PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A PASSIVATION LAYER

PACKAGE STRUCTURE

Semiconductor structure

Semiconductor structure having an anti-arcing pattern disposed on a passivation layer

Package structure having at least one die with a plurality of taper-shaped die connectors

Semiconductor device

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE

Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing pattern

Semiconductor structure and forming method therefor

Package structure having taper-shaped conductive pillar and method of forming thereof

Package with metal-insulator-metal capacitor and method of manufacturing the same

Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure

Integrated circuit packages and methods for forming the same

Package with metal-insulator-metal capacitor and method of manufacturing the same

Package with metal-insulator-metal capacitor and method of manufacturing the same

Corrosion resistant aluminum bond pad structure

Non-destructive testing of integrated circuit chips

NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS

High bandwidth memory (HBM) bandwidth aggregation switch

Integrated circuit packages and methods for forming the same

Semiconductor device and ball bonder

Pad structure and integrated circuit die using the same

Package with metal-insulator-metal capacitor and method of manufacturing the same

Corrosion resistant aluminum bond pad structure

Integrated circuit packages and methods for forming the same

Interconnection structure with confinement layer

Corrosion resistant aluminum bond pad structure

Mounting structure of semiconductor device and method of manufacturing the same

SEMICONDUCTOR LIGHT-EMITTING DEVICE AND SEMICONDUCTOR LIGHT-EMITTING APPARATUS HAVING THE SAME

Integrated circuit packages and methods for forming the same

Metallized electric component

Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device

Integrated circuit chip and fabrication method

Semiconductor packaging structure and manufacturing method for the same

Interconnection structure with confinement layer

Through silicon via with embedded barrier pad

Semiconductor device having conductive pads and a method of manufacturing the same

Devices for metallization

Mounting structure of semiconductor device and method of manufacturing the same

Backside processing of semiconductor devices

Integrated circuit packages and methods for forming the same

Package with metal-insulator-metal capacitor and method of manufacturing the same

Through silicon via with embedded barrier pad

Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof

Power semiconductor device module

Method for manufacturing fine-pitch bumps and structure thereof

Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation

Joint structure for substrates and methods of forming

Semiconductor device and method of forming compliant conductive interconnect structure in flipchip package

Wire Bonding Structures for Integrated Circuits

SEMICONDUCTOR PACKAGE HAVING PROTECTIVE LAYER AND METHOD OF FORMING THE SAME

Structures and methods for detecting solder wetting of pedestal sidewalls

Mechanisms for controlling bump height variation

Enhanced flip chip structure using copper column interconnect

Semiconductor package with integrated selectively conductive film interposer

Semiconductor device and method of manufacturing semiconductor device

Circuit board component shim structure

Semiconductor devices including protected barrier layers

Semiconductor device having shielded conductive vias

Device having electrodes formed from bumps with different diameters

Die power structure

Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing method

Packaging methods and structures using a die attach film

Pillar structure having a non-planar surface for semiconductor devices

Chip package and method for making same

Lead assembly for a flip-chip power switch

Routing layer for mitigating stress in a semiconductor die

Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device

Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking

Universal inter-layer interconnect for multi-layer semiconductor stacks

Bump-on-trace (BOT) structures

Semiconductor Device and Method of Forming a Wafer Level Package Structure Using Conductive Via and Exposed Bump

Semiconductor device

Recovery method for poor yield at integrated circuit die panelization

BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS

Electrical connection for multichip modules

Multilayer pillar for reduced stress interconnect and method of making same

Stacked memory module and system

Construction of reliable stacked via in electronic substrates—vertical stiffness control method

BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

SEMICONDUCTOR CHIP MODULE AND PLANAR STACK PACKAGE HAVING THE SAME

Package-on-package assembly with wire bonds to encapsulation surface

Vertical power transistor die packages and associated methods of manufacturing

Clustered stacked vias for reliable electronic substrates

Semiconductor device and method for manufacturing the same

Cover tape, method for manufacturing cover tape, and electronic part package

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Integrated circuit device including a copper pillar capped by barrier layer

Flip-chip Mounting Structure and Flip-chip Mounting Method

Package structure having embedded electronic component and fabrication method thereof

SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME

Reduced-stress bump-on-trace (BOT) structures

Integrated circuit chip package and manufacturing method thereof

Multi-die packages incorporating flip chip dies and associated packaging methods

Etchant and method for manufacturing semiconductor device using same

Routing layer for mitigating stress in a semiconductor die

STRUCTURE FOR MEASURING BUMP RESISTANCE AND PACKAGE SUBSTRATE COMPRISING THE SAME

Hybrid TSV and method for forming the same

Microelectronic devices with through-silicon vias and associated methods of manufacturing

Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor device

Sensor mounted in flip-chip technology on a substrate

LIGHT-EMITTING DIODE DIE PACKAGES AND ILLUMINATION APPARATUSES USING SAME

Light-emitting diode die packages and illumination apparatuses using same

Construction of reliable stacked via in electronic substrates—vertical stiffness control method

Method of manufacturing power module substrate and power module substrate

Method of assembling semiconductor device including insulating substrate and heat sink

MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES

Heat radiator and manufacturing method thereof

Contact and contactless differential I/O pads for chip-to-chip communication and wireless probing

SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION

Chip package and manufacturing method thereof

Light-emitting diode die packages and illumination apparatuses using same

Etchant and method for manufacturing semiconductor device using same

ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE, AND CONNECTING METHOD

Semiconductor device and method for fabricating the same

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

Copper post solder bumps on substrate

Semiconductor device manufacturing apparatus and method for manufacturing semiconductor device

Stacked package, method of fabricating stacked package, and method of mounting stacked package fabricated by the method

Via network structures and method therefor

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS

Semiconductor device having plural stacked chips

SEMICONDUCTOR APPARATUS FOR PREVENTING CROSSTALK BETWEEN SIGNAL LINES

Flip chip semiconductor device

Integrated circuit packaging system with filled vias and method of manufacture thereof

Integrated circuit packaging system with interconnects and method of manufacture thereof

Integrated circuit packaging system with lead frame etching and method of manufacture thereof

Semiconductor device, method of manufacturing the same, and method of manufacturing wiring board

Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEVELING STANDOFF AND METHOD OF MANUFACTURE THEREOF

IC wafer having electromagnetic shielding effects and method for making the same

Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die

Approach for bonding dies onto interposers

DEVICE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

ULTRAVIOLET (UV)-REFLECTING FILM FOR BEOL PROCESSING

Semiconductor apparatus including a metal alloy between a first contact and a second contact

Semiconductor apparatus and method for manufacturing the same

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM USING THE SAME

Power semiconductor device

Substrate for mounting semiconductor chip and method for producing same

DIE-BONDING FILM AND USE THEREOF

Method of manufacturing film for semiconductor device

Dicing film with protecting film

Carrier-free semiconductor package

Package structure, fabricating method thereof, and package-on-package device thereby

Semiconductor device and method for manufacturing semiconductor device

STACKED DIE POWER CONVERTER

Carrier structure and manufacturing method thereof

Conductive metal ink composition and method for forming a conductive pattern

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF

Co-axial restraint for connectors within flip-chip packages

SEMICONDUCTOR PACKAGE INCLUDING CONNECTING MEMBER HAVING CONTROLLED CONTENT RATIO OF GOLD

Solder ball for semiconductor packaging and electronic member using the same

Semiconductor device and method of forming vertical interconnect structure between semiconductor die and substrate

MOUNTING DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE

Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer

Extending metal traces in bump-on-trace structures

Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bump

Electrical component having an electrical connection arrangement and method for the manufacture thereof

Semiconductor device, manufacturing method of semiconductor device, and power source device

CHIP MODULE AND METHOD FOR PROVIDING A CHIP MODULE

Anchoring structure and intermeshing structure

WAFER CHIP SCALE PACKAGE CONNECTION SCHEME

Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device

Pyramid bump structure

BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME

Semiconductor package and method for manufacturing the same

Semiconductor chip with graphene based devices in an interconnect structure of the chip

METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

Elongated bump structure for semiconductor devices

UNIVERSAL INTER-LAYER INTERCONNECT FOR MULTI-LAYER SEMICONDUCTOR STACKS

3D integrated circuit with logic

Solder, soldering method, and semiconductor device

Semiconductor device, method of manufacturing semiconductor device, and electronic device

CUSTOMIZED RF MEMS CAPACITOR ARRAY USING REDISTRIBUTION LAYER

Pad bonding employing a self-aligned plated liner for adhesion enhancement

Contact Arrangement For Establishing A Spaced, Electrically Conducting Connection Between Microstructured Components

Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices

Method of making an electronic device having a liquid crystal polymer solder mask and related devices

Shared Electrostatic Discharge Protection For Integrated Circuits, Integrated Circuit Assemblies And Methods For Protecting Input/Output Circuits

Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties

Method and device for routing over a void for high speed signal routing in electronic systems

Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device

Packaging substrate with conductive structure

Chip package and method for forming the same

Package carrier and manufacturing method thereof

Multilayer pillar for reduced stress interconnect and method of making same

METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD

Selective Deposition in the Fabrication of Electronic Substrates

Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting device

Integrated circuit chip and fabrication method

Substrate structure including functional region and method for transferring functional region

Method of manufacturing semiconductor device

HYDROCARBON ADHESIVE COMPOSITION AND METHOD FOR TREATING SUBSTRATE SURFACE USING SAME

Substrate assembly provided with capacitive interconnections, and manufacturing method thereof

CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDER BUMP CONTACTS

Through hole via filling using electroless plating

FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package and method of manufacturing the same

LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

Methods and Structures Involving Terminal Connections

Die power structure

Stacked device identification assignment

Semiconductor device and assembling method thereof

Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same

SUBSTRATE FOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Template wafer and process for small pitch flip-chip interconnect hybridization

NON-SOLDER METAL BUMPS TO REDUCE PACKAGE HEIGHT

Method and apparatus of fabricating a pad structure for a semiconductor device

CONDUCTIVE ADHESIVE TAPE

Semiconductor package and manufacturing method therefor

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor devices and methods of manufacturing semiconductor devices

Semiconductor package and package on package having the same

Method of assembling two integrated circuits and corresponding structure

LEAD PIN FOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE PRINTED CIRCUIT BOARD INCLUDING THE SAME

Package structure

Bump structure and manufacturing method thereof

Method of manufacturing non-leaded package structure

Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure

Integrated circuit chip and fabrication method

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

High performance low profile QFN/LGA

Integrated circuit packaging system with multiple row leads and method of manufacture thereof

Top exposed package and assembly method

Semiconductor device and method of forming recesses in substrate for same size or different sized die with vertical integration

Chip package and method for forming the same

Brace for long wire bond

Roller microcontact printing device and printing method thereof

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE

PRINTED CIRCUIT BOARD (PCB) ASSEMBLY WITH ADVANCED QUAD FLAT NO-LEAD (A-QFN) PACKAGE

Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE USING THE CHIP

Laminated transferable interconnect for microelectronic package

Methods for transferring heat from stacked microfeature devices

Mechanisms for resistivity measurement of bump structures

Semiconductor chip and solar system

Fin fabrication process for entrainment heat sink

HEATING SPREADING ELEMENT WITH ALN FILM AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die

PACKAGE CARRIER

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Semiconductor device and method of manufacturing the same

Semiconductor package and semiconductor system including the same

Semiconductor device

SEMICONDUCTOR APPARATUS

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DEVICE MOUNT AND METHOD OF MANUFACTURE THEREOF

PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND ELECTRONIC PARTS CONNECTION METHOD USING SAME

Light emitting device with electrode having recessed concave portion

Semiconductor devices and methods of manufacturing the same

Electroplated posts with reduced topography and stress

SEMICONDUCTOR DEVICE

THERMOSETTING ADHESIVE TAPE OR SHEET, AND FLEXIBLE PRINTED CIRCUIT BOARD

HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Substrate Structure Having Buried Wiring And Method For Manufacturing The Same, And Semiconductor Device And Method For Manufacturing The Same Using The Substrate Structure

Encapsulating method for sealed and water-proof LED and luminescent holder

ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAGNETIC NANO-PARTICLES

Power module using sintering die attach and manufacturing method thereof

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHODS THEREOF

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

Through level vias and methods of formation thereof

Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device

Approach for bonding dies onto interposers

Mounting structure of electronic component

Chip Package

METHOD OF MANUFACTURING METAL BASE PACKAGE WITH VIA

Semiconductor device and method of forming the same

VERTICAL ELECTRODE STRUCTURE USING TRENCH AND METHOD FOR FABRICATING THE VERTICAL ELECTRODE STRUCTURE

METHOD FOR PACKAGING A SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

Integrated circuit package and physical layer interface arrangement

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME

Light emitting device and method for manufacturing same

Semiconductor chip having different pad width to UBM width ratios and method of manufacturing the same

Under-bump metallization (UBM) structure and method of forming the same

Semiconductor package

Elastic encapsulated carbon nanotube based electrical contacts

Cost-effective TSV formation

Methods of forming a semiconductor package using a seed layer and semiconductor packages formed using the same

Electronic assemblies and methods of forming electronic assemblies

Method of Contacting a Semiconductor Substrate

Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element

Conductive adhesive, and circuit board and electronic component module using the same

Semiconductor device and method for manufacturing the same

Wire bond through-via structure and method

ELECTRICAL CONTACT STRUCTURES SUITABLE FOR USE ON WAFER TRANSLATORS AND METHODS OF MAKING SAME

Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate

Semiconductor device having metal posts non-overlapping with other devices and layout method of semiconductor device

Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking

Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting

Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma Process

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor apparatus

Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method