Packaging DRAM and SOC in an IC package

Semiconductor device assemblies including face-to-face semiconductor dice and related methods

Semiconductor device

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Power semiconductor device

Printed wiring board and method for manufacturing the same

Circuit module and method of producing the same

Metallic particle paste, cured product using same, and semiconductor device

Semiconductor device and method for manufacturing the same

Apparatus and method for a component package

Method for manufacturing a semiconductor device, and semiconductor device

Semiconductor-on-insulator with back side strain topology

Light-reflective anisotropic conductive adhesive agent, and light emitting device

Monolithic bidirectional silicon carbide switching devices

Wireless communication with dielectric medium

Method of forming an integrated circuit package

Multichip power semiconductor device

Optical coupling module

Semiconductor laser structure

Semiconductor device

Dense-pitch small-pad copper wire bonded double IC chip stack packaging piece and preparation method therefor

Semiconductor package with multi-level die block

Package-on-package devices, methods of fabricating the same, and semiconductor packages

Cavity package with pre-molded cavity leadframe

Substrate, method of fabricating the same, and application the same

3D semiconductor device and structure

Power semiconductor package with gate and field electrode leads

Semiconductor packages having multiple lead frames and methods of formation thereof

Electronic package structure comprising a magnetic body and an inductive element and method for making the same

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Stack packages having token ring loops

Semiconductor device and method of forming pad layout for flipchip semiconductor die

Lead frame having a perimeter recess within periphery of component terminal

Semiconductor package including multiple chips and separate groups of leads

Semiconductor package with embedded die and its methods of fabrication

Adhesive sheet and method for manufacturing semiconductor device

Conductor pad for flexible circuits and flexible circuit incorporating the same

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Semiconductor package

Semiconductor package having a baseplate with a die attach region and a peripheral region

Memory module

Interfaces and die packages, and appartuses including the same

Semiconductor package with lead frame and recessed solder terminals

3D packages and methods for forming the same

Method to enhance reliability of through mold via TMVA part on part POP devices

Semiconductor device

Semiconductor device sealed in a resin section and method for manufacturing the same

Multi-die fine grain integrated voltage regulation

Electronic circuit device

Packaging a semiconductor device having wires with polymerized insulator skin

Methods of forming articles including metal structures having maximized bond adhesion and bond reliability

Semiconductor device and method of manufacturing the same

Segmented bond pads and methods of fabrication thereof

Multichip device including a substrate

Pad configurations for an electronic package assembly

Semiconductor device and manufacturing method thereof, and mounting method of semiconductor device

Multi-chip package having a logic chip disposed in a package substrate opening and connecting to an interposer

Method for manufacturing semiconductor device and semiconductor device

Wafer scale package for high power devices

Vertical semiconductor MOSFET device with double substrate-side multiple electrode connections and encapsulation

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

Non-leaded type semiconductor package and method of assembling same

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatus

Semiconductor module

Method for fabricating wire bonding structure

Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed

Semiconductor device, method of manufacturing the semiconductor device, and electronic device

Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Mechanisms for forming bonding structures

Semiconductor device

Semiconductor device and manufacturing method thereof

Light-emitting device

LED module having a highly reflective carrier

Power semiconductor module

Current sensor device

Semiconductor packages including a metal layer between first and second semiconductor chips

Interconnect structure

Semiconductor device having through silicon trench shielding structure surrounding RF circuit

Semiconductor device and method of fabricating the same

Semiconductor device and method of assembling same

Pin attachment

Variable-beam light source and related methods

Semiconductor device

Semiconductor packages

Substrate warpage control using external frame stiffener

Manufacturing method of semiconductor device and semiconductor device

Light emmiting diode chip

III-nitride device and FET in a package

Method and apparatus for measuring a free air ball size during wire bonding

Methods of forming conductive and insulating layers

Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same

Methods of forming conductive jumper traces

LED package and method of the same

Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system

Semiconductor packages having wire bond wall to reduce coupling

Semiconductor device comprising an output driver circuitry, a packaged semiconductor device and associated methods

Wire tail connector for a semiconductor device

Chip package

Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package

Packaged semiconductor device

Semiconductor device and a method of manufacturing the same

Leadless semiconductor package and method of manufacture

Semiconductor device and cooler thereof

Die fracture detection and humidity protection with double guard ring arrangement

Stack type semiconductor package

Semiconductor package

Semiconductor device with integrated antenna

Optical-coupling semiconductor device

Soldering method and method of manufacturing semiconductor device

Electronic circuit arrangement and method of manufacturing the same

Method for producing a semiconductor module

Dual lead frame semiconductor package and method of manufacture

Power converters having capacitive energy transfer elements and arrangements of energy storage elements for power converters

Memory module in a package

TIN-BASED WIREBOND STRUCTURES

Mold cap for semiconductor device

Semiconductor substrate and semiconductor chip

Electric magnetic shielding structure in packages

Through silicon vias for semiconductor devices and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Semiconductor device with overlapped lead terminals

Semiconductor device including cooler

Semiconductor device and radio communication device

Integrated circuit package with printed circuit layer

Semiconductor device

Aquaculture lighting devices and methods

Semiconductor package and fabrication method thereof

Semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Moisture barrier for a wire bond

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Hermetic electronics package with dual-sided electrical feedthrough configuration

Semiconductor device

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Semiconductor package with single sided substrate design and manufacturing methods thereof

Hybrid semiconductor package

Semiconductor device, electronic apparatus, and method of manufacturing semiconductor device

Method and system for co-packaging vertical gallium nitride power devices

Module and assembly with dual DC-links for three-level NPC applications

Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages

Land grid array semiconductor device packages

Semiconductor package device

Semiconductor package

Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip

Printing circuit board with traces in an insulator

Bonding structure and method

Stack packages having fastening element and halogen-free inter-package connector

Illumination device

Chip package and method for forming the same

Chip package

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Resin-encapsulated semiconductor device and its manufacturing method

Dual lead frame semiconductor package and method of manufacture

Microelectronic devices and methods for manufacturing microelectronic devices

Chip package and method for forming the same

Semiconductor device including DC-DC converter

Semiconductor device

Method for mounting a semiconductor chip on a carrier

Electronic devices and components for high efficiency power circuits

Chip package and method for forming the same

Power module with integrated current sensor

Semiconductor package structure and fabrication method thereof

Noise cancellation for a magnetically coupled communication link utilizing a lead frame

Wide bandgap semiconductor device

Power semiconductor device, method of manufacturing the device and bonding wire

Lead frame strips with support members

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Directly cooled substrates for semiconductor modules and corresponding manufacturing methods

Stackable package by using internal stacking modules

3D packages and methods for forming the same

Semiconductor device and method of forming high routing density interconnect sites on substrate

Contact pads with sidewall spacers and method of making contact pads with sidewall spacers

Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

Multi-functional detachable and replaceable wire bonding heating plate

Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same

Manufacturing method of wafer level package

Semiconductor device fabricating method

Fabrication method of semiconductor package without chip carrier

Integrated circuit package including embedded thin-film battery

Chip embedded substrate and method of producing the same

Semiconductor device, substrate and semiconductor device manufacturing method

Semiconductor device including a DC-DC converter

Chip package and manufacturing method thereof

Lead and lead frame for power package

No-exposed-pad ball grid array (BGA) packaging structures and method for manufacturing the same

Semiconductor device

Semiconductor device manufacturing method

Detection of defective electrical connections

Semiconductor package

Semiconductor device and electronic apparatus

Bonding wire for high-speed signal line

Semiconductor packages and methods of fabricating the same

Resin-sealed semiconductor device and associated wiring and support structure

Semiconductor device

Semiconductor device having an inductor mounted on a back face of a lead frame

Arrangement for energy conditioning

Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding

Impedance controlled packages with metal sheet or 2-layer rdl

Stack type semiconductor package

Electronic apparatus having a resin filled through electrode configured to go through first and second semiconductor components

Method for manufacturing electronic devices

Multi-level semiconductor package

Hybrid carbon-metal interconnect structures

Semiconductor packages having an electric device with a recess

Compact LED package with reflectivity layer

Light emitting diode device

Method for plating a semiconductor package lead

System and method of sensing current in a power semiconductor device

Method for manufacturing semiconductor devices having a metallisation layer

Power converter

Microelectronic devices and methods for filling vias in microelectronic devices

Coreless integrated circuit packaging system and method of manufacture thereof

Semiconductor device and method of manufacturing the same

Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps

Semiconductor device

Semiconductor device and method for manufacturing the same

Multi-chip semiconductor power device

Chip diode and diode package

Semiconductor component with moisture barrier for sealing semiconductor body

Semiconductor device that attenuates high-frequency oscillation

Method of making package with interposer frame

Method of manufacturing semiconductor device

Power module having stacked flip-chip and method for fabricating the power module

Method for fabricating stack die package

Formulation for packaging an electronic device and assemblies made therefrom

Method of manufacturing substrate for chip packages and method of manufacturing chip package

Method for connecting inter-layer conductors and components in 3D structures

Semiconductor package and printed circuit board

Package-on-package structure with reduced height

Semiconductor package and package on package having the same

Package-on-package with via on pad connections

Package on-package structures and methods for forming the same

Package-on-package structure and method of forming same

Package on-package structure

Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith

Semiconductor package assembly with decoupling capacitor

Package on-package with cavity in interposer

Semiconductor device

Method of manufacturing semiconductor device

No-exposed-pad quad flat no-lead (QFN) packaging structure and method for manufacturing the same

High-frequency module

Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect

Chip package and method for forming the same

Shielded gate trench MOSFET package

Method of forming a HEMT semiconductor device and structure therefor

Semiconductor module and method for manufacturing same

Light emitting device mount, light emitting apparatus including the same, and leadframe

Light-emitting module and method of manufacturing a single light-emitting structure thereof

Method for making a sensor device using a graphene layer

Methods for bonding a die and a substrate

Method of manufacturing a semiconductor device having a chip mounted on an interposer

Integrated circuit device and electronic apparatus

Semiconductor chip with modified regions for dividing the chip

Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die

Semiconductor component comprising copper metallizations

Package-on-package structure and methods for forming the same

Semiconductor devices that include a die bonded to a substrate with a gold interface layer

Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages

Method and apparatus for constructing an isolation capacitor in an integrated circuit

Field effect transitor and semiconductor device using the same

Chip-on-lead package and method of forming

Three-dimensional integrated circuit (3DIC)

MEMS device and method of formation thereof

Method for manufacturing light emitting diode packages

Floating bond pad for power semiconductor devices

Package on package structure

Semiconductor device, wireless device, and storage device

Package substrate, method of manufacturing the package substrate and semiconductor package including the package substrate

Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus

High current, low switching loss SiC power module

Multi-chip package and method of manufacturing the same

Leadframe, semiconductor device, and method of manufacturing the same

Enhanced stacked microelectronic assemblies with central contacts

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Window ball grid array (BGA) semiconductor packages

Semiconductor device

Semiconductor device

Method and an alignment plate for engaging a stiffener frame and a circuit board

Semiconductor package and method of forming the same

Medical apparatus and X-ray high voltage apparatus

Mounting structure for printed circuit board, and semiconductor device using such structure

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device

Semiconductor device

Module and method of manufacturing a module

Semiconductor device including electromagnetic absorption and shielding

Semiconductor device

Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance

Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules

Semiconductor packages and methods of packaging semiconductor devices

Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function

Semiconductor package including multiple chips and separate groups of leads

Solderless die attach to a direct bonded aluminum substrate

Semiconductor module system having encapsulated through wire interconnect (TWI)

Copper pillar full metal via electrical circuit structure