Semiconductor device and manufacturing method of the same

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion

Circuitry component and method for forming the same

Ultrathin semiconductor circuit having contact bumps

Methods for bonding and micro-electronic devices produced according to such methods

Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer

Post passivation structure for a semiconductor device and packaging process for same

Coaxial through chip connection

Post-attachment chip-to-chip connection

Tack & fuse chip bonding

Routingless chip architecture

Rigid-backed, membrane-based chip tooling

Through chip connection

Chip-based thermo-stack

Pre-solder structure on semiconductor package substrate and method for fabricating the same

Substrate for pre-soldering material and fabrication method thereof

Active packaging

Chip spanning connection

Inverse chip connector

Chip connector

Post & penetration interconnection

Triaxial through-chip connection

Profiled contact

Chip capacitive coupling

Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump

Electronic chip contact structure

Patterned contact

Contact-based encapsulation

Membrane-based chip tooling

METHOD FOR FORMING BUMPS

Capping copper bumps

Offset solder bump method and apparatus

Wafer level pre-packaged flip chip systems

Wafer level pre-packaged flip chip

Backside method for fabricating semiconductor components with conductive interconnects

Semiconductor device and fabrication method thereof

Wafer level pre-packaged flip chip

Semiconductor device and method of fabricating the same

Wafer level pre-packaged flip chip system

Contact structure on chip and package thereof

Conductive bump structure for semiconductor device and fabrication method thereof

Semiconductor package with controlled solder bump wetting and fabrication method therefor

Solder bumps in flip-chip technologies

Semiconductor device including an under electrode and a bump electrode

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Electronic devices including offset conductive bumps

Packing method for electronic components

Electronic device and method for fabricating the same

Chip scale surface mounted device and process of manufacture

Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

Semiconductor device having a functional surface

Forming solder balls on substrates

Conductive bump structure of circuit board and method for fabricating the same

FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME

Application of impressed-current cathodic protection to prevent metal corrosion and oxidation

Semiconductor device production method and semiconductor device

Microelectronic assemblies having compliancy

Semiconductor device and manufacturing method thereof

Semiconductor device and unit equipped with the same

Accurate relative alignment and epoxy-free attachment of optical elements

Tools and methods for forming conductive bumps on microelectronic elements

Method of forming a wear-resistant dielectric layer

Semiconductor device and fabrication method thereof

Efficient method of forming and assembling a microelectronic chip including solder bumps

Bump structure of semiconductor device and method of manufacturing the same

Electronic device and method for fabricating the same

Apparatus for plating a semiconductor wafer and plating solution bath used therein

Thin array plastic package without die attach pad and process for fabricating the same

Method of metal sputtering for integrated circuit metal routing

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Method for fabricating module of semiconductor chip

Plating apparatus and plating method

Solder structures for out of plane connections

Semiconductor device and fabrication method thereof

Semiconductor device and fabrication method thereof

Method for constructing contact formations

Wafer structure, chip structure, and fabricating process thereof

Manufacturing method of semiconductor device

Semiconductor device and manufacturing method therefor

Repairable three-dimensional semiconductor subsystem

Method of manufacturing a semiconductor device

Solder bump composition for flip chip

Reinforced solder bump structure and method for forming a reinforced solder bump

Plating apparatus

Method for removing resin mask layer and method for manufacturing solder bumped substrate

Solder for fabricating solder bumps and pumping process

Probe arrays and method for making

Flip chip bonding structure using non-conductive adhesive and related fabrication method

Semiconductor device having through electrode and method of manufacturing the same

Bumping process

Bumping process and structure thereof

Fabrication method of a wafer structure

Bumping process and structure thereof

UBM STRUCTURE FOR IMPROVING RELIABILITY AND PERFORMANCE

Bumping process and structure thereof

Plating apparatus and plating method

Resist sidewall spacer for C4 BLM undercut control

Semiconductor substrate thinning method for manufacturing thinned die

Nano-sized metals and alloys, and methods of assembling packages containing same

Semiconductor element including a wet prevention film

Wafer scale integration packaging and method of making and using the same

Production methods for a leadframe and electronic devices

Method for forming a redistribution layer in a wafer structure

Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip

Packaging with metal studs formed on solder pads

Semiconductor device and method for fabricating the same

Method for reducing lead precipitation during wafer processing

Semiconductor device

Method for fabricating semiconductor package with circuit side polymer layer

Method for processing a base that includes connecting a first base to a second base with an insulating film

Method for processing base

Damascene patterning of barrier layer metal for C4 solder bumps

Method of manufacturing semiconductor device

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device

Methods of forming electronic structures including conductive shunt layers and related structures

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Semiconductor devices with permanent polymer stencil and method for manufacturing the same

Method for ultra thinning bumped wafers for flip chip

Highly compliant plate for wafer bonding

Multi-component integrated circuit contacts

Circuit film with bump, film package using the same, and related fabrication methods

Electronic assembly with carbon nanotube contact formations or interconnections

Method for fabricating chip structure

Method for forming bump on electrode pad with use of double-layered film

Underfill and encapsulation of semiconductor assemblies with materials having differing properties

Method of forming a solder bump and the structure thereof

Lead-free bonding systems

Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device, and electro-optical apparatus

Semiconductor device having adhesion increasing film to prevent peeling

Screen printing method of forming conductive bumps

Methods for producing an electronic device having microscopically small contact areas

Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface

Semiconductor device and method of manufacturing the semiconductor device

Methods of forming solder bumps on exposed metal pads

Method for making an interconnect pad

INTEGRATED CIRCUIT PACKAGE WITH DIFFERENT HARDNESS BUMP PAD AND BUMP AND MANUFACTURING METHOD THEREFOR

Display device and manufacturing method of the same

Method for manufacturing an interconnect

Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device

Semiconductor device having a refractory metal containing film and method for manufacturing the same

Semiconductor device with read out prevention and method of producing same

Chip package structure and process for fabricating the same

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device

Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor

Semiconductor flip-chip package and method for the fabrication thereof

Through electrode, spacer provided with the through electrode, and method of manufacturing the same

Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both

Methods of forming bumps using barrier layers as etch masks

METHOD FOR FORMING PHOTORESIST LAYER ON SUBSRTATE AND BUMPING PROCESS USING THE SAME

Low fabrication cost, high performance, high reliability chip scale package

BUMPING PROCESS, BUMP STRUCTURE, PACKAGING PROCESS AND PACKAGE STRUCTURE

Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment

Solder bump structure and method for forming a solder bump

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Microelectronic device interconnects

Circuit component with bump formed over chip

Low fabrication cost, high performance, high reliability chip scale package

Manufacturing method for semiconductor device and semiconductor device

Chip scale surface mounted device and process of manufacture

Method and structure for interfacing electronic devices

BUMPING PROCESS OF LIGHT EMITTING DIODE

Bumping process of light emitting diode

Wafer-level package and method for production thereof

Pre-solder structure on semiconductor package substrate and method for fabricating the same

Method of forming solder bump with reduced surface defects

Structure and method for temporarily holding integrated circuit chips in accurate alignment

Light-emitting diode chip package body and packaging method thereof

UBM for fine pitch solder ball and flip-chip packaging method using the same

Semiconductor device and manufacturing method thereof

Lithographic contact elements

Capacitor device and method of manufacturing the same

Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed

Semiconductor device with intermediate connector

Semiconductor device and method of fabricating the same

Methods of providing solder structures for out plane connections

Methods of forming solder areas on electronic components and electronic components having solder areas

Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same

Selective deposition of solder ball contacts

Semiconductor device and method of manufacturing the same

Semiconductor device and method of fabricating the same

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Methods and apparatus for packaging integrated circuit devices

Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer

Method of manufacturing a semiconductor device having an enhanced electrode pad structure

Semiconductor device and method of manufacturing the same

Bath and method for high rate copper deposition

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of fabricating ultra thin flip-chip package

Method for forming solder bump structure

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Processes and tools for forming lead-free alloy solder precursors

Method of forming bumps

Electronic circuit device and porduction method therefor

Large bumps for optical flip chips

Large bumps for optical flip chips

Reliable metal bumps on top of I/O pads after removal of test probe marks

Substrate for pre-soldering material and fabrication method thereof

Bumped wafer with adhesive layer encompassing bumps and manufacturing method thereof

Solder bump structure and method for forming the same

Method for chemical etch control of noble metals in the presence of less noble metals

Process for forming lead-free bump on electronic component

Method of enhancing the adhesion between photoresist layer and substrate and bumping process

Method of metal sputtering for integrated circuit metal routing

Composition for removing photoresist and method of forming a bump electrode in a semiconductor device using the composition

Low fabrication cost, fine pitch and high reliability solder bump

Process for manufacturing multilayer flexible wiring boards

ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER

Bonding structure with pillar and cap

Semiconductor device with strain relieving bump design

CHIP STRUCTURE WITH BUMPS AND A PROCESS FOR FABRICATING THE SAME

Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer

Under-bump metallization layers and electroplated solder bumping technology for flip-chip

Under-bump metallugical structure

Packaging assembly and method of assembling the same

Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode

Bump electrodes having multiple under ball metallurgy (UBM) layers

Semiconductor device with under bump metallurgy and method for fabricating the same

Anodes for electroplating operations, and methods of forming materials over semiconductor substrates

Wafer-level chip-scale package structure utilizing conductive polymer