Semiconductor device for reducing propagation time of gate input signals

Semiconductor device for reducing gate wiring length

Multiple die layout for facilitating the combining of an individual die into a single die

Semiconductor device and method for manufacturing semiconductor device

Integrated electronic device with transceiving antenna and magnetic interconnection

Semiconductor devices and methods of making semiconductor devices

Module comprising a semiconductor chip

Quad flat no-lead package and manufacturing method thereof

Combined QFN and QFP semiconductor package

Semiconductor device

Fastening systems for power modules

Circuits incorporating integrated passive devices having inductances in 3D configurations and stacked with corresponding dies

Method for making a sensor device using a graphene layer

Packages with metal line crack prevention design

Three dimensional device integration method and integrated device

Integrated circuit device

Scalable semiconductor interposer integration

Power semiconductor device

Method of manufacturing resin-encapsulated semiconductor device, and lead frame

Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold

Solid state lighting apparatuses, systems, and related methods

Chip to dielectric waveguide interface for sub-millimeter wave communications link

Power semiconductor package with a common conductive clip

Wire bonding method employing two scrub settings

Structure for aluminum pad metal under ball bond

Semiconductor device

Recessed semiconductor substrates and associated techniques

Method and materials for warpage thermal and interconnect solutions

LPS solder paste based low cost fine pitch pop interconnect solutions

Semiconductor device

Semiconductor device having lead frame with notched inner leads

Semiconductor package

Semiconductor packages and methods of forming the same

Semiconductor chip and semiconductor package having the same

Power semiconductor device

Semiconductor module package and method of manufacturing the same

SEMICONDUCTOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor devices and methods of making the same

Semiconductor device

Discrete three-dimensional vertical memory comprising off-die address/data-translator

Dynamic random access memory (DRAM) and production method, semiconductor packaging component and packaging method

Semiconductor device

Semiconductor chip and semiconductor package

SEMICONDUCTOR DEVICE AND WIRE BONDING INTERCONNECTION METHOD

Semiconductor device and method of manufacturing the same

Wedge bond foot jumper connections

Electronic device including soldered surface-mount component

Manufacturing method of semiconductor device and semiconductor device

Positional relationship among components of semiconductor device

Packages with through-vias having tapered ends

Semiconductor packages and data storage devices including the same

Circuit board having bypass pad

Semiconductor device, method of manufacturing a semiconductor device, and positioning jig

Exposed die power semiconductor device

Semiconductor interposer integration

Combined substrate

Semiconductor device packaging having plurality of wires bonding to a leadframe

Package-on-package assembly with wire bond vias

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Mounting member, electronic component, and method for manufacturing module

Semiconductor device with lead terminals having portions thereof extending obliquely

Semiconductor device having plated outer leads exposed from encapsulating resin

Method for producing a multiplicity of optoelectronic semiconductor components

EDRAM/DRAM fabricated capacitors for use in on-chip PMUS and as decoupling capacitors in an integrated EDRAM/DRAM and PMU system

Method of manufacturing light-emitting device and wiring substrate for light-emitting element

Semiconductor element, semiconductor element manufacturing method, semiconductor module, semiconductor module manufacturing method, and semiconductor package

Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers

Wire-bonding apparatus and method of manufacturing semiconductor device

Chip diode and diode package

Semiconductor device manufacturing method

Thin NiB or CoB capping layer for non-noble metallic bonding landing pads

Forming a carbon nano-tube dispersion

Wire-bonding apparatus and method of wire bonding

Wire-bonding apparatus and method of manufacturing semiconductor device

Semiconductor device grid array package

Method of manufacturing semiconductor package having magnetic shield unit

Method for manufacturing semiconductor devices having a metallisation layer

Semiconductor package and fabrication method thereof

Discrete three-dimensional vertical memory comprising off-die voltage generator

WIRE BONDING METHOD WITH TWO STEP FREE AIR BALL FORMATION

METHOD FOR MOUNTING SEMICONDUCTOR SENSOR DEVICE

Encapsulated semiconductor device and method for manufacturing the same

Integrated circuit package

Optoelectronic component with a pre-oriented molecule configuration and method for producing an optoelectronic component with a pre-oriented molecule configuration

Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips

Semiconductor device

Semiconductor device with an interlocking wire bond

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Integrated circuit package fabrication

Semiconductor device

Semiconductor device

Method of manufacturing stacked package

Methods for packaging integrated circuits

Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof

Electric power semiconductor device

Semiconductor light emitting device, manufacturing method thereof, and semiconductor light emitting device package using the same

Semiconductor device including independent film layer for embedding and/or spacing semiconductor die

Multiple die face-down stacking for two or more die

Semiconductor device

Semiconductor device

Impedance controlled electrical interconnection employing meta-materials

Device and method of manufacturing the same

Magnetically coupled galvanically isolated communication using lead frame

Package assembly having a semiconductor substrate

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacture thereof

Multi-dimensional integrated circuit structures and methods of forming the same

Amplifier

Light-emitting module

Semiconductor device including embedded controller die and method of making same

Structure and formation method of chip package structure

Semiconductor device having multiple contact clips

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Methods for forming a semiconductor device package

Microelectronic unit and package with positional reversal

Passive component structure and manufacturing method thereof

Integrated package assembly for switching regulator

Power semiconductor module

Power conversion device

Integrated circuit package and methods of forming same

Semiconductor device with combined power and ground ring structure

I/O pin capacitance reduction using TSVS

Package on packaging structure and methods of making same

Integrated circuit module having a first die with a power amplifier stacked with a second die and method of making the same

Pad structure design in fan-out package

Stackable microelectronic package structures

Semiconductor device

THERMAL IMPROVEMENT FOR HOTSPOTS ON DIES IN INTEGRATED CIRCUIT PACKAGES

Stub minimization for multi-die wirebond assemblies with parallel windows

Bond pad having a trench and method for forming

Self-shielded components and methods for making the same

Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing same

Package with terminal pins with lateral reversal point and laterally exposed free end

Semiconductor apparatus

Semiconductor package with conductive clips

Reversible top/bottom MEMS package

Preparation method of a thin power device

Package on package structure and fabrication method thereof

Multi-level package assembly having conductive vias coupled to chip carrier for each level and method for manufacturing the same

Stackable microelectronic package structures

Semiconductor device

Semiconductor package including a connecting member

Semiconductor device

Semiconductor device and a manufacturing method thereof

SPI interface enhanced flash chip and chip packaging method

Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies

Semiconductor component with chip for the high-frequency range

LED package with multiple element light source and encapsulant having curved and/or planar surfaces

Method of making stacked multi-chip packaging structure

Stub minimization with terminal grids offset from center of package

Semiconductor device and method of forming stress relief layer between die and interconnect structure

Semiconductor device for transmitting electrical signals between two circuits

Methods and apparatus for package with interposers

Semiconductor device

Pre-molded integrated circuit packages

Electronic module for a piece of vehicle-borne aeronautic equipment and a piece of aeronautic equipment for an aeronautic vehicle

Molding method for COB-EUSB devices and metal housing package

Linearity performance for radio-frequency switches

Devices and methods related to radio-frequency switches having improved on-resistance performance

Radio-frequency switching devices having improved voltage handling capability

Stacked packaged integrated circuit devices, and methods of making same

Manufacturing method of a conductive shield layer in semiconductor device

Low cost hybrid high density package

Method for manufacturing semiconductor apparatus

Methods for forming semiconductor devices with stepped bond pads

Semiconductor apparatus and method for producing the same

Conductive shield for semiconductor package

Method of manufacturing semiconductor device and semiconductor device

MEMS package and a method for manufacturing the same

Surface mounted piezoelectric vibrator

Semiconductor device and method of manufacturing the same

Semiconductor package for III-nitride transistor stacked with diode

Interposer-chip-arrangement for dense packaging of chips

Array based fabrication of power semiconductor package with integrated heat spreader

Packaged semiconductor device with interior polygonal pads

Power converter package with an integrated output inductor

Connecting techniques for stacked CMOS devices

Electronic device

Electronic package, package carrier, and method of manufacturing package carrier

Package structure and methods of forming same

Tunable composite interposer

Semiconductor memory device with plural memory die and controller die

Power semiconductor device to reduce voltage variation between terminals

Semiconductor device including a MOSFET and having a super-junction structure

Multiple die stacking for two or more die

Semiconductor package

Semiconductor device and semiconductor device mounting structure

Aluminum coated copper bond wire and method of making the same

Carrier-less silicon interposer using photo patterned polymer as substrate

Semiconductor device with sealed semiconductor chip

Low profile wire bonded USB device

Independent control of stacked electronic modules

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Substrates having ball lands, semiconductor packages including the same, and methods of fabricating semiconductor packages including the same

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics

Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects

Semiconductor package

Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device

Electronic component having a corrosion-protected bonding connection and method for producing the component

Aluminum coated copper ribbon

Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods

Stacked microelectronic devices

Semiconductor device and semiconductor package having a plurality of differential signal balls

Adhesive composition and semiconductor device using same

Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system

Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV

Multi-die sensor device

Optical sensor package

High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly

Signal transmission arrangement

Memory system and assembling method of memory system

Semiconductor device and semiconductor device connection structure

Camera module and electronic device

Nanoelectromechanical antifuse and related systems

Defense against counterfeiting using antifuses

Semiconductor device and manufacturing method thereof

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor package and manufacturing method thereof

Semiconductor device and semiconductor package

Semiconductor device and method of manufacturing semiconductor device

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor device including semiconductor chips stacked via relay substrate

Semiconductor package and method of fabricating the same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

EMI shielding in semiconductor packages

Thermal dissipation through seal rings in 3DIC structure

Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball

Semiconductor packages and methods of manufacturing the same

Electronic device and method of fabricating an electronic device

METHOD FOR MANUFACTURING A FLIP-CHIP CIRCUIT CONFIGURATION AND THE FLIP-CHIP CIRCUIT CONFIGURATION

Ball grid array semiconductor package and method of manufacturing the same

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

No-flow underfill for package with interposer frame

Semiconductor device and method for producing semiconductor device

Semiconductor device and method for producing the same

Vertically integrated systems

PoP structure with electrically insulating material between packages

Method for manufacturing semiconductor device

Semiconductor integrated circuit device

Semiconductor die laminating device with independent drives

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Wirebond recess for stacked die

Semiconductor package having magnetic connection member

Chip on package structure and method

Method and apparatus for high temperature semiconductor device packages and structures using a low temperature process

Stacked semiconductor package including a smaller-area semiconductor chip

Semiconductor module for electric power

Semiconductor device and method of forming a shielding layer between stacked semiconductor die

Methods of stress balancing in gallium arsenide wafer processing

Semiconductor device package

Power semiconductor module having pattern laminated region

Electronic component assembly apparatus

System-in-package module with memory

Contactless communication unit connector assemblies with signal directing structures

Processes and structures for IC fabrication

Manufacturing method of forming an etch-back type semiconductor package with locking anchorages

Circuit module having a substrate, semiconductor chip, and molding material formed by dicing

Semiconductor package and method of fabricating the same

Stacked die package with aligned active and passive through-silicon vias

Semiconductor device and manufacturing method thereof

Package on package structure and method of manufacturing the same

Submount, encapsulated semiconductor element, and methods of manufacturing the same

Flow sensor and method for manufacturing the same

High-voltage packaged device

Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same

Power module package

Unpacked structure for power device of radio frequency power amplification module and assembly method therefor

Stacked packaging improvements

Semiconductor package

Semiconductor device for battery power voltage control

Semiconductor packages and methods for forming semiconductor package

Package structure having MEMS element

Light-emitting diode assembly and fabrication method thereof

Systems and methods for single-molecule nucleic-acid assay platforms

Contact pad structure, an electronic component, and a method for manufacturing a contact pad structure

Multi-die wirebond packages with elongated windows

3D device packaging using through-substrate pillars

Semiconductor device

Semiconductor device

Package structure

EXTERNAL CONNECTION TERMINAL, SEMICONDUCTOR PACKAGE HAVING EXTERNAL CONNECTION TERMINAL AND METHOD OF MANUFACTURING THE SAME

Stack-type semiconductor package

Explosion-protected semiconductor module

Semiconductor device and electronic unit provided with the same

Semiconductor chip and stacked semiconductor package having the same

Package-on-package assembly with wire bonds to encapsulation surface

Package carrier and manufacturing method thereof

Electronic component package and method for forming same

Die edge side connection

Copper ball bond features and structure

Stackable molded microelectronic packages

Semiconductor device including heat dissipating structure

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Semiconductor package and method of fabricating the same

Semiconductor device

Electronic device, test board, and semiconductor device manufacturing method

Semiconductor device having stacked chips

Electronic device with bimetallic interface element for wire bonding

Semiconductor device having voids between top metal layers of metal interconnects