209745 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors; Disposition being disposed on at least two different sides of the body, e.g. dual array
Quilt packaging system with mated metal interconnect nodules and voids
#2Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
#3Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
#4Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die
#5Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die
#6Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die
#7Chip having side pad, method of fabricating the same and package using the same