Clip interconnect with encapsulation material locking feature

Integrated circuit packaging system with multi-row leads and method of manufacture thereof

Compensation network for RF transistor

Method of constructing a semiconductor device and structure

Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Stacked packaged integrated circuit devices

Multi-chip module

CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME

Semiconductor device

Integrated circuit packaging system with stack interconnect and method of manufacture thereof

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

Integrated circuit device having die bonded to the polymer side of a polymer substrate

Using bump bonding to distribute current flow on a semiconductor power device

DIE DOWN DEVICE WITH THERMAL CONNECTOR

ENHANCED HEAT SPREADER FOR USE IN AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic devices

Method for semiconductor leadframes in low volume and rapid turnaround

PACKAGE STRUCTURE

Method for semiconductor leadframes in low volume and rapid turnaround

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM

SEMICONDUCTOR DEVICE PACKAGE WITH ELECTROMAGNETIC SHIELDING

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS, MOUNTING METHOD AND SEMICONDUCTOR CHIP FOR VERTICAL MOUNTING ONTO CIRCUIT SUBSTRATES

ULTRA THIN DIE TO IMPROVE SERIES RESISTANCE OF A FET

Package and high frequency terminal structure for the same

Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Method for manufacturing magnetic memory chip device

SEMICONDUCTOR DEVICE

Input/output core design and method of manufacture therefor

Integrated circuit packaging system with foldable substrate and method of manufacture thereof

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Semiconductor package with bonding wires of reduced loop inductance

Stacked integrated circuit package having recessed sidewalls

Microelectronic package with terminals on dielectric mass

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Integrated circuit packaging system with connection structure and method of manufacture thereof

Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground

Microelectronic devices and methods for manufacturing microelectronic devices

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor packages with reduced solder voiding

Power semiconductor module

Phosphor, method of manufacturing the same, and light-emitting device

Nitride semiconductor element and nitride semiconductor package

Method for manufacturing a substrate for a semiconductor package

Contact pad

Chip-scale semiconductor die packaging method

Multi-chip stacking method to reduce voids between stacked chips

In-package microelectronic apparatus, and methods of using same

Quad flat package with exposed paddle

Systems and methods for ESD protection for RF couplers in semiconductor packages

DIFFERENTIAL SIGNAL TRANSMISSION LINE, IC PACKAGE, AND METHOD FOR TESTING SAID DIFFERENTIAL SIGNAL TRANSMISSION LINE AND IC PACKAGE

Semiconductor packages and methods for producing the same

Semiconductor devices and methods of manufacturing the same

System for relieving stress and improving heat management in a 3D chip stack

Integrated circuit system with distributed power supply comprising interposer and voltage regulator module

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS

Resin-sealed semiconductor device and method for fabricating the same

Dual lead frame semiconductor package and method of manufacture

Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die

SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES

High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device

ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY

Wire bonding apparatus and method using the same

Method for manufacturing semiconductor device

FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Method for fabrication of a semiconductor device and structure

Method for Producing an Electrical Circuit and Electrical Circuit

Hybrid integrated circuit device and electronic device

Base plate

Semiconductor module having an insert and method for producing a semiconductor module having an insert

ANTENNA

Reversible top/bottom MEMS package

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

Power package module with low and high power chips and method for fabricating the same

Bonding wire for semiconductor device

DISCRETE CIRCUIT COMPONENT HAVING COPPER BLOCK ELECTRODES AND METHOD OF FABRICATION

Stacked semiconductor packages and related methods

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Semiconductor module having a semiconductor chip stack and method

Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Integrated circuit packaging system with lead frame and method of manufacture thereof

Semiconductor device packages with protective layer and related methods

Semiconductor device having die pads isolated from interconnect portion and method of assembling same

High power ceramic on copper package

Semiconductor package device with a heat dissipation structure and the packaging method thereof

Integrated circuit package system with encapsulation lock

Semiconductor device and method of shielding semiconductor die from inter-device interference

Package structure with micro-electromechanical element and manufacturing method thereof

LIGHT EMITTING DIODE PACKAGE STRUCTURE

FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

Chip Package

FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Methods and apparatus for a stacked-die interposer

LAMINATED SUBSTRATE WITH COILS

Power semiconductor device

Element mounting substrate and semiconductor module

Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer

Power/ground layout for chips

POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE

Semiconductor device including an insulating layer and heat sink plates formed in the insulating layer

Device with semiconductor die attached to a leadframe

Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package

Carrier body for a semiconductor component, semiconductor component and method for producing a carrier body

HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS

Light emitting diode package having improved wire bonding structure

Atomic layer deposition encapsulation for power amplifiers in RF circuits

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

Package substrate and fabrication method thereof

Microelectronic devices and methods for filing vias in microelectronic devices

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump

Semiconductor Chip Attach Configuration Having Improved Thermal Characteristics

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME

Copper alloy bonding wire for semiconductor

ENCAPSULATED CIRCUIT DEVICE FOR SUBSTRATES HAVING AN ABSORPTION LAYER, AND METHOD FOR THE MANUFACTURE THEREOF

Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics

Electronic apparatus, method of making the same, and transceiving device

Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package

Semiconductor device for semiconductor package having through silicon vias of different heights

Semiconductor device

SEMICONDUCTOR PACKAGE AND IMPLEMENTATION STRUCTURE OF SEMICONDUCTOR PACKAGE

Semiconductor device

Chip package structure and chip packaging method

Leadframe package structure and manufacturing method thereof

Mixed wire semiconductor lead frame package

Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die

Submount and manufacturing method thereof

Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump

Semiconductor device and the method of manufacturing the same

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Method for manufacturing semiconductor package

Semiconductor multi-project or multi-product wafer process

Printed Circuit Board For Board-On-Chip Package, Board-On-Chip Package Including The Same, And Method Of Fabricating The Board-On-Chip Package

PACKAGE SUBSTRATE

Semiconductor device comprising thin-film terminal with deformed portion

Semiconductor assembly and semiconductor package including a solder channel

Integrated circuit packaging system with interposer interconnections and method of manufacture thereof

SEMICONDUCTOR DEVICE

IC PACKAGE

Semiconductor device including shielding layer and fabrication method thereof

Massively parallel interconnect fabric for complex semiconductor devices

Method of manufacturing semiconductor device

Manufacturing method of semiconductor device

Flexible packaging for chip-on-chip and package-on-package technologies

Chip Capacitor Precursors

Resin composition for encapsulating semiconductor and semiconductor device

Off-chip VIAS in stacked chips

Semiconductor device packages stacked together having a redistribution layer

SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT MODULE USING THE SAME

POWER MODULE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor module comprising an insert

Electronic Package and Method of Making an Electronic Package

Delamination resistant device package having raised bond surface and mold locking aperture

Assembly method for converting the precursors to capacitors

Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereof

Brace for wire bond

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Manufacturing method of semiconductor device

SINTERED CERAMIC AND SUBSTRATE COMPRISING SAME FOR SEMICONDUCTOR DEVICE

Circuit device and method of manufacturing the same

MULTI-CHIP PACKAGE

Set of resin compositions for preparing system-in-package type semiconductor device

SEMICONDUCTOR PACKAGE

Methods of fabricating package stack structure and method of mounting package stack structure on system board

Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

Semiconductor structure having metal oxide or nirtride passivation layer on fill layer and method for making same

Semiconductor device

Package for semiconductor device including guide rings and manufacturing method of the same

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

Semiconductor power module and method of manufacturing the same

Circuit device having an improved heat dissipitation, and the method of manufacturing the same

Semiconductor device

Lead frame, semiconductor device, and method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE WITH EXPOSED PAD

Integrated circuit packaging system with interlock and method of manufacture thereof

Integrated circuit packaging system with lead encapsulation and method of manufacture thereof

Multi-chip semiconductor packages and assembly thereof

Semiconductor device and manufacturing method therefor

Semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor chip package

Semiconductor device

Communication device

Semiconductor Package for Higher Power Transistors

Semiconductor module including a switch and non-central diode

METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS

Chip packaging method and structure thereof

Module with silicon-based layer

Method for mounting luminescent device

Integrated circuit with intra-chip clock interface and methods for use therewith

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Power conversion module

Chip to dielectric waveguide interface for sub-millimeter wave communications link

High frequency amplifier

Flexible distributed LED-based light source and method for making the same

Metal can impedance control structure

Integrated circuit packaging system with die paddles and method of manufacture thereof

Stacked multi-die packages with impedance control

Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assist

SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS EMPLOYING THE SAME

Method for depackaging prepackaged integrated circuit die and a product from the method

Ball grid array semiconductor package and method of manufacturing the same

Impedance controlled packages with metal sheet or 2-layer RDL

Semiconductor device and method of forming composite bump-on-lead interconnection

Integrated circuit packaging system with post and method of manufacture thereof

Semiconductor device package and method of making a semiconductor device package

Semiconductor device with parasitic bipolar transistor

Integrated power converter package with die stacking

Integrated circuit packaging system with stack interconnect and method of manufacture thereof

Integrated circuit packaging system with paddle molding and method of manufacture thereof

TSOP with impedance control

Transition from a chip to a waveguide port

SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR

Vertical discrete devices with trench contacts and associated methods of manufacturing

Electronic device comprising a chip disposed on a pin

HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Method of making a high frequency device package

Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops

Semiconductor device including coupling conductive pattern

Connector assembly and method of manufacture

Copper bonding compatible bond pad structure and method

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding

Method of manufacture of integrated circuit packaging system with stacked integrated circuit

SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE DIES AND A COMMON NODE STRUCTURE

MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

Complex semiconductor device for use in mobile equipment

Semiconductor component and method of manufacture

Electronic Device, Circuit Board Assembly, and Semiconductor Device

Semiconductor package with integrated substrate thermal slug

Power amplifier circuit

Resin composition for encapsulating semiconductor and semiconductor device

Electronic packaging with a variable thickness mold cap

Integrated circuit packaging system with film encapsulation and method of manufacture thereof

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Semiconductor device and method of manufacturing the same

Semiconductor component and device provided with heat dissipation means

Semiconductor device and manufacturing method thereof

Semiconductor package and method for manufacturing the same

Die structure, die arrangement and method of processing a die

Embedded ball grid array substrate and manufacturing method thereof

Method of manufacturing substrate for semiconductor element, and semiconductor device

Semiconductor device

Semiconductor module and method for production thereof

Semiconductor device having a pin mounted heat sink

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

POWER SEMICONDUCTOR MODULE HAVING SINTERED METAL CONNECTIONS, PREFERABLY SINTERED SILVER CONNECTIONS, AND PRODUCTION METHOD

Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect

Package structure for DC-DC converter

METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

Semiconductor packages having increased input/output capacity and related methods

DICING DIE BOND FILM

Programmable anti-fuse wire bond pads

Control device of semiconductor device

Memory card package structure and method for fabricating the same

Method for manufacturing semiconductor optical device

Method of fabricating a semiconductor device having a resin with warpage compensated structures

Manufacturing method for semiconductor device carrier and semiconductor package using the same

Fabrication method of semiconductor integrated circuit device

LED light source unit for backlight of liquid crystal display, and liquid crystal display

Multi-chip package with offset die stacking

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

SUBSTRATE FOR A MICROELECTRONIC PACKAGE AND METHOD OF FABRICATING THEREOF

Semiconductor device with pads of enhanced moisture blocking ability

Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers

SEMICONDUCTOR DEVICE

Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

Lead frame for semiconductor device

Semiconductor device and method of blowing fuse thereof

Semiconductor device integrated with converter and package structure thereof

MULTI-CHIP PACKAGES

Method of manufacturing semiconductor device and wire bonding apparatus

Method for manufacturing semiconductor device

Leadless array plastic package with various IC packaging configurations

METHOD FOR MANUFACTURING CHIP PACKAGE

Method of manufacturing semiconductor device

Method for manufacturing semiconductor devices

Semiconductor apparatus, inspection method thereof and electric device

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

Semiconductor device and method for manufacturing the same

Substrate dicing technique for separating semiconductor dies with reduced area consumption

Semiconductor storage device and a method of manufacturing the semiconductor storage device

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE HAVING THROUGH-SILICON-VIA (TSV) CHIP EMBEDDED THEREIN AND FABRICATION METHOD THEREOF

Semiconductor package

Structures embedded within core material and methods of manufacturing thereof

Package structure

Semiconductor device and method for manufacturing thereof

BALL GRID ARRAY PACKAGE

Semiconductor apparatus

Helical springs electrical connecting a plurality of packages

STACKABLE SEMICONDUCTOR DEVICE PACKAGES

Semiconductor device