209546 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas; Structure Bonding areas having different sizes, e.g. different heights or widths
Wafer arrangement, a method for testing a wafer, and a method for processing a wafer
#902Lateral super junctions with high substrate breakdown and build in avalanche clamp diode
#903Semiconductor device package
#904Integrated circuit package with spatially varied solder resist opening dimension
#905Semiconductor device for battery power voltage control
#906Semiconductor module comprising printed circuit board and method for producing a semiconductor module comprising a printed circuit board
#907Semiconductor device and method of manufacturing the same, and power supply apparatus
#908Substrate for mounting multiple power transistors thereon and power semiconductor module
#909Mounting member having die pad unit and terminals, and photocoupler having the mounting member
#910Monolithic bidirectional silicon carbide switching devices
#911Semiconductor device
#912Power semiconductor package with gate and field electrode leads
#913HEMT with a metal film between the gate electrode and the drain electrode
#914Substrateless power device packages
#915Electronic component and method
#916Electronic circuit device
#917Semiconductor device, and method for manufacturing semiconductor device
#918Segmented bond pads and methods of fabrication thereof
#919Method for manufacturing semiconductor device and semiconductor device
#920Wafer scale package for high power devices
#921Vertical semiconductor MOSFET device with double substrate-side multiple electrode connections and encapsulation
#922Technique for wafer-level processing of QFN packages
#923Semiconductor device and manufacturing method thereof
#924Semiconductor die and package with source down and sensing configuration
#925III-Nitride device with solderable front metal
#926Methods of fluxless micro-piercing of solder balls, and resulting devices
#927Semiconductor package
#928Semiconductor package
#929Semiconductor device
#930Semiconductor device
#931Semiconductor component with integrated crack sensor and method for detecting a crack in a semiconductor component
#932Module and assembly with dual DC-links for three-level NPC applications
#933Semiconductor device
#934Semiconductor device
#935Light-emitting device and method for manufacturing same
#936Semiconductor device
#937Compound semiconductor device and method of manufacturing the same
#938Semiconductor device
#939Semiconductor device and electronic apparatus
#940Method for making a photolithography mask intended for the formation of contacts, mask and integrated circuit corresponding thereto
#941System and method of sensing current in a power semiconductor device
#942Method for manufacturing semiconductor devices having a metallisation layer
#943Semiconductor device
#944Semiconductor device that attenuates high-frequency oscillation
#945Chip arrangement, wafer arrangement and method of manufacturing the same
#946Shielded gate trench MOSFET package
#947Method of forming a high electron mobility semiconductor device and structure therefor
#948Semiconductor module and method for manufacturing same
#949Light-emitting module and method of manufacturing a single light-emitting structure thereof
#950Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
#951Method and apparatus for constructing an isolation capacitor in an integrated circuit
#952Floating bond pad for power semiconductor devices
#953High current, low switching loss SiC power module
#954Method for manufacturing a semiconductor device
#955Electronic device comprising at least a chip enclosed in a package and a corresponding assembly process
#956Dual-flag stacked die package
#957Semiconductor device
#958Semiconductor device and method for manufacturing the same
#959Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance
#960Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
#961Electric connection method
#962Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#963Device including a semiconductor chip and wires
#964Semiconductor device and fabrication method therefor, and power supply apparatus
#965Bumps for chip scale packaging including under bump metal structures with different diameters
#966Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
#967Semiconductor device, method for manufacturing the same, power supply, and high-frequency amplifier
#968Substrate contact opening
#969UBM structures for wafer level chip scale packaging
#970Semiconductor module, upper and lower arm kit, and three-level inverter
#971Normally off power electronic component
#972Stacked type power device module
#973Power semiconductor devices
#974Configurable interposer
#975Semiconductor device
#976Chip arrangements and methods for manufacturing a chip arrangement
#977Electronic circuit, production method thereof, and electronic component
#978Solder fatigue arrest for wafer level package
#979MULTI-CHIP MODULE CONNECTION BY WAY OF BRIDGING BLOCKS
#980Semiconductor package having an over-temperature protection circuit utilizing multiple temperature threshold values
#981Method and system for controlling chip inclination during flip-chip mounting
#982Semiconductor device and method of manufacturing the same
#983Semiconductor package having multi-phase power inverter with internal temperature sensor
#984IGBT die structure with auxiliary P well terminal
#985Stacked dual-chip packaging structure and preparation method thereof
#986Control and driver circuits on a power quad flat no-lead (PQFN) leadframe
#987Power quad flat no-lead (PQFN) package having control and driver circuits
#988Semiconductor packages and methods of formation thereof
#989Semiconductor device having sensing functionality
#990Semiconductor device and a method of manufacturing the same
#991Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)
#992Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#993Localized high density substrate routing
#994Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter
#995Solid-state image pickup element and solid-state image pickup element mounting structure
#996Power semiconductor housing with redundant functionality
#997Semiconductor device and method of detecting wire open failure thereof
#998Vertically Stacked Power FETS and Synchronous Buck Converter Having Low On-Resistance
#999Voltage regulator using N-type substrate
#1000Semiconductor unit and semiconductor device using the same
#1001Semiconductor package for high power devices
#1002Semiconductor structures comprising a dielectric material having a curvilinear profile
#1003Monolithic bidirectional silicon carbide switching devices
#1004Light-emitting device and method for manufacturing same
#1005Redistribution layer (RDL) with variable offset bumps
#1006Three-dimensional integrated structure capable of detecting a temperature rise
#1007Method and apparatus for image sensor packaging
#1008Semiconductor packages having multiple lead frames and methods of formation thereof
#1009Integrated RF front end system
#1010Package-in-packages and methods of formation thereof
#1011FET TRANSISTOR ON HIGH-RESISTIVITY SUBSTRATE
#1012Lead Frame Packages and Methods of Formation Thereof
#1013Integrated circuit package having offset vias
#1014Electro-thermal cooling devices and methods of fabrication thereof
#1015Semiconductor device with normally off and normally on transistors
#1016Semiconductor modules and methods of formation thereof
#1017Integrated snubber in a single poly MOSFET
#1018Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device
#1019Circuit module such as a high-density lead frame array (HDA) power module, and method of making same
#1020Semiconductor device having a breakdown voltage holding region
#1021Semiconductor power device and method for producing same
#1022Reliable area joints for power semiconductors
#1023Package with metal-insulator-metal capacitor and method of manufacturing the same
#1024Semiconductor package and methods of formation thereof
#1025Semiconductor module with a semiconductor chip and a passive component and method for producing the same
#1026Power transistor partial current sensing for high precision applications
#1027SYSTEM AND METHODS FOR WIRE BONDING
#1028Strain reduced structure for IC packaging
#1029Electronic Module
#1030Semiconductor device
#1031Monolithic power converter package
#1032Monolithic Power Converter Package with Through Substrate vias
#1033Semiconductor package and method of manufacturing the same
#1034Multichip power semiconductor device
#1035Compound semiconductor device and method for manufacturing the same
#1036Semiconductor device, power-supply unit, amplifier and method of manufacturing semiconductor device
#1037Compound semiconductor device and method of manufacturing the same
#1038Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit
#1039Manufacturing method of semiconductor device, semiconductor device, and semiconductor crystal growth substrate
#1040Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same
#1041High performance power module
#1042Contact test structure and method
#1043Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#1044TWO-SOLDER METHOD FOR SELF-ALIGNING SOLDER BUMPS IN SEMICONDUCTOR ASSEMBLY
#1045Semiconductor device and method of manufacturing the same
#1046Method for manufacturing semiconductor devices having a glass substrate
#1047Power semiconductor module with method for manufacturing a sintered power semiconductor module
#1048Semiconductor module with switching elements
#1049Power semiconductor module
#1050Aluminum alloy lead-frame and its use in fabrication of power semiconductor package
#1051Power module and air conditioner
#1052Semiconductor device using diffusion soldering
#1053Semiconductor device and method of manufacturing thereof
#1054Semiconductor device and method of manufacturing the same
#1055DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAME ATTACH
#1056Techniques for wafer-level processing of QFN packages
#1057Module including a discrete device mounted on a DCB substrate
#1058Microspring structures adapted for target device cooling
#1059Semiconductor Device and Fabrication Method
#1060Bump structure design for stress reduction
#1061Semiconductor package having internal shunt and solder stop dimples
#1062Device including two power semiconductor chips and manufacturing thereof
#1063UBM structures for wafer level chip scale packaging
#1064Power semiconductor package with conductive clip
#1065Ceramic Plate
#1066Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging process
#1067SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#1068Power module with current routing
#1069Bumps for Chip Scale Packaging
#1070Device including two power semiconductor chips and manufacturing thereof
#1071Electronic device and method for fabricating an electronic device
#1072Compact wirebonded power quad flat no-lead (PQFN) package
#1073Low impedance gate control method and apparatus
#1074Semiconductor device having multiple bump heights and multiple bump diameters
#1075Semiconductor device having improved contact structure
#1076COMPOUND SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#1077Low-inductive semiconductor module
#1078Seal ring structure with a metal pad
#1079Semiconductor device
#1080Power semiconductor module with wireless saw temperature sensor
#1081Compound semiconductor device and method of manufacturing the same
#1082PACKAGE STRUCTURE
#1083PACKAGING STRUCTURE
#1084Semiconductor device
#1085Semiconductor device and fabrication method
#1086SEMICONDUCTOR DEVICE
#1087Semiconductor device and fabrication method
#1088Compound semiconductor device and method of manufacturing the same
#1089Device including a semiconductor chip and metal foils
#1090Multi-die semiconductor package
#1091Snubber circuit and method of using bipolar junction transistor in snubber circuit
#1092Snubber circuit and method of using bipolar junction transistor in snubber circuit
#1093TRANSISTOR STRUCTURE AND RELATED TRANSISTOR PACKAGING METHOD THEREOF
#1094COMPOUND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#1095Electronic circuit device
#1096Semiconductor device
#1097Small-Outline Package for a Power Transistor
#1098Engineered substrates for semiconductor devices and associated systems and methods
#1099Semiconductor device
#1100Shielded gate trench MOSFET package
#1101Structure and method for power field effect transistor
#1102Light-emitting device
#1103Semiconductor arrangement
#1104Power semiconductor chip having two metal layers on one face
#1105Semiconductor device
#1106Power semiconductor device and method for manufacturing same
#1107METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK
#1108Power device having a specific range of distances between collector and emitter electrodes
#1109SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#1110Semiconductor device and method of manufacturing the same
#1111Semiconductor device including a contact clip having protrusions and manufacturing thereof
#1112Half-bridge electronic device with common heat sink on mounting surface
#1113Semiconductor device
#1114DC/DC CONVERTOR POWER MODULE PACKAGE INCORPORATING A STACKED CONTROLLER AND CONSTRUCTION METHODOLOGY
#1115Semiconductor device and manufacturing method
#1116Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#1117Power converter including a power module allowing main current supply and cutoff
#1118Electronic device and manufacturing thereof
#1119Impedence controlled packages with metal sheet or 2-layer RDL
#1120IGBT and diode
#1121Method of fabricating semiconductor device
#1122Semiconductor device
#1123Semiconductor device and driving apparatus including semiconductor device
#1124Semiconductor module and driving apparatus including semiconductor module
#1125Semiconductor device including Schottky barrier diode
#1126LED device and method for manufacturing the same
#1127Backside Power Delivery Using Die Stacking
#1128Pad layout structure of semiconductor chip
#1129Method for producing a metal layer on a substrate and device
#1130Common drain exposed conductive clip for high power semiconductor packages
#1131Multi-transistor exposed conductive clip for high power semiconductor packages
#1132Thermally enhanced semiconductor package with exposed parallel conductive clip
#1133Semiconductor light-emitting structure
#1134Circuit board having bypass pad
#1135SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#1136Method for making solder-top enhanced semiconductor device of low parasitic packaging impedance
#1137Semiconductor device, LED driving circuit, and apparatus for displaying an image
#1138Manufacturing electronic device having contact elements with a specified cross section
#1139Semiconductor device and semiconductor element
#1140Variable attenuator having stacked transistors
#1141Electronic device packaging structure
#1142Semiconductor device for use in a power supply circuit and having a power MOSFET and Schottky barrier diode
#1143Module comprising a semiconductor chip
#1144Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP
#1145Semiconductor device and power supply device using the same
#1146Semiconductor device and manufacturing method of the same
#1147Package with multiple dies
#1148Method of manufacturing a semiconductor device
#1149Semiconductor device
#1150Bondwireless power module with three-dimensional current routing
#1151Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
#1152MONOLITHIC INTEGRATED CAPACITORS FOR HIGH-EFFICIENCY POWER CONVERTERS
#1153Over-temperature protected triac and protection method
#1154Method for manufacturing semiconductor devices having a glass substrate
#1155HEAT CONDUCTION FOR CHIP STACKS AND 3-D CIRCUITS
#1156Methods for forming a semiconductor structure
#1157Package structure for DC-DC converter
#1158Lead component and method for manufacturing the same, and semiconductor package
#1159Flip chip semiconductor device
#1160Configurable interposer
#1161Semiconductor device and manufacturing method of the same
#1162Semiconductor device and manufacturing method of the same
#1163Power semiconductor module and its attachment structure
#1164Power device with bottom source electrode
#1165Inkjet head and inkjet print device
#1166Air-gap C4 fluidic I/O interconnects and methods of fabricating same
#1167Flip chip package
#1168IGBT power semiconductor package having a conductive clip
#1169III-nitride transistor stacked with FET in a package
#1170Polymer and solder pillars for connecting chip and carrier
#1171Compound semiconductor device and method for manufacturing the same
#1172Compound semiconductor device and method for manufacturing the same
#1173SEMICONDUCTOR CIRCUIT AND SWITCHING POWER SUPPLY APPARATUS
#1174Stacked multi-die electronic device with interposed electrically conductive strap
#1175Semiconductor device and semiconductor device mounting structure
#1176SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND POWER SUPPLY APPARATUS
#1177Method of producing semiconductor device and semiconductor device
#1178Bidirectional switch
#1179Semiconductor apparatus including protective film on gate electrode and method for manufacturing the semiconductor apparatus
#1180Determining intra-die wirebond pad placement locations in integrated circuit
#1181Power modules with reverse polarity protection
#1182Semiconductor device, manufacturing method of semiconductor device, and power source device
#1183Semiconductor device, method for manufacturing the same, and power supply unit
#1184SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#1185SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ELECTRONIC CIRCUIT
#1186Semiconductor device and method for manufacturing semiconductor device
#1187Semiconductor device including gate electrode provided over active region in P-type nitride semiconductor layer and method of manufacturing the same, and power supply apparatus
#1188Manufacturing method of semiconductor device
#1189Semiconductor chip and fabricating method thereof
#1190Device and associated semiconductor package for limiting drain-source voltage of transformer-coupled push pull power conversion circuit
#1191Semiconductor device, power-supply unit, amplifier and method of manufacturing semiconductor device
#1192SEMICONDUCTOR DEVICE, POWER SUPPLY DEVICE, AMPLIFIER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#1193Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing
#1194Semiconductor device and method for producing the same, and power supply
#1195Semiconductor module having deflecting conductive layer over a spacer structure
#1196SEMICONDUCTOR DEVICE
#1197Vertical discrete device with drain and gate electrodes on the same surface and method for making the same
#1198Semiconductor relay
#1199Trench-based power semiconductor devices with increased breakdown voltage characteristics
#1200Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors