211270 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus by applying pressure, e.g. by injection
LOGIC DRIVE WITH BRAIN-LIKE ELASTICITY AND INTEGRALITY BASED ON STANDARD COMMODITY FPGA IC CHIPS USING NON-VOLATILE MEMORY CELLS
#2SEMICONDUCTOR PACKAGES WITH A BRIDGE SEMICONDUCTOR DIE AND METHODS FOR FORMING THE SAME
#3LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS COMPRISING NON-VOLATILE RANDOM ACCESS MEMORY CELLS
#4LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS COMPRISING NON-VOLATILE RANDOM ACCESS MEMORY CELLS
#5RESIN COMPOSITION AND METHOD OF FORMING A SEMICONDUCTOR PACKAGE WITH UNDERFILL USING THE SAME
#6METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#7INTERCONNECTING A PRINTED-CIRCUIT-BOARD SUBSTRATE TO ANOTHER SUBSTRATE OR TO A DIE
#8SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
#9Wafer Level Integration of Passive Devices
#10PROCESS FOR FLIP CHIP PACKAGING
#11Packaging electronic device with liquid thermal interface material
#12Method for packaging stacking flip chip
#13SINTER BONDING SHEET
#14STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
#15LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS COMPRISING NON-VOLATILE RANDOM ACCESS MEMORY CELLS
#16SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPROVED PACKAGE RELIABILITY
#17PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON CORE OF THE PACKAGE SUBSTRATE
#18SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD
#19SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#20SINTERING FILM FRAMES AND RELATED METHODS
#21SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#22METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS
#23CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE BOARD COMPRISING SAME
#24LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS COMPRISING NON-VOLATILE RANDOM ACCESS MEMORY CELLS
#25Wafer level chip scale packaging intermediate structure apparatus and method
#26DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
#27DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
#28Semiconductor package with dual sides of metal routing
#29Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
#30Power semiconductor component and method for producing a power semiconductor component
#31Wafer Level Integration of Passive Devices
#32Camera module, and photosensitive assembly and manufacturing method therefor
#33SEMICONDUCTOR DEVICE WITH THIN REDISTRIBUTION LAYERS
#34Semiconductor device and manufacturing method thereof
#35Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells
#36Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells
#37Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
#38Semiconductor device and method
#39Wafer level chip scale packaging intermediate structure apparatus and method
#40Semiconductor device with thin redistribution layers
#41DAM FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
#42Semiconductor structure and manufacturing method thereof
#43Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
#44Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
#45Package-on-package structure
#46Semiconductor device and manufacturing method thereof
#47Wafer level chip scale packaging intermediate structure apparatus and method
#48Multi-die package with bridge layer
#49Semiconductor device
#50Package-on-package structure
#51Plurality of light emitting devices having opaque insulating layer between them
#52Semiconductor package and method of manufacturing the same
#53Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells
#54Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
#55Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells
#56Contact structures with porous networks for solder connections, and methods of fabricating same
#57Semiconductor structure and manufacturing method thereof
#58Bonding method of semiconductor chip and bonding apparatus of semiconductor chip
#59SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#60Wafer level integration of passive devices
#61Semiconductor device with thin redistribution layers
#62Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
#63Semiconductor packages
#64Device and method for reworking flip chip components
#65Dummy flip chip bumps for reducing stress
#66Integrated circuit with a thermally conductive underfill
#67Semiconductor devices and semiconductor devices including a redistribution layer
#68Logic drive using standard commodity programmable logic IC chips comprising non-volatile radom access memory cells
#69Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
#70Substrate device, electronic apparatus, and method for manufacturing substrate device
#71Semiconductor packaging structure and process
#72Package-on-package (PoP) structure including stud bulbs
#73Semiconductor die assemblies with heat sink and associated systems and methods
#74Semiconductor device and method
#75Semiconductor package and method of manufacturing the same
#76INVERSION-TYPE PACKAGE STRUCTURE FOR FLIP CHIP AND FLIP CHIP HAVING THE SAME
#77Semiconductor device package and method of manufacturing the same
#78Wafer level chip scale packaging intermediate structure apparatus and method
#79Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
#80Dam for three-dimensional integrated circuit
#81METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS
#82Semiconductor device and manufacturing method thereof
#83Method of fabricating packaging structure
#84Wiring structure, semiconductor package structure and semiconductor process
#85Wiring substrate and semiconductor device
#86Solid-state image pickup apparatus, method of manufacturing solid-state image pickup apparatus, and electronic apparatus
#87Semiconductor device with thin redistribution layers
#88Package-on-package (PoP) structure including stud bulbs
#89SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#90Systems and methods for bonding semiconductor elements
#91Package on-package structure
#92Self-alignment for redistribution layer
#93Mounting structure and method for manufacturing same
#94Semiconductor device including semiconductor chips mounted over both surfaces of substrate
#95Semiconductor devices including conductive pillars
#96Semiconductor packaging structure and process
#97Semiconductor die assemblies with heat sink and associated systems and methods
#98Bonding method of semiconductor chip and bonding apparatus of semiconductor chip
#99Dummy flip chip bumps for reducing stress
#100Methods for making multi-die package with bridge layer
#101Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
#102Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#103Method and materials for warpage thermal and interconnect solutions
#104Coupling inductors in an IC device using interconnecting elements with solder caps and resulting devices
#105Semiconductor device and method of manufacturing the same
#106Semiconductor chip mounted on a packaging substrate
#107Die attachment for packaged semiconductor device
#108Bonding structure for semiconductor package and method of manufacturing the same
#109Package on-package (PoP) structure including stud bulbs
#1103DIC stacking device and method of manufacture
#111Semiconductor package and method of manufacturing thereof
#112Film for semiconductor back surface and its use
#113Semiconductor device including semiconductor chips mounted over both surfaces of substrate
#114Semiconductor substrate and semiconductor package structure having the same
#115Reliable device assembly
#116Semiconductor device and manufacturing method thereof
#117Semiconductor device and manufacturing method thereof
#118Semiconductor die assemblies with heat sink and associated systems and methods
#119Methods of forming conductive materials on semiconductor devices, and methods of forming electrical interconnects
#120Substrate for mounting chip and chip package
#121Method of manufacturing semiconductor device
#122Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof
#123Semiconductor device
#124Dummy flip chip bumps for reducing stress
#125Solder joint structure for ball grid array in wafer level package
#126Integrated millimeter-wave chip package
#127Semiconductor device, method for manufacturing the same, and electronic device
#128Electrical apparatus
#129Bonding method of semiconductor chip and bonding apparatus of semiconductor chip
#130Die attachment for packaged semiconductor device
#131Integrated circuit with a thermally conductive underfill and methods of forming same
#132Multi-die package with bridge layer and method for making the same
#133Test probe head for full wafer testing
#134Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the same
#135Electronic circuit, production method thereof, and electronic component
#136Method of manufacturing electronic device
#137Bump structural designs to minimize package defects
#138Support member, wiring substrate, method for manufacturing wiring substrate, and method for manufacturing semiconductor package
#139Wiring substrate and semiconductor device
#140Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
#141Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device
#142Method of forming package-on-package (PoP) structure having a chip package with a plurality of dies attaching to first side of an interposer with a die formed thereon
#1433D packages and methods for forming the same
#144Method of forming solder bump, and solder bump
#145Method of manufacturing stacked semiconductor package
#146Protecting flip-chip package using pre-applied fillet
#147Semiconductor device including semiconductor chips mounted over both surfaces of substrate
#148Method and materials for warpage thermal and interconnect solutions
#149Semiconductor inspecting apparatus and method of inspecting and manufacturing semiconductor device using the same
#150Dam for three-dimensional integrated circuit
#151Semiconductor device with thin redistribution layers
#152Packages with solder ball revealed through laser
#153Clamping mechanism for processing of a substrate within a substrate carrier
#154Probing chips during package formation
#155Structure and method for 3D IC package
#156Semiconductor packaging structure and process
#157Underfill pattern with gap
#158Package structure and methods of forming same
#159Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers
#160Solder joint structure for ball grid array in wafer level package
#161Self-alignment for redistribution layer
#162Package on-Package (PoP) structure including stud bulbs and method
#163Semiconductor device including semiconductor chips stacked via relay substrate
#164Semiconductor device and method of manufacturing the semiconductor device
#165Mounting structure and method for manufacturing same
#166Structure to prevent solder extrusion
#167Microelectronic Assembly With Thermally and Electrically Conductive Underfill
#168Dummy flip chip bumps for reducing stress
#169Method of forming a reliable microelectronic assembly
#170Semiconductor device having stacked chips, a re-distribution layer, and penetration electrodes
#171Package for three dimensional integrated circuit
#172Semiconductor device, method for manufacturing the same, and electronic device
#173Wafer level chip scale packaging intermediate structure apparatus and method
#174Package on-package structure
#175Interconnect structures and methods of forming same
#176Three-dimensional integrated circuit (3DIC)
#177Copper nanorod-based thermal interface material (TIM)
#178Bonding structure manufacturing method, heating and melting treatment method, and system therefor
#179Joining method and semiconductor device manufacturing method
#180Semiconductor device and manufacturing method thereof
#181Bump structural designs to minimize package defects
#182Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties
#183Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#184Electronic circuit, production method thereof, and electronic component
#185Microelectronic assembly with thermally and electrically conductive underfill
#186Semiconductor device
#187Electronic component mounting method
#188Methods for forming 3DIC package
#189Method of manufacturing semiconductor device
#190Interposer system and method
#191Integrated circuit with a thermally conductive underfill and methods of forming same
#192Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
#193Using an optically transparent solid material as a support structure for attachment of a semiconductor material to a substrate
#194Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods
#1953DIC stacking device and method of manufacture
#196Package structures and methods for forming the same
#197Heatsink attachment module
#198Three dimensional flip chip system and method
#199THREE DIMENSIONAL FLIP CHIP SYSTEM AND METHOD
#200Semiconductor device and method of depositing underfill material with uniform flow rate
#201Electronic component mounting device
#202Flip chip mounted monolithic microwave integrated circuit (MMIC) structure
#203Solder-mounted board, production method therefor, and semiconductor device
#204Semiconductor device
#205Electrode body, wiring substrate, and semiconductor device
#206Probing chips during package formation
#207Integrated circuit chip using top post-passivation technology and bottom structure technology
#208Semiconductor device and method of forming compliant conductive interconnect structure in flipchip package
#209Grown carbon nanotube die attach structures, articles, devices, and processes for making them
#210Fine-pitch package-on-package structures and methods for forming the same
#211SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF
#212Bump structural designs to minimize package defects
#213Semiconductor package including underfill layers
#214Semiconductor device and method of manufacturing the same
#215Integrated circuit constructions having through substrate vias and methods of forming integrated circuit constructions having through substrate vias
#216SURFACE MOUNT PIEZOELECTRIC OSCILLATOR
#217Semiconductor packages
#218Package-on-package (PoP) structure including stud bulbs and method
#219Joining method and semiconductor device manufacturing method
#220Package for three dimensional integrated circuit
#221Semiconductor Device and Method of Forming Sloped Surface in Patterning Layer to Separate Bumps of Semiconductor Die from Patterning Layer
#222Heatsink attachment module
#223SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME
#224Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die
#225Methods for forming 3DIC package
#226Package-on-package (PoP) structure having at least one package comprising one die being disposed in a core material between first and second surfaces of the core material
#227Wafer-level chip scale package with re-workable underfill
#228Semiconductor device package and method
#229Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof
#230Solder cap bump in semiconductor package and method of manufacturing the same
#231Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure
#232Integrated circuit system with test pads and method of manufacture thereof
#233Printed circuit board including under-fill dam and fabrication method thereof
#234Solder mask with anchor structures
#235SEMICONDUCTOR DEVICE
#236Three-dimensional integrated circuit (3DIC) formation process
#237Semiconductor apparatus, method of manufacturing semiconductor apparatus, and electronic apparatus
#238Dummy flip chip bumps for reducing stress
#239Liquid epoxy resin composition for semiconductor encapsulation
#240SOLDER DEPOSITION SYSTEM AND METHOD FOR METAL BUMPS
#241BOND LINE THICKNESS CONTROL FOR DIE ATTACHMENT
#242Semiconductor device and method for manufacturing the same
#243Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties
#244Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance
#245Manufacturing a filling of a gap in semiconductor devices
#246Substrate for semiconductor package and method for manufacturing the same
#247Protecting flip-chip package using pre-applied fillet
#248Electronic element unit and reinforcing adhesive agent
#249Method of fabricating stacked chips in a semiconductor package
#250Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assist
#251Package structure with underfilling material and packaging method thereof
#252Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device
#253Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
#254Semiconductor package having gap-filler injection-friendly structure
#255Semiconductor device, method for manufacturing the same, and electronic device
#256Method of manufacturing semiconductor device
#257SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#258Semiconductor device and method of manufacturing the same
#259High frequency flip chip package structure of polymer substrate
#260Semiconductor package and manufacturing method thereof and encapsulating method thereof
#261Method for low stress flip-chip assembly of fine-pitch semiconductor devices
#262Semiconductor device and method for manufacturing the same
#263Method for applying liquid material, device therefor, and program therefor
#264Semiconductor device and method for manufacturing the same
#265Semiconductor device and method for manufacturing the same
#266Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module
#267Semiconductor device and method of manufacturing the same
#268Semiconductor Manufacturing Method
#269High frequency flip chip package process of polymer substrate and structure thereof
#270Integrated circuit chip using top post-passivation technology and bottom structure technology
#271Semiconductor package and manufacturing method thereof and encapsulating method thereof
#272Method for low stress flip-chip assembly of fine-pitch semiconductor devices
#273Solder Interconnect
#274Molded flip chip package with enhanced mold-die adhesion
#275ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#276Wiring board with built-in electronic component and method of manufacturing same
#277Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body
#278ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
#279Method of fabricating semiconductor device having three-dimensional stacked structure
#280Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device
#281Method for manufacturing an electrode and electrode component mounted body
#282Method for manufacturing semiconductor device that includes mounting chip on board and sealing with two resins
#283Thin flip-chip method
#284Semiconductor package, method of production of same, printed circuit board, and electronic apparatus
#285Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
#286Semiconductor component with connecting elements and method for producing the same
#287LIGHT EMITTING DEVICE AND MANUFACTURE METHOD THEREOF
#288Electronic part mounting substrate and method for producing same
#289Semiconductor package with flash-absorbing mechanism and fabrication method thereof
#290Semiconductor device and manufacturing method thereof
#291Transfer molding of integrated circuit packages
#292Thin flip-chip method
#293Underfill system for die-over-die arrangements
#294Semiconductor chip with external connecting terminal
#295Semiconductor chip with external connecting terminal
#296Semiconductor chip with external connecting terminal
#297Apparatus and methods for an underfilled integrated circuit package
#298Relaxed tolerance flip chip assembly
#299Electronic part mounting substrate and method for producing same
#300Photo-semiconductor module and method for manufacturing the same