Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof

Semiconductor device

Semiconductor device, semiconductor package, and electronic device

Method of forming a protecting element comprising a first high concentration impurity region separated by an insulating region of a substrate

Semiconductor device, and manufacturing method for same

Method of manufacturing resin-encapsulated semiconductor device, and lead frame

Device including a semiconductor chip and wires

Semiconductor device with resin mold

Microelectronic package having wire bond vias and stiffening layer

Semiconductor device and method of manufacturing the same

Power transistor arrangement and method for manufacturing the same

Semiconductor package with cantilever leads

Semiconductor device and manufacturing method of the same

Light emitter devices

Microelectronic packages and methods therefor

Pre-soldered leadless package

Semiconductor package including stacked chips and a redistribution layer (RDL) structure

Semiconductor device, semiconductor device design method, semiconductor device design apparatus, and program

Integrated circuit system with distributed power supply comprising interposer and voltage regulator

Wire bonder and method of calibrating a wire bonder

Methods and arrangements relating to semiconductor packages including multi-memory dies

Finger sensor including encapsulating layer over sensing area and related methods

Sensor and method for manufacturing sensor

Heat sink for cooling of power semiconductor modules

Method of forming a power module with a magnetic device having a conductive clip

Power MOSFETs with improved efficiency for multi-channel class D audio amplifiers and packaging therefor

Method for packaging quad flat non-leaded package body, and package body

Semiconductor device including cooler

Half-bridge package with a conductive clip

Stackable microelectronic package structures

Semiconductor device

Package on package structures and methods for forming the same

Semiconductor module and method for manufacturing semiconductor module

Methods of fabricating package stack structure and method of mounting package stack structure on system board

Die package structure

Chip arrangement with low temperature co-fired ceramic and a method for forming a chip arrangement with low temperature co-fired ceramic

Shields for magnetic memory chip packages

Sensor package

Method of forming high voltage device

Illumination device with inclined light emitting element disposed on a transparent substrate

Lead frame

Method of manufacturing semiconductor device having pad region for wire-bonding

Method of manufacturing semiconductor device

Stacked semiconductor package including connections electrically connecting first and second semiconductor packages

Direct metalization of electrical circuit structures

Multi-chip package assembly with improved bond wire separation

Integrated circuit package and method of making

External storage device and method of manufacturing external storage device

Stacked half-bridge package

Stub minimization using duplicate sets of signal terminals

Power semiconductor device

Sensor system and cover device for a sensor system

Three-dimensional structure in which wiring is provided on its surface

Semiconductor device

Waterfall wire bonding

Semiconductor device and microphone

Three-dimensional structure for wiring formation

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

In situ-built pin-grid arrays for coreless substrates, and methods of making same

Semiconductor device and method of manufacturing the same

Semiconductor package

Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same

Semiconductor package with multiple conductive clips

Vertically integrated systems

Devices and systems for power conversion circuits

Integrated circuit device and method of identifying a presence of a broken connection within an external signal path

Power module

Amplifer device

Current sensor substrate and current sensor

Semiconductor integrated circuit device

Semiconductor package having supporting plate and method of forming the same

Microelectronic package with terminals on dielectric mass

Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows

Methods and apparatus for package with interposers

Semiconductor package signal routing using conductive vias

Semiconductor device carrier and semiconductor package using the same

Semiconductor die package and method for making the same

Semiconductor module

Leadframe-type semiconductor package having EMI shielding layer connected to ground

Light emitting device package

Normally off power electronic component

Semiconductor package and method for routing the package

Semiconductor module

Semiconductor device and method of manufacture thereof

Semiconductor device and method of manufacturing the same

Stacked type power device module

Light-emitting device with reflective resin

Power module semiconductor device

Method for top-side cooled semiconductor package with stacked interconnection plates

Power module having stacked substrates arranged to provide tightly-coupled source and return current paths

Semiconductor package and process for fabricating same

Integrated heater on MEMS cap for wafer scale packaged MEMS sensors

Semiconductor package

Semiconductor device including alternating source and drain regions, and respective source and drain metallic strips

Semiconductor device including gate drivers around a periphery thereof

Semiconductor device including a redistribution layer and metallic pillars coupled thereto

Power semiconductor devices

Semiconductor device

Multi-dimensional integrated circuit structures and methods of forming the same

Method of manufacturing a semiconductor device using markings on both lead frame and sealing body

High frequency device

Tamper-resistant coating for an integrated circuit

Electronic devices with embedded die interconnect structures, and methods of manufacture thereof

Semiconductor assemblies with multi-level substrates and associated methods of manufacturing

Packaged microelectronic components

Semiconductor device and method for producing the same

Semiconductor device

High-density package-on-package structure

Photoelectric module

Semiconductor device

Chip arrangements and methods for manufacturing a chip arrangement

Wire bonding apparatus and bonding method

POP structures with dams encircling air gaps and methods for forming the same

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Stacked chip-on-board module with edge connector

Semiconductor packages utilizing leadframe panels with grooves in connecting bars

Embedded semiconductor die package and method of making the same using metal frame carrier

Semiconductor package having an over-temperature protection circuit utilizing multiple temperature threshold values

Integrated circuit package including wire bond and electrically conductive adhesive electrical connections

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Semiconductor package having unified semiconductor chips

Semiconductor device

Contoured package-on-package joint

Semiconductor device with conductive vias

Semiconductor module

Semiconductor device and method of manufacturing the same

Semiconductor package having multi-phase power inverter with internal temperature sensor

Lead frame with grooved lead finger

Low forward voltage rectifier

PACKAGE SUBSTRATE AND CHIP PACKAGE USING THE SAME

IGBT die structure with auxiliary P well terminal

Microelectronic assembly with impedance controlled wirebond and reference wirebond

Semiconductor device having a high frequency external connection electrode positioned within a via hole

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Control and driver circuits on a power quad flat no-lead (PQFN) leadframe

Power quad flat no-lead (PQFN) package having control and driver circuits

Method of and device for manufacturing LED assembly using liquid molding technologies

Electronic device and semiconductor device

Semiconductor device and method of confining conductive bump material with solder mask patch

Active area bonding compatible high current structures

Method of manufacturing circuit board and chip package and circuit board manufactured by using the method

Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Embedded chip packages and methods for manufacturing an embedded chip package

Semiconductor dies with reduced area consumption

SEMICONDUCTOR DEVICES AND PROCESSING METHODS

Power module and method of manufacturing the power module

Structures embedded within core material and methods of manufacturing thereof

Stub minimization for assemblies without wirebonds to package substrate

Semiconductor device and method of forming a PoP device with embedded vertical interconnect units

Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)

Semiconductor device with lead terminals having portions thereof extending obliquely

Dual-leadframe multi-chip package

Semiconductor device

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Illumination device capable of decreasing shadow of lighting effect

Techniques for packaging multiple device components

Circuit board having bypass pad

Power quad flat no-lead (PQFN) package in a single shunt inverter circuit

Packaged IC having printed dielectric adhesive on die pad

Open source power quad flat no-lead (PQFN) package

Leadframe for semiconductor packages

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Method of manufacturing semiconductor apparatus and semiconductor apparatus

Semiconductor device with stacked semiconductor chips

Apparatus and method for a component package

LEADFRAME HAVING SLOPED METAL TERMINALS FOR WIREBONDING

Semiconductor device

Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter

High density second level interconnection for bumpless build up layer (BBUL) packaging technology

SYSTEM IN PACKAGE WITH EMBEDDED RF DIE IN CORELESS SUBSTRATE

Solid-state image pickup element and solid-state image pickup element mounting structure

Power semiconductor housing with redundant functionality

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Device mounting board and semiconductor power module

Linked semiconductor module unit and electronic circuit-integrated motor device using same

PoP structure with electrically insulating material between packages

Semiconductor package substrates having pillars and related methods

Thermal dissipation through seal rings in 3DIC structure

Semiconductor device

Semiconductor device and method of manufacturing same

Semiconductor device including semiconductor chip mounted on lead frame

Method and apparatus for multi-chip structure semiconductor package

Semiconductor device

Fabrication method of carrier-free semiconductor package

Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier

Semiconductor packaging method using connecting plate for internal connection

Method of manufacturing semiconductor device

Method for manufacturing package structure with electronic component

Packaging substrate, method for manufacturing same, and chip packaging body having same

Device mounting board, semiconductor module, and method for fabricating the device mounting board

Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package

Semiconductor packages having warpage compensation

Semiconductor chip, method for producing a semiconductor chip and method for soldering a semiconductor chip to a carrier

Thermally enhanced package with lid heat spreader

Semiconductor device and lead frame used for the same

Semiconductor device and method for manufacturing thereof

Method for electrophoretically depositing a film on an electronic assembly

Tunable composite interposer

Semiconductor device

Multi-chip packaging structure and method

Semiconductor package with connecting plate for internal connection

Semiconductor memory card

Semiconductor devices with impedance matching-circuits

Integrated electronic device with transceiving antenna and magnetic interconnection

Bondable top metal contacts for gallium nitride power devices

Voltage regulator using N-type substrate

Semiconductor device and manufacturing method of the same

Identification mechanism for semiconductor device die

Wire bond splash containment

Methods and apparatus for package on package structures

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR COPPER BOND PADS

Power quad flat no-lead (PQFN) package

Stacked die power converter

Integrated circuit

Multilayer packaged semiconductor device and method of packaging

Electronic device and semiconductor device

Semiconductor device and semiconductor package

Semiconductor unit and semiconductor device using the same

Chip package and a method for manufacturing a chip package

Semiconductor housing and method for the production of a semiconductor housing

Dicing die bond film

Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement

Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof

Chip package

Copper ball bond features and structure

Semiconductor device with copper wirebond sites and methods of making same

Method of manufacturing semiconductor device

Stacked dual chip package having leveling projections

Semiconductor device and electronic device

Electrical component resin, semiconductor device, and substrate

Package for semiconductor device including guide rings and manufacturing method of the same

INTEGRATED CIRCUIT PACKAGE HAVING MEDIUM-INDEPENDENT SIGNALING INTERFACE COUPLED TO CONNECTOR ASSEMBLY

Pad sidewall spacers and method of making pad sidewall spacers

Mounted structure

Contact pads with sidewall spacers and method of making contact pads with sidewall spacers

High temperature interconnect assemblies for high temperature electronics utilizing transition pads

Integrated circuit device

Semiconductor package for high power devices

Semiconductor device and method of manufacturing the same

Integrated circuit packaging system with array contacts and method of manufacture thereof

Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units

Semiconductor devices including a non-planar conductive pattern, and methods of forming semiconductor devices including a non-planar conductive pattern

Package on package devices and methods of forming same

Semiconductor device for preventing a progression of a crack in a solder layer and method of manufacturing the same

Microelectronic devices and methods for manufacturing microelectronic devices

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Method for plating a semiconductor package lead

Thin leadframe QFN package design of RF front-ends for mobile wireless communication

Integrated system and method of making the integrated system

BVA interposer

Semiconductor device and programming method

Semiconductor device stack with bonding layer and wire retaining member

Semiconductor device and method of manufacturing the same

Embedded package security tamper mesh

Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics

Explosion-protected semiconductor module

Top exposed semiconductor chip package

Semiconductor device and manufacturing method thereof

Semiconductor package having an antenna and manufacturing method thereof

High-frequency device including high-frequency switching circuit

Measuring current in a power regulator system

Field emission devices and methods of making thereof

Semiconductor device with embedded interconnect pad

Electric device package comprising a laminate and method of making an electric device package comprising a laminate

Semiconductor device and method for manufacturing semiconductor device

Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die

Monolithic bidirectional silicon carbide switching devices

Vertically integrated systems

Microelectronic packages having cavities for receiving microelectronic elements

Semiconductor package with single sided substrate design and manufacturing methods thereof

Packaged semiconductor die with power rail pads

Semiconductor device and manufacturing method of same

Methods and arrangements relating to semiconductor packages including multi-memory dies

Configurable passive components

Chip packages having dual DMOS devices with power management integrated circuits

Chip card module

Method of manufacturing a ball grid array substrate or a semiconductor chip package

Interposer and semiconductor module using the same

Chip stack packages, system in packages including the same, and methods of operating the same

Stacked fan-out semiconductor chip

Semiconductor device including cooler

EMI shielding and thermal dissipation for semiconductor device

Semiconductor device and method of manufacturing the same

Light emitting device package

Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices

Component and method of manufacturing a component using an ultrathin carrier

Semiconductor device and method of forming bump-on-lead interconnection

Stackable molded microelectronic packages

Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same

Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same

Thermal leadless array package with die attach pad locking feature

Chip package and method of manufacturing the same

Semiconductor packages having multiple lead frames and methods of formation thereof

Method of making 3D integration microelectronic assembly for integrated circuit devices

Power module package and method for manufacturing the same

Power amplifier modules including related systems, devices, and methods

Semiconductor device capable of switching operation modes and operation mode setting method therefor

Adhesive film, method of manufacturing semiconductor device, and semiconductor device