Wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip

Semiconductor device having through electrode and method of manufacturing the same

Semiconductor device and system having semiconductor device mounted thereon

Signal isolation in a package substrate

Substrate structure and the fabrication method thereof

Chip-on-board assemblies

Component with sensitive component structures and method for the production thereof

CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies

Module with built-in component

Module having stacked chip scale semiconductor packages

Package structure of chip and the package method thereof

Chip-package structure and fabrication process thereof

Electronic component comprising a cooling surface

Method for recording identification information on semiconductor chip, and imaging device

Bond head link assembly for a wire bonding machine

Wiring board, method for manufacturing same, and semiconductor package

Semiconductor module

Semiconductor device and manufacturing method therefor

Soldered assemblies and methods of making the same

Ball grid array package with thermally-enhanced heat spreader

Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Microelectronic loop packages

Physical quantity sensor, lead frame, and manufacturing method therefor

Electronic circuit protection device

Circuit assembly with surface-mount IC package and heat sink

Semiconductor package and fabrication method thereof

Assembly structure and method for chip scale package

Stacked chip security

Lead frame with attached components

Curable silicone rubber composition and semiconductor device

Method of fabricating wiring board and method of fabricating semiconductor device

Manufacturing method for an electronic component assembly and corresponding electronic component assembly

Method of making semiconductor BGA package having a segmented voltage plane

Method for producing a protective assembly for protecting an electronic component from electrostatic discharge, and correspondingly configured electronic component

Methods for packaging an image sensor and a packaged image sensor

Epoxy bump for overhang die

Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging

Semiconductor element and manufacturing method thereof

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Taped semiconductor device and method of manufacture

Semiconductor device having capacitive insulation means and communication terminal using the device

Power module package structure

Semiconductor device

Encapsulated power semiconductor assembly

Varied-thickness heat sink for integrated circuit (IC) package

Graded liquid crystal polymer package

Semiconductor BGA package having a segmented voltage plane

System for assembling electronic components of an electronic system

Stacked semiconductor package assembly having hollowed substrate

Image sensitive electronic device packages

Semiconductor device

Method for efficiently producing removable peripheral cards

Tab package connecting host device element

Methods of making integrated circuits

Panel and semiconductor device having a composite plate with semiconductor chips

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Integrated circuit with substantially perpendicular wire bonds

Semiconductor device

System and method for die attach using a backside heat spreader

Semiconductor package and leadframe therefor having angled corners

Semiconductor chip with coil element over passivation layer

Composite material, electrical circuit or electric module

Jig structure for manufacturing an image sensor

Semiconductor integrated circuit device

CHIP PACKAGE STRUCTURE

Methods and apparatuses for encapsulating microelectronic devices

Wafer level pre-packaged flip chip systems

Multi-chip module and methods

Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same

Wafer level pre-packaged flip chip

SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same

Low cost power semiconductor module without substrate

LED package structure and method making of the same

System-in-a-package based flash memory card

Microelectronic imagers and methods of packaging microelectronic imagers

Light emitting device package and method for manufacturing the same

Method and device for producing a bondable area region on a carrier

Wafer level pre-packaged flip chip

Method and system for solder die attach

Wafer-level electro-optical semiconductor manufacture fabrication method

Integrated circuit package including miniature antenna

Magnetic assist manufacturing to reduce mold flash and assist with heat slug assembly

Wafer level pre-packaged flip chip system

Flip chip package having protective cap and method of fabricating the same

Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection

Semiconductor module provided with contacts extending through the package

Lid used in package structure and the package structure having the same

Multi stack packaging chip and method of manufacturing the same

Semiconductor device with sealed semiconductor chip

Method for encapsulating a semiconductor device and semiconductor device

Semiconductor device and manufacturing method of the same

Wire loop, semiconductor device having same and wire bonding method

Camera-assisted adjustment of bonding head elements

Signal isolators using micro-transformers

Bond pad structure comprising multiple bond pads with metal overlap

Multiple chip package module including die stacked over encapsulated package

Semiconductor device with passivation layer covering wiring layer

Package for receiving electronic parts, and electronic device and mounting structure thereof

Semiconductor device with substrate having penetrating hole having a protrusion

Large die package and method for the fabrication thereof

SEMICONDUCTOR PACKAGE HAVING ULTRA-THIN THICKNESS AND METHOD OF MANUFACTURING THE SAME

Multi-chip module and method of manufacture

Multiple etch-stop layer deposition scheme and materials

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions

Three dimensional packaging optimized for high frequency circuitry

Semiconductor power module package

Power switching control device for electric systems

Memory packages having stair step interconnection layers

Electronic component and electronic configuration

Microelectronic component and assembly having leads with offset portions

Method of manufacturing a semiconductor apparatus

Multi-chip semiconductor package

Semiconductor device with a rewiring level and method for producing the same

Circuit board with built-in electronic component and method for manufacturing the same

Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam

Semiconductor device assemblies with compliant spring contact structures

Fabrication of compliant spring contact structures and use thereof

Semiconductor device with terminals, and method of manufacturing the same

Method of making a multi-chip electronic package having laminate carrier

Semiconductor die edge reconditioning

Standoffs for centralizing internals in packaging process

Shielding arrangement to protect a circuit from stray magnetic fields

Substrate for mounting electronic part and electronic part

Multilayer printed wiring board

Leadframe with encapsulant guide and method for the fabrication thereof

Method of forming a substrateless semiconductor package

Electronic device

Semiconductor device with self-aligning contactless interface

Production method of a multilayer ceramic substrate

Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

Coolant cooled type semiconductor device

Semiconductor device and manufacturing method thereof

BGA semiconductor chip package and mounting structure thereof

Semiconductor package accomplishing fan-out structure through wire bonding

Thermally enhanced semiconductor package and fabrication method thereof

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

High density direct connect LOC assembly

Semiconductor device having resin-sealed area on circuit board thereof

ELECTRICAL PACKAGE STRUCTURE INCLUDING CHIP WITH POLYMER THEREON

Semiconductor device including ROM interface pad

Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density

Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating

Chip package

Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package

Reinforced bond pad for a semiconductor device

Power semiconductor module

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement

Strobe light control circuit and IGBT device

Method of manufacturing flexible circuit substrate

Molding method for foldover package

Semiconductor device to be applied to various types of semiconductor package

Stacked die package

Multi-chip package and method for manufacturing the same

Method of mounting an integrated circuit package in an encapsulant cavity

ELECTRONIC DEVICE PACKAGE

Circuit device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides

Stacked-type semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same, metal component and method of manufacturing the same

Electronic package with a stepped-pitch leadframe

Package structure having mixed circuit and composite substrate

Semiconductor device and method of manufacturing the same

Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same

CURRENT SENSOR

Package structure and fabrication thereof

Universal interconnect die

Stacked die-in-die BGA package with die having a recess

Microelectronics devices, having vias, and packaged microelectronic devices having vias

Schottky diode device with aluminum pickup of backside cathode

Integrated circuit for communications modules

Integrated circuit carrier

Semiconductor device having a functional surface

Semiconductor device including an arrangement for detection of tampering

Semiconductor device and manufacturing method thereof

LED package structure and method for making the same

Leadframe for semiconductor device

Device and applications for passive RF components in leadframes

Method for producing a wire connection

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Flip-chip adaptor package for bare die

Semiconductor device

Electronic assembly with integral thermal transient suppression

Microelectronic component assemblies with recessed wire bonds and methods of making same

Three-dimensional package

Double density method for wirebond interconnect

Semiconductor device package

Semiconductor chip and semiconductor device including the same

Miniature optical element for wireless bonding in an electronic instrument

Method for manufacturing a semiconductor package with a laminated chip cavity

Solder masks used in encapsulation, assemblies including the solar mask, and methods

Electronic package with integrated capacitor

Current regulator having a transistor and a measuring resistor

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Printed wiring board and method for manufacturing the same

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package

Chip package and fabricating method thereof

Semiconductor device, semiconductor body and method of manufacturing thereof

Impedance matching external component connections with uncompensated leads

Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads

Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices have conductive complementary structures

Encapsulated light receiving and processing semiconductor module with enhanced shielding and grounding properties

Semiconductor device

Low profile small outline leadless semiconductor device package

Electrical device allowing for increased device densities

Stacked microfeature devices

Microelectronic devices and methods for forming interconnects in microelectronic devices

Semiconductor integrated circuit and semiconductor device

Ultra thin dual chip image sensor package structure and method for fabrication

Semiconductor device having a plastic housing and external connections and method for producing the same

HEAT SINK AND PACKAGE STRUCTURE

Chip-packaging with bonding options having a plurality of package substrates

Integrated circuit package system with die and package combination

PHOTO DETECTOR PACKAGE

Semiconductor package with passive device integration

Integrated circuit package with lead fingers extending into a slot of a die paddle

MULTI-CHIP BALL GRID ARRAY PACKAGE

Package for high frequency usages and its manufacturing method

Integrated circuit with staggered differential wire bond pairs

Chip scale package having flip chip interconnect on die paddle

Integrated connection arrangements

Ultra thin dual chip image sensor package structure and method for fabrication

Chip stack employing a flex circuit

Integrated circuit and wireless IC tag

Semiconductor package having double layer leadframe

Integrated circuit package and method of manufacture thereof

Semiconductor device package, method of manufacturing the same, and semiconductor device

Method of making reinforced semiconductor package

Encapsulation of circuit components to reduce thermal cycling stress

Low cost method to produce high volume lead frames

Microfeature systems including adhered microfeature workpieces and support members

Integrated circuit package-in-package system

Thermally conductive resin sheet and power module using the same

Input and output circuit of an integrated circuit chip

Semiconductor device with chip-on-board structure

Semiconductor device and manufacturing method thereof

High frequency arrangement

Electronic component with stacked semiconductor chips and method for producing the same

Semiconductor device

Semiconductor packages and methods for making and using same

Module card structure

Semiconductor package having improved adhesiveness and ground bonding

Semiconductor device and manufacturing process therefor

Wire bonding method

Current sensor

Forming a cap above a metal layer

Semiconductor device

Component arrangement for series terminal for high-voltage applications

Substrate for an FBGA semiconductor component

Method for producing an FBGA component and substrate for carrying out the method

Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices

Chip package and producing method thereof

Semiconductor device and process for fabrication thereof

Semiconductor storage device, semiconductor device, and manufacturing method therefor

IC chip coating material and vacuum fluorescent display device using same

Perimeter matrix ball grid array circuit package with a populated center

Methods of adhering microfeature workpieces, including a chip, to a support member

Minimized wire bonds in transient blocking unit packaging

Semiconductor apparatus

Molded package and semiconductor device using molded package

Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner

High performance IC package and method

Ball grid array package

Interposers with flexible solder pad elements

Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof

Nested integrated circuit package on package system

Integrated circuit package system using interposer

Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods

Multi-leadframe semiconductor package and method of manufacture

Smart card, smart card module, and a method for production of a smart card module

Wire bonding method

Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

Fabrication of stacked microelectronic devices

Semiconductor device and a method of manufacturing the same

Device packages

Method of embedding semiconductor element in carrier and embedded structure thereof

Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages

Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

Method of fabricating a semiconductor stacked multi-package module having inverted second package

Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA)

Device packages having stable wirebonds

Semiconductor laser, method of mounting semiconductor laser, semiconductor laser mounted structure, and optical disk system

Semiconductor module

Image pick-up inspection equipment and method

Device package

Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages

Method and apparatus for packaging an electronic chip

Transducer assembly, capillary and wire bonding method using the same

Molding tool and a method of forming an electronic device package

Printed wiring board having a solder pad and a method for manufacturing the same

Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same

Thermal enhanced package for block mold assembly

Electronic component for radio frequency applications and method for producing the same

Integrated circuit package encapsulating a hermetically sealed device

Semiconductor device

Semiconductor device