209746 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors Material
Sub-classes:BONDING THROUGH MULTI-SHOT LASER REFLOW
#2NO-REMELT SOLDER ENFORCEMENT JOINT
#3Bonding through multi-shot laser reflow
#4Bonding through multi-shot laser reflow
#5Semiconductor package having magnetic interconnects and related methods
#6Semiconductor package structure and method of manufacturing the same
#7Stretchable and self-healing solders for dies and components in manufacturing environments
#8Bonding through multi-shot laser reflow
#9CHIP ASSEMBLIES EMPLOYING SOLDER BONDS TO BACK-SIDE LANDS INCLUDING AN ELECTROLYTIC NICKEL LAYER
#10Removable sacrificial connections for semiconductor devices
#11Package on package configuration
#12Semiconductor package, interposer and semiconductor process for manufacturing the same
#13Semiconductor package having a solder-on-pad structure
#14High temperature solder paste
#15Removable sacrificial connections for semiconductor devices
#16Quilt packaging system with mated metal interconnect nodules and voids
#17Metal bump joint structure
#18Electronic device
#19Semiconductor packages
#20Metal bump joint structure
#21Semiconductor package
#22Stacked package and method of manufacturing the same
#23Semiconductor device and fabrication method thereof
#24Variable temperature solders for multi-chip module packaging and repackaging
#25Metal bump joint structure and methods of forming
#26Metal bump joint structure
#27SEMICONDUCTOR PACKAGES