209594 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body; Reinforcing structures Bump collar
Method for packaging stacking flip chip
#2SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#3SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#4Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structure
#5Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#6Methods of forming connector pad structures, interconnect structures, and structures thereof
#7Method of manufacturing substrate structure with filling material formed in concave portion
#8Methods of forming connector pad structures, interconnect structures, and structures thereof
#9Packaged semiconductor devices and methods of packaging thereof
#10Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#11Methods of forming connector pad structures, interconnect structures, and structures thereof
#12Solder in cavity interconnection structures
#13Mounting structure and method for manufacturing same
#14Semiconductor package structure and method for forming the same
#15Methods of forming connector pad structures, interconnect structures, and structures thereof
#16Semiconductor package structure and method for forming the same
#17Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#18Solder bump reflow by induction heating
#19Wiring board
#20Flip-chip hybridisation of two microelectronic components using a UV anneal
#21Solder in cavity interconnection structures
#22Mounting structure and method for manufacturing same
#23Stress buffer structures in a mounting structure of a semiconductor device
#24Connector design for packaging integrated circuits
#25Packaging structures and methods with a metal pillar
#26Wafer-level device packaging
#27Package structure and semiconductor structure thereof
#28Semiconductor packages
#29Solder in cavity interconnection structures
#30Wafer-level chip scale package with re-workable underfill
#313D IC packaging structures and methods with a metal pillar
#32Connector design for packaging integrated circuits
#33Chip package and method for forming the same
#34Solder in cavity interconnection structures
#35Package substrate unit and method for manufacturing package substrate unit
#36Recessed pillar structure
#37INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND METHOD OF MANUFACTURE THEREOF
#38Stress buffer structures in a mounting structure of a semiconductor device
#39Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
#40Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate