209592 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
Sub-classes:MOLDED SPACER FOR SURFACE MOUNT TECHNOLOGY
#2ELECTRONIC PACKAGE
#3SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METHODS FOR MANUFACTURING THE SAME
#4Corner guard for improved electroplated first level interconnect bump height range
#5Package with conductive underfill ground plane
#6Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure
#7Thin embedded packages, methods of fabricating the same, electronic systems including the same, and memory cards including the same
#8Packaging structures and methods for semiconductor devices
#9Semiconductor device and manufacturing method of semiconductor device
#10SEMICONDUCTOR DEVICE MOUNTED ON SUBSTRATE, AND MANUFACTURING METHOD THEREOF
#11Semiconductor device, connecting member, method for manufacturing a semiconductor device and method for manufacturing a connecting member
#12Method for manufacturing semiconductor device with reduced damage to metal wiring layer
#13All intermetallic compound with stand off feature and method to make