209546 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas; Structure Bonding areas having different sizes, e.g. different heights or widths
Semiconductor device
#1202Electronic system with expansion feature
#1203Semiconductor chip module, semiconductor package having the same and package module
#1204Multi chip module, method for operating the same and DC/DC converter
#1205Stacked half-bridge package with a common conductive leadframe
#1206Device including two mounting surfaces
#1207RF power amplifier
#1208Semiconductor device having separated heatsink and chip mounting portion
#1209Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus
#1210Chip-exposed semiconductor device
#1211Semiconductor Package with Reduced On-Resistance and Top Metal Spreading Resistance with Application to Power Transistor Packaging
#1212High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistor
#1213High power semiconductor package with conductive clips and flip chip driver IC
#1214High power semiconductor package with multiple conductive clips
#1215High power semiconductor package with conductive clip on multiple transistors
#1216High power semiconductor package with conductive clip
#1217Method of making a copper wire bond package
#1218Power semiconductor device package method
#1219Semiconductor device package
#1220BALL GRID ARRAY METHOD AND STRUCTURE
#1221Dual-leadframe multi-chip package and method of manufacture
#1222Power semiconductor module
#1223Monolithic IGBT and diode structure for quasi-resonant converters
#1224Semiconductor power device having a super-junction structure
#1225Light-emitting diode die package and method for producing same
#1226Light-emitting diode die package and method for producing same
#1227Die package
#1228Simultaneous wafer bonding and interconnect joining
#1229Method for chip scale package and package structure thereof
#1230SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1231Method for fabricating semiconductor device
#1232Electronic assemblies including mechanically secured protruding bonding conductor joints
#1233Semiconductor device for battery power voltage control
#1234Semiconductor device including a DC-DC converter with schottky barrier diode
#1235Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections
#1236Top exposed package and assembly method
#1237Die arrangement and method of forming a die arrangement
#1238Semiconductor device having a gate recess structure
#1239Vertical LED with current-guiding structure
#1240Semiconductor apparatus having fluorine containing region formed in recessed portion of semiconductor layer
#1241Insulated gate type semiconductor device and method for fabricating the same
#1242Semiconductor device including a DC-DC converter
#1243Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
#1244Semiconductor device and a method of manufacturing the same
#1245PRESSURE SENSOR AND METHOD OF PACKAGING SAME
#1246Insulated gate type semiconductor device and method for fabricating the same
#1247SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF
#1248Clip interconnect with encapsulation material locking feature
#1249Semiconductor device
#1250Semiconductor device and method of manufacturing semiconductor device
#1251Semiconductor device
#1252SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#1253Multi-chip module
#1254Semiconductor device having conductive vias and semiconductor package having semiconductor device
#1255PACKAGE STRUCTURE
#1256Solder mold plates used in packaging process and method of manufacturing solder mold plates
#1257Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
#1258Power semiconductor module
#1259Dual lead frame semiconductor package and method of manufacture
#1260SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#1261Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same
#1262Electronic component and electronic device
#1263Contact pad array
#1264Semiconductor device and method for manufacturing the same
#1265Substrateless power device packages
#1266POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE
#1267HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS
#1268WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME
#1269Package-based filtering and matching solutions
#1270SEMICONDUCTOR DEVICE AND POWER SUPPLY APPARATUS
#1271Semiconductor chip having different pad width to UBM width ratios and method of manufacturing the same
#1272Manufacturing of a device including a semiconductor chip
#1273ESD DEVICE AND METHOD
#1274Manufacturing method of semiconductor device
#1275MULTI-CHIP PACKAGE
#1276Multi-chip semiconductor packages and assembly thereof
#1277Semiconductor device
#1278Module with silicon-based layer
#1279SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE
#1280Semiconductor device and method for manufacturing the same
#1281Tape package
#1282Semiconductor device with parasitic bipolar transistor
#1283Integrated power converter package with die stacking
#1284Connector assembly and method of manufacture
#1285Copper bonding compatible bond pad structure and method
#1286SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE DIES AND A COMMON NODE STRUCTURE
#1287Semiconductor component and method of manufacture
#1288Semiconductor module and method for production thereof
#1289Package structure for DC-DC converter
#1290Power semiconductor package
#1291Control device of semiconductor device
#1292Semiconductor device integrated with converter and package structure thereof
#1293Package substrate having main dummy pattern located in path of stress
#1294Semiconductor device
#1295Semiconductor package for forming a leadframe package
#1296Semiconductor device
#1297Semiconductor device and method of manufacturing the same, and power supply apparatus
#1298Method of manufacturing semiconductor package
#1299Semiconductor device production method and semiconductor device
#1300Seal ring structure with metal pad
#1301Power semiconductor chip with a formed patterned thick metallization atop
#1302Equal Potential Ring Structures of Power Semiconductor with Trenched Contact
#1303Method for forming a patterned thick metallization atop a power semiconductor chip
#1304SEMICONDUCTOR DEVICE
#1305Self-aligning structures and method for integrated chips
#1306Compact semiconductor package with integrated bypass capacitor
#1307Alpha particle blocking wire structure and method fabricating same
#1308Drive controller
#1309Solder interconnect on IC chip
#1310Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces
#1311Semiconductor encapsulation and method thereof
#1312Semiconductor element with semiconductor die and lead frames
#1313Wafer level chip scale package
#1314Power semiconductor device
#1315Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same
#1316Semiconductor device
#1317Semiconductor device for driving electric motor
#1318Insulated gate type semiconductor device and method for fabricating the same
#1319Semiconductor device and power supply device using the same
#1320Power module
#1321Power module
#1322Method for manufacturing semiconductor devices having a metallisation layer
#1323Method for manufacturing semiconductor devices having a glass substrate
#1324Semiconductor device
#1325THERMAL FLEX CONTACT CARRIERS #2
#1326Semiconductor device
#1327Light emitting diode, light emitting diode lamp and illuminating device
#1328Internal packaging of a semiconductor device mounted on die pads
#1329Package for high power devices
#1330Semiconductor package with an embedded printed circuit board and stacked die
#1331Semiconductor module and method of manufacturing the same
#1332Semiconductor device attached to island having protrusion
#1333Wafer scale package for high power devices
#1334LIGHT-EMITTING DIODE AND LIGHT-EMITTING DIODE LAMP
#1335Power semiconductor device and power conversion device
#1336Electronic circuit and semiconductor arrangement with a load, a sense and a start-up transistor
#1337Electrode pad having a recessed portion
#1338Combined packaged power semiconductor device
#1339Power supply circuit having a semiconductor device including a MOSFET and a Schottky junction
#1340High power and high temperature semiconductor power devices protected by non-uniform ballasted sources
#1341Semiconductor device
#1342Fabrication method of leadframe-based semiconductor package
#1343POWER SEMICONDUCTOR SYSTEM
#1344Semiconductor component and method of manufacture
#1345Three-dimensional semiconductor device structures and methods
#1346Method for manufacturing a semiconductor component and structure therefor
#1347Electronic device and method for connecting a die to a connection terminal
#1348Semiconductor device with substrate-side exposed device-side electrode and method of fabrication
#1349Semiconductor module with electrical switching elements
#1350Semiconductor light receiving device with an off-centered light receiving part
#1351Sintering silver paste material and method for bonding semiconductor chip
#1352Semiconductor module device and driving apparatus having the same
#1353Semiconductor module device and driving apparatus having the same
#1354Substrate contact opening
#1355Chip-exposed semiconductor device and its packaging method
#1356Semiconductor device including external connection pads and test pads
#1357Semiconductor Package
#1358Stacked-die package for battery power management
#1359Power Electronic Device Package
#1360Semiconductor Device with Circuit for Reduced Parasitic Inductance
#1361Semiconductor device
#1362Pre-molded clip structure
#1363Stackable power MOSFET, power MOSFET stack, and process of manufacture
#1364MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE CONTAINING STACKED SEMICONDUCTOR CHIPS
#1365Power switch component having improved temperature distribution
#1366Semiconductor on semiconductor substrate multi-chip-scale package
#1367Power semiconductor device packaging
#1368Semiconductor package structure and package process
#1369Method of manufacturing semiconductor apparatus
#1370RF power amplifier
#1371Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress
#1372PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
#1373ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE
#1374Monolithic semiconductor switches and method for manufacturing
#1375Semiconductor device and manufacturing method of the same
#1376SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME
#1377Semiconductor device and method of manufacturing the same
#1378Semiconductor device
#1379SEMICONDUCTOR DEVICE
#1380Semiconductor device
#1381Dual-leadframe multi-chip package and method of manufacture
#1382Semiconductor device and method of manufacturing the same
#1383Semiconductor device and a method of manufacturing the same
#1384Electronic device having interconnections, openings, and pads having greater width than the openings
#1385Stacked dual chip package and method of fabrication
#1386Multi-layer lead frame package and method of fabrication
#1387Semiconductor device
#1388Integration of a sense FET into a discrete power MOSFET
#1389Semiconductor substrate and semiconductor chip
#1390Method of sensing magnitude of current through semiconductor power device
#1391Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces
#1392Integrated circuit package for semiconductior devices with improved electric resistance and inductance
#1393Electronic circuit device
#1394SEMICONDUCTOR DEVICE
#1395Stacked semiconductor chips with separate encapsulations
#1396Semiconductor device
#1397Semiconductor circuit and switching power supply apparatus
#1398Light-emitting device, light-emitting element and method of manufacturing same
#1399Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device
#1400Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same
#1401III-nitride power device with solderable front metal
#1402Semiconductor package
#1403Semiconductor package of a flipped MOSFET and its manufacturing method
#1404Insulated gate semiconductor device
#1405Power semiconductor device
#1406Semiconductor device with surface electrodes
#1407SEMICONDUCTOR DEVICE AND POWER SUPPLY UNIT USING THE SAME
#1408Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation
#1409FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#1410Method of teaching eyepoints for wire bonding and related semiconductor processing operations
#1411Die package including multiple dies and lead orientation
#1412Semiconductor device including a DC-DC converter having a metal plate
#1413Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation
#1414SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1415Semiconductor device and method of manufacturing the same
#1416Semiconductor device and method of manufacturing the same
#1417SEMICONDUCTOR DEVICE
#1418Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs
#1419Device and method for limiting drain-source voltage of transformer-coupled push pull power conversion circuit
#1420Temperature controlled attenuator
#1421Temperature compensation attenuator
#1422Variable attenuator having stacked transistors
#1423Integrated circuit package with embedded components
#1424Semiconductor connection component
#1425Semiconductor device and method for fabricating the same
#1426High voltage semiconductor device including a free wheel diode
#1427Light emitting device, light emitting device and package, and lighting system
#1428Heat conduction for chip stacks and 3-D circuits
#1429Light emitting diodes with smooth surface for reflective electrode
#1430FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#1431Lateral super junction device with high substrate-drain breakdown and built-in avalanche clamp diode
#1432Semiconductor device and power source device with a current detection circuit
#1433Semiconductor device and lead frame thereof
#1434Configurable interposer
#1435Semiconductor device and method of manufacturing the same
#1436Compliant bonding structures for semiconductor devices
#1437SEMICONDUCTOR PACKAGE AND DC-DC CONVERTER
#1438Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package
#1439Chip package structure and method for fabricating the same
#1440Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof
#1441Semiconductor package with metal straps
#1442Power semiconductor module and method for operating a power semiconductor module
#1443Semiconductor device and power supply device
#1444High efficiency module
#1445Semiconductor package and method for fabricating the same
#1446Wirebond-less semiconductor package
#1447Method of attaching an interconnection plate to a semiconductor die within a leadframe package
#1448Semiconductor device and information processing system including the same
#1449SEMICONDUCTOR PACKAGE WITH SECTIONED BONDING WIRE SCHEME
#1450Method of manufacturing a semiconductor device having vertical MOSFET
#1451Electronic assemblies including mechanically secured protruding bonding conductor joints
#1452Insulated gate type semiconductor device and method for fabricating the same
#1453Self locking and aligning clip structure for semiconductor die package
#1454MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES AND ITS FABRICATION METHOD
#1455SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#1456Semiconductor integrated circuit
#1457Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#1458Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#1459Semiconductor device and method of manufacturing the same
#1460Semiconductor device including vertical transistor and horizontal transistor
#1461Metal oxide semiconductor field effect transistor integrating a capacitor
#1462Power semiconductor module
#1463MOS gate power semiconductor device with anode of protection diode connected to collector electrode
#1464Method of integrating a MOSFET with a capacitor
#1465Semiconductor device and manufacturing method therefor
#1466Hybrid Packaged Gate Controlled Semiconductor Switching Device Using GaN MESFET
#1467MOS GATE POWER SEMICONDUCTOR DEVICE
#1468Semiconductor device having an enlarged emitter electrode
#1469Solderless carbon nanotube and nanowire electrical contacts and methods of use thereof
#1470Circuit board having bypass pad
#1471Semiconductor device
#1472Semiconductor device
#1473Variable feature interface that induces a balanced stress to prevent thin die warpage
#1474Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon
#1475Semiconductor device including first and second carriers
#1476Bond and probe pad distribution
#1477Multi-die package
#1478Semiconductor device and method for manufacturing the same
#1479Manufacturing method of semiconductor device and semiconductor device
#1480Integrated circuit packaging system with through silicon via base and method of manufacture thereof
#1481Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors
#1482Semiconductor device including a MOSFET and a Schottky junction
#1483Semiconductor package and semiconductor package module
#1484Electronic device, method of producing the same, and semiconductor device
#1485Semiconductor device and manufacturing method of the same
#1486SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD WITH FOLDED EDGE
#1487Light emitting diodes with smooth surface for reflective electrode
#1488Linked semiconductor module unit and electronic circuit-integrated motor vehicle device using same
#1489Semiconductor device and manufacturing method of the same
#1490ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
#1491Semiconductor device and power supply device using the same
#1492Semiconductor apparatus and temperature detection circuit
#1493INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONTACT PADS AND METHOD OF MANUFACTURE THEREOF
#1494Insulated gate type semiconductor device and method for fabricating the same
#1495Integration of sense FET into discrete power MOSFET
#1496Integration of a sense FET into a discrete power MOSFET
#1497Power semiconductor devices integrated with clamp diodes sharing same gate metal pad
#1498Semiconductor apparatus and manufacturing method of the same
#1499Semiconductor device for a DC-DC converter
#1500Fabrication method of semiconductor integrated circuit device