209595 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body Alignment aids
SEMICONDUCTOR PACKAGE
#2METHODS OF FORMING A SEMICONDUCTOR PACKAGE INCLUDING STRESS BUFFERS
#3Power, Signaling and Thermal Path Co-optimization
#4DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER METHOD
#5SEMICONDUCTOR PACKAGE INCLUDING STRESS BUFFERS AND METHODS OF FORMING THE SAME
#6Multi-layered structure interface between a ball grid array device and a printed circuit board
#7Semiconductor Assembly Packaging Method, Semiconductor Assembly and Electronic Device
#8Assembly platform
#9Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#10Mixed-orientation multi-die integrated circuit package with at least one vertically-mounted die
#11Assembly platform
#12Ball grid array and land grid array assemblies fabricated using temporary resist
#13Semiconductor device and method of unit specific progressive alignment
#14Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#15Chip alignment utilizing superomniphobic surface treatment of silicon die
#16Package structure having magnetic bonding between substrates
#17Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#18Magnetic contacts
#19Electronic component and method for manufacturing electronic component
#20Ball grid array and land grid array assemblies fabricated using temporary resist
#21Ball grid array and land grid array assemblies fabricated using temporary resist
#22Stack of integrated-circuit chips and electronic device
#23Magnetic contacts
#24Apparatus and methods for high-density chip connectivity
#25Chip stack with electrically insulating walls
#26Method for aligning micro-electronic components
#27Semiconductor device and method of manufacturing semiconductor device
#28Mechanism for MEMS bump side wall angle improvement
#29Semiconductor package having magnetic connection member
#30Electronic component and method for manufacturing electronic component
#31Technique for controlling positions of stacked dies
#32Electronic device
#33Electronic device and method of manufacturing electronic device
#34Package alignment structure and method of forming same
#35Semiconductor device and manufacturing method thereof
#36Semiconductor device and method of making bumpless flipchip interconnect structures
#37Bump structures having an extension
#38Electronic circuit substrate, display device, and wiring substrate
#39STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
#40Mechanism for MEMS bump side wall angle improvement
#41Semiconductor device having magnetic alignment marks and underfill resin layers
#42ELECTRONIC COMPONENT MOUNTING METHOD
#43Use of a local constraint to enhance attachment of an IC device to a mounting platform
#44Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance
#45Semiconductor device and method of manufacturing semiconductor device
#46Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor die
#47Apparatus and methods for high-density chip connectivity
#48Ramp-stack chip package with static bends
#49Optical connection through single assembly overhang flip chip optics die with micro structure alignment
#50METHOD AND SYSTEM FOR ALIGNMENT OF INTEGRATED CIRCUITS
#51Semiconductor chip and semiconductor package with stack chip structure
#52In system reflow of low temperature eutectic bond balls
#53Flux-free chip to wafer joint serial thermal processor arrangement
#54SOLDER, ELECTRONIC PART, AND METHOD OF FABRICATING ELECTRONIC PART
#55Wiring circuit structure and manufacturing method for semiconductor device using the structure
#56Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof
#57Substrate with built-in semiconductor element, and method of fabricating substrate with built-in semiconductor element
#583-D semiconductor die structure with containing feature and method
#59Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
#60Microstructure Apparatus and Method for Manufacturing Microstructure Apparatus
#61Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates
#62Method and apparatus for facilitating proximity communication and power delivery
#63Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking
#64Semiconductor device and manufacturing method of semiconductor device
#65Methods for bonding and micro-electronic devices produced according to such methods
#66Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby
#673-D semiconductor die structure with containing feature and method
#68Method and system for providing an aligned semiconductor assembly
#69Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device
#70Method and system for providing a reliable semiconductor assembly
#71SEMICONDUCTOR DEVICE HAVING THREE-DIMENSIONAL STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME
#72Flip-chip component production method
#73WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME
#74SEMICONDUCTOR DEVICE MOUNTED ON SUBSTRATE, AND MANUFACTURING METHOD THEREOF
#75Integrated circuit edge protection method and apparatus
#76FLIP CHIP PACKAGE WITH ANTI-FLOATING STRUCTURE
#77Devices with microjetted polymer standoffs
#78Semiconductor device manufacturing method
#79Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
#80Apparatus and methods for high-density chip connectivity
#81Magnetic alignment of integrated circuits to each other
#82Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
#83Method and device to elongate a solder joint
#84Semiconductor component and method for production of a semiconductor component
#85Method and apparatus for facilitating proximity communication and power delivery
#86Semiconductor component and method of manufacture
#87Self alignment features for an electronic assembly
#88Method and structure for interfacing electronic devices
#89Self alignment features for an electronic assembly
#90Methods for bonding and micro-electronic devices produced according to such methods
#91Semiconductor device, semiconductor device mounting board, and method for mounting semiconductor device
#92Integrated circuit edge protection method and apparatus
#93Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board
#94System and method to increase die stand-off height
#95Semiconductor flip chip package having substantially non-collapsible spacer
#96Semiconductor device and process for producing the same
#97RFID tag and method of manufacturing the same
#98RFID tag and method of manufacturing the same
#99Flip chip package with anti-floating structure
#100Substrate package structure and packaging method thereof
#101Method for manufacturing electronic component-mounted board
#102Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface
#103Semiconductor package with encapsulated passive component
#104Circuit board, device mounting structure, device mounting method, and electronic apparatus
#105Method and structure for interfacing electronic devices
#106Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
#107Method and device to elongate a solder joint
#108Heat dissipation apparatus for package device
#109Electronic package having controlled height stand-off solder joint