Structure and method for power field effect transistor

Electronic component and method of connecting with multi-profile bumps

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME

Power semiconductor device and method for its production

Power electronic device

Semiconductor device, LED driving circuit, and apparatus for displaying an image

Circuit board having bypass pad

Semiconductor power module

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Semiconductor device

Power MOSFET package

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

Semiconductor device

Package with multiple dies

Semiconductor device

Semiconductor device

Avalanche capability improvement in power semiconductor devices having dummy cells around edge of active area

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

SEMICONDUCTOR DEVICE

Microelectronic packages fabricated at the wafer level and methods therefor

Semiconductor device and manufacturing method thereof

Methods of fluxless micro-piercing of solder balls, and resulting devices

SEMICONDUCTOR DEVICE

Semiconductor device and method for manufacturing the same

Pre-molded clip structure

Pre-molded clip structure

Semiconductor device comprising a through electrode and a pad connected to the through electrode and having an exposed portion and method for fabricating the same

Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly

SEMICONDUCTOR LIGHT-EMITTING DEVICE

Chip stack package and method of fabricating the same

Semiconductor device and manufacturing method therefor

Structure and method for sealing cavity of micro-electro-mechanical device

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Carrier for Multi-Chip Packaging

Semiconductor device

Lead and lead frame for power package

Complaint bonding structures for semiconductor devices

Module having a stacked magnetic device and semiconductor device and method of forming the same

Large current handling capable semiconductor switching device with suppression of short circuit damage and recovery current switching loss

Bidirectional switch module

Module having a stacked magnetic device and semiconductor device and method of forming the same

Semiconductor device and wire bonding method

Semiconductor device and a method of manufacturing the same

Light-emitting diode die package and method for producing same

Semiconductor device and method for fabricating the same

Semiconductor device and method of manufacturing semiconductor device

Method of forming a copper topped interconnect structure that has thin and thick copper traces

Semiconductor device and method of manufacturing the same

Monolithic semiconductor switches and method for manufacturing

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device having lead free solders between semiconductor chip and frame and fabrication method thereof

SEMICONDUCTOR DEVICE

Method for forming a patterned thick metallization atop a power semiconductor chip

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

Semiconductor circuit and switching power supply apparatus

Metal schemes of trench MOSFET for copper bonding

Semiconductor device with circuit for reduced parasitic inductance

Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips

Semiconductor device and method of manufacturing the same

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

THERMOELECTRIC DEVICE AND FABRICATION METHOD THEREOF, CHIP STACK STRUCTURE, AND CHIP PACKAGE STRUCTURE

Method of manufacturing a semiconductor device

Pad layout structure of semiconductor chip

Wafer structure with conductive bumps and fabrication method thereof

Thermally enhanced thin semiconductor package

Electronic switching device

Light-emitting device, method for manufacturing same, molded body and sealing member

Semiconductor integrated circuit

Semiconductor device including chip

Semiconductor element and electrical apparatus

Semiconductor device and method for fabricating the same

Insulated-gate semiconductor device with protection diode

Semiconductor element and electrical apparatus

Semiconductor device including DC-DC converter

Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device

SEMICONDUCTOR POWER MODULE PACKAGE HAVING EXTERNAL BONDING AREA

High frequency semiconductor device

Semiconductor device

Trench-based power semiconductor devices with increased breakdown voltage characteristics

Trench-based power semiconductor devices with increased breakdown voltage characteristics

Trench-based power semiconductor devices with increased breakdown voltage characteristics

Trench-based power semiconductor devices with increased breakdown voltage characteristics

Compact semiconductor package with integrated bypass capacitor and method

Device including a semiconductor chip and metal foils

High-speed optical interconnection device

Semiconductor device with reduced pad pitch

Semiconductor device including a DC-DC converter having a metal plate

Semiconductor integrated circuit devices and display apparatus including the same

Semiconductor device with varying bump density regions and method of manufacturing the same

Semiconductor device and manufacturing method thereof

RF power amplifier

Semiconductor device and a manufacturing method of the same

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR DRIVING DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor die package including lead with end portion

SEMICONDUCTOR DEVICE

Gallium nitride-based compound semiconductor light-emitting device with an electrode covered by an over-coating layer

Electronic device and method for fabricating the same

Member for synchronous rectifier bridge, related synchronous rectifier bridge and use thereof

Stacked field effect transistor configurations

Semiconductor die package including multiple dies and a common node structure

Semiconductor device having IGBT and FWD on same substrate

Forming solder balls on substrates

Electronic circuit device

Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer

Device including two mounting surfaces

Semiconductor device for battery power voltage control

Copper-topped interconnect structure that has thin and thick copper traces and method of forming the copper-topped interconnect structure

Light-emitting device, light-emitting element and method of manufacturing same

Semiconductor device

METHODS AND APPARATUS FOR INTEGRATED CIRCUIT HAVING INTEGRATED ENERGY STORAGE DEVICE

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device

Semiconductor device with emitter contact holes in a first layer not overlaid by emitter through holes in a second layer

Semiconductor device

Semiconductor light emitting apparatus having stacked reflective dielectric films

Semiconductor light emitting device and semiconductor light emitting apparatus

Semiconductor light-emitting device and method for manufacturing same

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material

Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same

Stacked semiconductor device and method

Semiconductor module with two cooling surfaces and method

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

Electronic device and method of manufacturing same

Copper bonding method

Semiconductor device and method of manufacturing a semiconductor device

Methods and apparatus for integrated circuit having on chip capacitor with eddy current reductions

Stacked semiconductor chips with separate encapsulations

Power semiconductor device

Semiconductor device covered by front electrode layer and back electrode layer

Light emitting element and method of making the same

Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates

Electronic device having contact elements with a specified cross section and manufacturing thereof

Inverter with asymmetric clocking and thermally isolated modules

Electrode structure and semiconductor device

Semiconductor chip assembly

Flex chip connector for semiconductor device

STACKED DIE PACKAGE

Insulated gate type semiconductor device and method for fabricating the same

Semiconductor chip and method for fabricating the same

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

Power semiconductor device

Semiconductor package featuring flip-chip die sandwiched between metal layers

Semiconductor device having insulated gate bipolar transistor

Semiconductor device having insulated gate bipolar transistor

Device and method for limiting drain-source voltage of transformer-coupled push pull power conversion circuit

Circuit arrangement having two semiconductor switching elements and one freewheeling element

SEMICONDUCTOR PACKAGE HAVING PASSIVE COMPONENT BUMPS

POWER SUPPLY DEVICE AND SWITCHING POWER SUPPLY DEVICE

Solder mold plates used in packaging process and method of manufacturing solder mold plates

Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element

Semiconductor module

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME

DFN semiconductor package having reduced electrical resistance

Method of making semiconductor devices employing first and second carriers

Three-dimensional semiconductor device structures and methods

Integrated circuit system having different-size solder bumps and different-size bonding pads

Integration of a sense FET into a discrete power MOSFET

Device and method for limiting Di/Dt caused by a switching FET of an inductive switching circuit

Semiconductor device and manufacturing method of the same

Mock bump system for flip chip integrated circuits

Mock bump system for flip chip integrated circuits

Complex semiconductor packages and methods of fabricating the same

Light emitting diodes with smooth surface for reflective electrode

GaN based semiconductor light-emitting device and method for producing same

Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof

Semiconductor device

Flip chip package

Semiconductor module

Semiconductor Device

Semiconductor device

Power converter

SEMICONDUCTOR DEVICE

Semiconductor die package including exposed connections

Semiconductor device and method of manufacturing the same

Semiconductor device having a gate contact on one surface electrically connected to a gate bus on an opposing surface

Flip chip semiconductor assembly with variable volume solder bumps

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor package having a bridge plate connection

High power and high temperature semiconductor power devices protected by non-uniform ballasted sources

Manufacturing method of resin-sealed semiconductor device

Semiconductor device and a method of manufacturing the same

Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof

Semiconductor device

Power switching circuit improved to reduce loss due to reverse recovery current

GaN based semiconductor light-emitting device and method for producing same

POLYMER AND SOLDER PILLARS FOR CONNECTING CHIP AND CARRIER

Semiconductor device

POWER MOSFET

Light emitting diode and method for manufacturing the same

Semiconductor device

LUMINESCENT MATERIAL

Multi-chip module

ANGLED FLYING LEAD WIRE BONDING PROCESS

Semiconductor device and manufacturing method of the same

Ultra-Thin Semiconductor Package

Method of manufacturing electronic device on leadframe

Semiconductor device having a trench type high-power MISFET

Semiconductor module

Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same

Flex clip connector for semiconductor device

Semiconductor device, DC/DC converter and power supply

Semiconductor module

Semiconductor package with an embedded printed circuit board and stacked die

Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead

Semiconductor device and its manufacture

Semiconductor element, semiconductor device, and fabrication method thereof

Method of fabricating a power electronic device

SEMICONDUCTOR MODULE MOUNTING STRUCTURE

Package with multiple dies

Forming solder balls on substrates

Semiconductor device and power supply device using the same

Circuit board having bypass pad

Methods of fluxless micro-piercing of solder balls, and resulting devices

Semiconductor device and manufacturing method of the same

Electronic device

Semiconductor device having a stacked multi structure that has layered insulated gate-type bipolar transistors

Method for making a device including placing a semiconductor chip on a substrate

Semiconductor device and method of manufacturing the same

Method for fabricating electrical bonding pads on a wafer

Stacked-die package for battery power management

Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device

Method and system for providing a reliable semiconductor assembly

Semiconductor power module packages with simplified structure and methods of fabricating the same

Back to Back Die Assembly For Semiconductor Devices

Self-aligning structures and method for integrated circuits

Clip mount for integrated circuit leadframes

Radiation detector array

Semiconductor device and manufacturing method thereof

WAFER-LEVEL UNDERFILL PROCESS USING OVER-BUMP-APPLIED RESIN

Device with a plurality of semiconductor chips

Solder-top enhanced semiconductor device for low parasitic impedance packaging

Semiconductor integrated circuit device, PDP driver, and plasma display panel

Method of forming micro metal bump

Power Integrated Circuit with Bond-Wire Current Sense

SEMICONDUCTOR DEVICE

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire

Method for producing a power semiconductor module comprising surface-mountable flat external contacts

Bond pad design for fine pitch wire bonding

Device and method for limiting Di/Dt caused by a switching FET of an inductive switching circuit

Audio power amplifier package

FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD

Power semiconductor arrangement

GAN TYPE LIGHT EMITTING DIODE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS

Semiconductor device, and manufacturing method of semiconductor device

Semiconductor device

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE

Package for monolithic compound semiconductor (CSC) devices for DC to DC converters

Semiconductor connection component

Semiconductor device and method of manufacturing the same

Bidirectional switch module

Semiconductor apparatus

Wafer level packaging of semiconductor chips

CO-PACKAGED HIGH-SIDE AND LOW-SIDE NMOSFETS FOR EFFICIENT DC-DC POWER CONVERSION

BONDING-PATTERNED DEVICE AND ELECTRONIC COMPONENT

Self locking and aligning clip structure for semiconductor die package

THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE

Semiconductor light emitting device and method for manufacturing same

Temperature sensing arrangements for power electronic devices

Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same

Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing

Power semiconductor device

Backlight including side-emitting semiconductor light emitting devices

Optical element coupled to low profile side emitting LED

Method of manufacturing an integrated circuit module

Package-based filtering and matching solutions

Cascode current sensor for discrete power semiconductor devices

Semiconductor circuit and switching power supply apparatus

Power semiconductor component with metal contact layer and production method therefor

SEMICONDUCTOR DEVICE

Semiconductor device with semiconductor chip and method for producing it

Semiconductor device

Apparatus and method for bonding silicon wafer to conductive substrate

GROUP PROBING OVER ACTIVE AREA PADS ARRANGEMENT

Output control device, and AC/DC power source device, circuit device, LED backlight circuit device, and switching DC/DC converter device each using output control device

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

Electronic device, method of producing the same, and semiconductor device

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Driving chip, driving chip package having the same, display apparatus having the driving chip, and method thereof

Semiconductor module

Semiconductor device

Luminescent material

Semiconductor assembly

DC-DC converter, driver IC, and system in package

Integrated circuit package for semiconductor devices with improved electric resistance and inductance

Ultra-Thin Wafer-Level Contact Grid Array

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Power semiconductor device and manufacturing method of the same

Gallium nitride-based semiconductor element, optical device using the same, and image display apparatus using optical device

Semiconductor device and manufacturing method therefor

IC chip with finger-like bumps

Semiconductor device including semiconductor chips having contact elements

Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof

High power semiconductor device capable of preventing parasitical bipolar transistor from turning on

Semiconductor device and power conversion device using the same

Power composite integrated semiconductor device and manufacturing method thereof