209593 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body Reinforcing structures
Sub-classes:REINFORCING RESIN COMPOSITION AND MOUNTED STRUCTURE
#2BUMP LANDING WITH BOND WIRES FOR IMPROVED SOLDER WETTING
#3SEMICONDUCTOR PACKAGE FOR STRESS ISOLATION
#4PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
#5Method for underfilling using spacers
#6Semiconductor device package connector structure and method therefor
#7Semiconductor package and method of manufacturing the same
#8Light-emitting device and displayer
#9Interposer, electronic substrate, and method for producing electronic substrate
#10Semiconductor package structure and method for manufacturing the same
#11Tall and fine pitch interconnects
#12Tall and fine pitch interconnects
#13Tall and fine pitch interconnects
#14Electrical connection for chip scale packaging
#15METHODS OF FORMING HYDROPHOBIC SURFACES ON SEMICONDUCTOR DEVICE STRUCTURES, METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES, AND SEMICONDUCTOR DEVICE STRUCTURES
#16Substrate warpage control using external frame stiffener
#17Method and an alignment plate for engaging a stiffener frame and a circuit board
#18Methods of forming hydrophobic surfaces on semiconductor device structures, methods of forming semiconductor device structures, and semiconductor device structures
#19Interconnect crack arrestor structure and methods
#20ELECTRONIC COMPONENT MOUNTING METHOD
#21Electrical connection for chip scale packaging
#22Use of a local constraint to enhance attachment of an IC device to a mounting platform
#23WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME