters
#16Three dimensional metal insulator metal capacitor structure
#17Electronic package with rotated semiconductor die
#18Capacitor die embedded in package substrate for providing capacitance to surface mounted die
#19Interposer
#20Monolithic multi-I region diode limiters
#21Mitigating thermal-mechanical strain and warpage of an organic laminate substrate
#22MICROWAVE DEVICE AND ANTENNA
#23Interconnect Structure for High Power GaN Module
#24Three dimensional metal insulator metal capacitor structure
#25Electronic device with an integral filtering component
#26THROUGH-BOARD DECOUPLING CAPACITANCE ARRANGEMENTS FOR INTEGRATED CIRCUIT DEVICES
#27Through-board power control arrangements for integrated circuit devices
#28DECOUPLING CAPACITANCE ARRANGEMENTS FOR INTEGRATED CIRCUIT DEVICES
#29Electronic package with rotated semiconductor die
#30High speed semiconductor chip stack
#31Semiconductor package
#32Channel loss compensation circuits
#33Monolithic multi-I region diode limiters
#34High cutoff frequency metal-insulator-metal capacitors implemented using via contact configurations
#35High power radio frequency amplifiers and methods of manufacture thereof
#36High power radio frequency amplifiers and methods of manufacture thereof
#37Stacked capacitors for use in integrated circuit modules and the like
#38Electronic device and method of manufacturing the same
#39Power module
#40Semiconductor package with in-package compartmental shielding and fabrication method thereof
#41Additive deposition low temperature curable magnetic interconnecting layer for power components integration
#42Circuit system having compact decoupling structure
#43On-chip power supply noise suppression through hyperabrupt junction varactors
#44Ultra-low profile package shielding technique using magnetic and conductive layers for integrated switching voltage regulator
#45Capacitor die embedded in package substrate for providing capacitance to surface mounted die
#46Vertical electrode decoupling/bypass capacitor
#47Channel loss compensation circuits
#48Vertical capacitors for microelectronics
#49And placement of de-coupling capacitors for PDN design
#50CIRCUIT SYSTEM HAVING COMPACT DECOUPLING STRUCTURE
#51Semiconductor device, semiconductor device manufacturing method, and electronic device
#52Orthogonal transistor layouts
#53Capacitor and board having the same
#54Guard bond wires in an integrated circuit package
#55High speed semiconductor chip stack
#56Microwave module
#57Housing for a high-frequency chip
#58Bonded structures with integrated passive component
#59Integrated circuit devices with selectively arranged through substrate vias and method of manufacture thereof
#60Integrated circuit chip with molding compound handler substrate and method
#61Component carrier with a bypass capacitance comprising dielectric film structure
#62Transistor layout with low aspect ratio
#63SEMICONDUCTOR MEMORY DEVICE INCLUDING POWER DECOUPLING CAPACITOR
#64Electronic device, assembly and methods of manufacturing an electronic device including a vertical trench capacitor and a vertical interconnect
#65INTEGRATED CIRCUIT STRUCTURES WITH INTERPOSERS HAVING RECESSES
#66Flip-chip employing integrated cavity filter, and related components, systems, and methods
#67Impedance matching configuration
#68Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof
#69Multilayer wiring board
#70Method of density-controlled floorplan design for integrated circuits and integrated circuits
#71DECOUPLING CAPACITOR FOR SEMICONDUCTORS
#72Semiconductor socket with direct selective metalization
#73Noise decoupling structure with through-substrate vias
#74SEMICONDUCTOR DEVICE INCLUDING DECOUPLING CAPACITOR AND METHOD OF FORMING THE SAME
#75Metal trench decoupling capacitor structure penetrating through a shallow trench isolation
#76DE-POP ON-DEVICE DECOUPLING FOR BGA
#77Resonant clocking for three-dimensional stacked devices
#78Amplifier circuits
#79Photovoltaic device and method of manufacturing the same
#80Miniature passive structures for ESD protection and input and output matching
#81Integrated circuit chip using top post-passivation technology and bottom structure technology
#82De-pop on-device decoupling for BGA
#83Semiconductor device and wiring board
#84Power transistor output match network with high Q RF path and low Q low frequency path
#85Semiconductor device for smoothing the voltage of the end face of a drain of a high frequency semiconductor chip
#86Noise decoupling structure with through-substrate vias
#87Stacked multi-chip
#88Integrated circuit chip using top post-passivation technology and bottom structure technology
#89Electronic device, assembly and methods of manufacturing an electronic device including a vertical trench capacitor and a vertical interconnect
#90Flip-chip employing integrated cavity filter, and related components, systems, and methods