Semiconductor device having low dielectric insulating film and manufacturing method of the same

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Semiconductor device and method of forming interconnect structure in non-active area of wafer

Method of manufacturing a printed circuit board having an embedded electronic component

Process for making microelectronic element chips

Bonding method of semiconductor and laminated structure fabricated thereby

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

PACKAGING SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

POSITIVE PHOTORESIST COMPOSITION, THICK FILM PHOTORESIST LAMINATE, METHOD FOR PRODUCING THICK FILM RESIST PATTERN, AND METHOD FOR PRODUCING CONNECTING TERMINAL

Semiconductor device and method of manufacturing the same

Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip package

Flip chip for electrical function test and manufacturing method thereof

UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROLESS NICKEL DEPOSITION

Post passivation structure for a semiconductor device and packaging process for same

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

Die stacking apparatus and method

SEMICONDUCTOR CHIP WITH SOLDER BUMP AND METHOD OF FABRICATING THE SAME

Under Bump Routing Layer Method and Apparatus

Conductor bump method and apparatus

Apparatus and method of mounting conductive ball

Method for manufacturing a circuit board structure, and a circuit board structure

Semiconductor device

Capacitor device and method of manufacturing the same

Semiconductor device and manufacturing method therefor

Method of machining substrate

FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Electronic structures including barrier layers defining lips

Photoelectric conversion element having a semiconductor and semiconductor device using the same

Through silicon via dies and packages

Semiconductor element and method of manufacturing the same

Enhanced copper posts for wafer level chip scale packaging

Cylindrical bonding structure and method of manufacture

Metal interconnect System and Method for Direct Die Attachment

Semiconductor device and manufacturing method of the same

Semiconductor device and method of manufacturing same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING BOAC/COA

Reliable metal bumps on top of I/O pads after removal of test probe marks

Chip assembly with interconnection by metal bump

Semiconductor chip and manufacturing method thereof

Manufacturing method of semiconductor device

Semiconductor chip with post-passivation scheme formed over passivation layer

METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY

Low fabrication cost, fine pitch and high reliability solder bump

Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device

Chip package

UBM structure for strengthening solder bumps

Semiconductor device

Method of assembling chips

Semiconductor element connected to printed circuit board

Stackable semiconductor device and fabrication method thereof

Copper die bumps with electromigration cap and plated solder

System for fabricating semiconductor components with conductive interconnects

Method of joining chips utilizing copper pillar

Phenolic polymers and photoresists comprising same

Semiconductor device and method of manufacturing the same

Semiconductor device manufacturing method and semiconductor device

Conductive ball mounting apparatus and conductive ball mounting method

Electropolishing metal features on a semiconductor wafer

Method of assembling chips

Methods for fabricating semiconductor components with conductive interconnects

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Semiconductor components with conductive interconnects

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS

Conductive structure for a semiconductor integrated circuit and method for forming the same

Bowed wafer hybridization compensation

Conductive structure for a semiconductor integrated circuit and method for forming the same

Undercut-free BLM process for Pb-free and Pb-reduced C4

Semiconductor device comprising electromigration prevention film and manufacturing method thereof

Bump structure and manufacturing method thereof

Component with buried ductile conductive bumps and method of electrical connection between said component and a component equipped with hard conductive points

Low fabrication cost, fine pitch and high reliability solder bump

Nanostructure-Based Package Interconnect

Bump structure having a reinforcement member

Fabrication method of a semiconductor device

Driving circuit for a liquid crystal display device, method of manufacturing the same and display device having the same

Method for fabrication of a conductive bump structure of a circuit board

Light-emitting diode chip package body and packaging method thereof

Electrically conductive interconnect system and method

Bump structure with annular support

Redistribution circuit structure

Under bump metallurgy structure of a package and method of making same

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof

Method for manufacturing a three-dimensional semiconductor device and a wafer used therein

METHOD FOR CHIP TO PACKAGE INTERCONNECT

Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers

METHODS OF FORMING STEPPED BUMPS AND STRUCTURES FORMED THEREBY

STACK PACKAGE HAVING REDUCED ELECTRICAL CONNECTION LENGTH SUITABLE FOR HIGH SPEED OPERATIONS AND METHOD OF MANUFACTURING THE SAME

Methods of forming stepped bumps and structures formed thereby

Fabrication for electroplating thick metal pads

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Voltage regulator integrated with semiconductor chip

Microelectronic assemblies having compliancy and methods therefor

Method of manufacturing multi-layer printed circuit board

Electric component having microtips and ductile conducting bumps

Method for fabricating a circuit component

Semiconductor device

Tubular-shaped bumps for integrated circuit devices and methods of fabrication

Semiconductor device having active element formation region provided under a bump pad

Semiconductor device

Semiconductor chip and production process therefor

Wafer bonding method of system in package

Semiconductor device and method of manufacturing the same

Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package

ELECTRODE, DEVICE AND ELECTRONIC APPARATUS HAVING THE DEVICE

Systems and methods to passivate on-die redistribution interconnects

SEMICONDUCTOR DEVICE INCLUDING CORROSION RESISTANT WIRING STRUCTURE

METHOD FOR IMPROVED COPPER LAYER ETCHING OF WAFERS WITH C4 CONNECTION STRUCTURES

Wire and solder bond forming methods

Method of making lithographic contact elements

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Low fabrication cost, high performance, high reliability chip scale package

Low fabrication cost, high performance, high reliability chip scale package

Light-emitting diode chip package body and packaging method thereof

Light-emitting diode chip package body and packaging method thereof

Electronic Device, a Chip Contacting Method and a Contacting Device

Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof

Light-emitting diode chip package body and packaging method thereof

Light-emitting diode chip package body and packaging method thereof

Technique for forming a passivation layer without a terminal metal

Low fabrication cost, high performance, high reliability chip scale package

Solder pillar bumping and a method of making the same

Semiconductor device and a method of manufacturing the same

METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Semiconductor device and a method of manufacturing the same

Probe arrays and method for making

Microelectronic packages fabricated at the wafer level and methods therefor

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

Method of providing solder bumps on a substrate using localized heating

Low fabrication cost, fine pitch and high reliability solder bump

BUMP ELECTRODE INCLUDING PLATING LAYERS AND METHOD OF FABRICATING THE SAME

Electronic device including a nickel-palladium alloy layer

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Removing dry film resist residues using hydrolyzable membranes

Electrical interconnection structure formation

Semiconductor device and method of producing the same

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor chip and method for fabricating the same

SEMICONDUCTOR PACKAGE INCLUDING SILVER BUMP AND METHOD FOR FABRICATING THE SAME

Low fabrication cost, fine pitch and high reliability solder bump

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device including through electrode and method of manufacturing the same

FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS

Low fabrication cost, fine pitch and high reliability solder bump

Etching solution for etching metal layer, etching method using the etching solution, and method of fabricating semiconductor product using the etching solution

Semiconductor chip structure

Chip package and method for fabricating the same

Solder elements with columnar structures and methods of making the same

Methods of forming electronic structures including conductive shunt layers and related structures

Solder bumps in flip-chip technologies

Compliant Bumps for Integrated Circuits Using Carbon Nanotubes

Methods and apparatus for packaging integrated circuit devices

Semiconductor device and method of producing the same

Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween

Semiconductor package and method of manufacturing the same

Flip chip package and method of fabricating the same

Method for applying solder to redistribution lines

Microelectronic assembly with back side metallization and method for forming the same

Electronic component, semiconductor device employing same, and method for manufacturing electronic component

Method of wafer plating

Composition for removing a photoresist and method of forming a bump electrode

METHODS OF FORMING SOLDER CONNECTIONS AND STRUCTURE THEREOF

Methods of forming solder connections and structure thereof

Semiconductor device and method for producing the semiconductor device

HIGHLY COMPLIANT PLATE FOR WAFER BONDING

Microelectronic element chips

Semiconductor device and method for fabricating the same

Barrier layer for fine-pitch mask-based substrate bumping

Non-cyanide gold electroplating for fine-line gold traces and gold pads

Semiconductor component with connecting elements and method for producing the same

Device Comprising Circuit Elements Connected By Bonding Bump Structure

Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold

Method of providing solder bumps using reflow in a forming gas atmosphere

Ultrasound Transducer and Method for Implementing High Aspect Ration Bumps for Flip-Chip Two Dimensional Arrays

Semiconductor device and method of producing the same

Increased interconnect density electronic package and method of fabrication

Test pads on flash memory cards

CHIP STRUCTURE AND FABRICATING PROCESS THEREOF

Method for forming C4 connections on integrated circuit chips and the resulting devices

Semiconductor device and method of manufacturing the semiconductor device

Method for Electroplating and Contact Projection Arrangement

Method of manufacturing a through electrode

Solder joint flip chip interconnection having relief structure

Direct-write wafer level chip scale package

NOVEL UNDER-BUMP METALLIZATION FOR BOND PAD SOLDERING

Bilayer Laminated Film for Bump Formation and Method of Bump Formation

Semiconductor device having adhesion increasing film to prevent peeling

Semiconductor device and method for manufacturing the same

Method for forming metal bumps

Semiconductor device manufacturing method

Method of manufacturing semiconductor device

Isolating chip-to-chip contact

Semiconductor chip comprising a metal coating structure and associated production method

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Method for manufacturing bump of wafer level package

Method of forming a bump and a connector structure having the bump

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Chip package and method for fabricating the same

METHOD OF FABRICATING ULTRA THIN FLIP-CHIP PACKAGE

Processed wafer via

Stacked chip-based system and method

Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow

Method of fabrication on high coplanarity of copper pillar for flip chip packaging application

CHIP CONNECTOR

Method for forming a redistribution layer in a wafer structure

Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor

Bare chip embedded PCB

Tooling for coupling multiple electronic chips

Method for making flip chip on leadframe package

Triaxial through-chip connection

Method for fabricating circuit component

Microelectronic interconnect device comprising localised conductive pins

Semiconductor device having alignment post electrode and method of manufacturing the same

Semiconductor chip with bond area

Back-to-front via process

Methods of forming back side layers for thinned wafers

Thermally balanced via

Electronic device and method of manufacturing the same

Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps

Manufacturing method for semiconductor device and semiconductor device

System and method for solder bumping using a disposable mask and a barrier layer

Test pads on flash memory cards

System, apparatus, and method for advanced solder bumping

Nanostructure-based package interconnect

CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS

Method for mounting chip component and circuit board

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method of the same

Coaxial through chip connection

Methods and apparatus for packaging integrated circuit devices

Method for mounting bumps on an under metallurgy layer

Chip package structure

Integrated circuit chip with external pads and process for fabricating such a chip

Interconnect structure of an integrated circuit and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

CIRCUIT FILM WITH BUMP, FILM PACKAGE USING THE SAME, AND RELATED FABRICATION METHODS

Method for forming solder balls with a stable oxide layer by controlling the reflow ambient

Flip chip package and manufacturing method of the same

Pin-type chip tooling

Structure of bumps forming on an under metallurgy layer and method for making the same

Semiconductor device having align mark layer and method of fabricating the same

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Alloys for flip chip interconnects and bumps

Method for producing and cleaning surface-mountable bases with external contacts

Damascene patterning of barrier layer metal for C4 solder bumps

Wafer redistribution structure with metallic pillar and method for fabricating the same

Chip structure and manufacturing method of the same

Semiconductor device

Method of Forming Bump, Method of Forming Image Sensor Using the Method, Semiconductor Chip and the Sensor so Formed

Electrical interconnection structure formation

Solder joint flip chip interconnection

Photosensitive composition

Semiconductor chip with post-passivation scheme formed over passivation layer

Semiconductor package with controlled solder bump wetting

Method for forming solder contacts on mounted substrates

Method for forming bumps

Etchant and method for forming bumps

Method for forming improved bump structure

Intermetallic solder with low melting point

Electronic circuit chip, and electronic circuit device and method for manufacturing the same

Semiconductor device and a method of manufacturing the same

Contacts to microdevices

Integrated circuit solder bumping system

Display device and manufacturing method of the same

Chip structure and chip package structure

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

Method for forming a double embossing structure

METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT FORMED THEREBY

Copper bump barrier cap to reduce electrical resistance

Display panel package

Semiconductor device and method of manufacturing the same

Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side

Solder composition for electronic devices

Fluxless bumping process

Metal pad or metal bump over pad exposed by passivation layer

Semiconductor element with conductive bumps and fabrication method thereof

Bonding pad on IC substrate and method for making the same

Technique for forming a copper-based contact layer without a terminal metal

Method of fabricating self-assembled electrical interconnections

Self-assembled interconnection particles

Methods for forming flexible column die interconnects and resulting structures

Method of forming solder bump with reduced surface defects

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Forming of conductive bumps for an integrated circuit

Method for forming high reliability bump structure

Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography

Polygonal, rounded, and circular flip chip ball grid array board

Multi-component integrated circuit contacts

Method and structure for interfacing electronic devices

Semiconductor device

Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material