Semiconductor die containing lateral edge shapes and textures

Non-volatile memory with reduced mobile ion diffusion

Device package substrate and method of manufacturing the same

Metal oxide semiconductor field effect transistor integrating a capacitor

Method for manufacturing semiconductor device and bonding apparatus

Laminated substrate for an integrated circuit BGA package and printed circuit boards

Method of integrating a MOSFET with a capacitor

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

METHOD OF FORMING TAPE BALL GRID ARRAY PACKAGE

Manufacturing method of leadframe and semiconductor device

MEMS device package with vacuum cavity by two-step solder reflow method

BONDING WIRE

SEMICONDUCTOR DEVICE

Semiconductor device and semiconductor package having the same

Semiconductor device and method of manufacturing the same

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

Impedance optimized chip system

Semiconductor package

Method of manufacturing semiconductor device and semiconductor device

Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging

Delamination resistant packaged die having support and shaped die having protruding lip on support

Acceleration sensor, semiconductor device and method of manufacturing semiconductor device

LED package structure for increasing heat-dissipating and light-emitting efficiency and method for manufacturing the same

Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

Electronic device submounts with thermally conductive vias and light emitting devices including the same

LAMINATION METHOD OF ADHESIVE TAPE AND LEAD FRAME

DICING/DIE BONDING FILM

Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond

ADHESIVE FILM WITH DICING SHEET AND METHOD OF MANUFACTURING THE SAME

HIGH-DENSITY MEMORY ASSEMBLY

Semiconductor device, and power conversion device using semiconductor device

Light-emitting device, planar light source including the light-emitting device, and liquid crystal display device including the planar light source

Transformer signal coupling for flip-chip integration

Electronic devices with extended metallization layer on a passivation layer

Wafer Level Stacked Die Packaging

SEMICONDUCTOR DEVICE PACKAGES WITH INTEGRATED HEATSINKS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Off-chip vias in stacked chips

Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant

Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof

CONNECTION DEVICE BEWTEEN TRANSISTOR AND LEAD FRAME

Semiconductor package and method for packaging the same

Direct contact leadless package for high current devices

Semiconductor device with acene heat spreader

Encapsulant interposer system with integrated passive devices and manufacturing method therefor

Semiconductor package and method of manufacturing the same

Semiconductor device with electromagnetic interference shielding

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Bonding pad structure and integrated circuit chip using such bonding pad structure

Hybrid Packaged Gate Controlled Semiconductor Switching Device Using GaN MESFET

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

Power semiconductor device

Chip structure with bumps and testing pads

DEVICES AND METHOD FOR MANUFACTURING A DEVICE

Connector, Package Using the Same and Electronic Device

Printed wiring board and method for manufacturing the same

Photosensitive adhesive

HEAT RESISTANT MASKING TAPE AND USAGE THEREOF

Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same

Vertically stacked pre-packaged integrated circuit chips

Fabrication of compact opto-electronic component packages

Electronic component

High frequency circuit having multi-chip module structure

Semiconductor device

METHOD FOR ARRANGING COOLING FOR A COMPONENT AND A COOLING ELEMENT

MANUFACTURE OF A SMART CARD

Wiring board, semiconductor device and method for manufacturing semiconductor device

BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES

Interposer chip and manufacturing method thereof

SOLDER JOINT STRUCTURE, AND JOINING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND ON-VEHICLE AC GENERATOR

Electronic device and method of manufacturing the same

Stacked packaging improvements

Semiconductor device having stable signal transmission at high speed and high frequency

Electronic part and method of manufacturing the same

Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars

QFN SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD STRUCTURE ADAPTED FOR THE SAME

Flexible contactless wire bonding structure and methodology for semiconductor device

Light emitting diode package

Semiconductor memory device and semiconductor memory card

Method for manufacturing semiconductor device

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BUMP/BASE HEAT SPREADER AND A CAVITY IN THE BUMP

Flip chip cavity package

Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminal

Wireless transmission system and wireless transmission method

Illumination apparatus

METAL FRAME FOR ELECTRONIC PART

Circuit board having bypass pad

Semiconductor device

Semiconductor device

Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same

Integrated circuit

Device under bonding pad using single metallization

Electronic device and manufacturing method therefor

Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via

Semiconductor device

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Ball-grid-array package, electronic system and method of manufacture

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Semiconductor device and method of forming dam material around periphery of die to reduce warpage

Embedded semiconductor die package and method of making the same using metal frame carrier

High bond line thickness for semiconductor devices

Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof

Semiconductor chip assembly with bump/base heat spreader and cavity in bump

Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portion

Manufacturing method for integrating a shunt resistor into a semiconductor package

Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages

Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon

INTERPOSER, MODULE, AND ELECTRONICS DEVICE INCLUDING THE SAME

Integrated circuit device and electronic equipment

Edge connect wafer level stacking

Power semiconductor circuit device and method for manufacturing the same

POWER DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Semiconductor package requiring reduced manufacturing processes

Semiconductor package

Semiconductor device having an interposer

Microwave module

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Semiconductor package and stacked semiconductor package having the same

Method and apparatus for manufacturing semiconductor device

System-in packages

Integrated circuit device and electronic apparatus

Semiconductor device and programming method

Component arrangement and method for producing a component arrangement

WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE

Multi-die package

Semiconductor device and method of forming an interposer package with through silicon vias

SEMICONDUCTOR DEVICE

Semiconductor device and method for manufacturing the same

Semiconductor package and package-on-package semiconductor device

Manufacturing method of semiconductor device and semiconductor device

SUBSTRATE STRUCTURE FOR CAVITY PACKAGE

Semiconductor Package Thermal Performance Enhancement and Method

Method of reducing memory card edge roughness by edge coating

Stackable Package By Using Internal Stacking Modules

Integrated circuit packaging system with through silicon via base and method of manufacture thereof

Semiconductor device package having features formed by stamping

Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors

Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame

CMOS image sensor big via bonding pad application for AICu process

High frequency field-effect transistor

System with semiconductor components having encapsulated through wire interconnects (TWI)

Thin foil semiconductor package

Mounting and connecting an antenna wire in a transponder

Resin composition for semiconductor encapsulation and semiconductor device

METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED CIRCUIT CHIP AND ELECTRONIC DEVICE

Low noise high thermal conductivity mixed signal package

Semiconductor device

Semiconductor packages and methods of fabricating the same

High-bandwidth ramp-stack chip package

Semiconductor packages including heat slugs

PoP precursor with interposer for top package bond pad pitch compensation

Encapsulant cavity integrated circuit package system and method of fabrication thereof

Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same

SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING ELECTRICAL CONNECTION WITHOUT USING WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME

Method for the low-temperature pressure sintering of electronic units to heat sinks

Bonding machine incorporating dual-track transfer mechanism

Semiconductor device

Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device

Manufacturing process for embedded semiconductor device

Method for packaging semiconductor dies having through-silicon vias

Semiconductor Device and Method of Forming Conductive TSV in Peripheral Region of Die Prior to Wafer Singulaton

MULTI-CHIP PACKAGE STRUCTURE SUITABLE FOR MULTI-PROCESSOR SYSTEM HAVING MEMORY LINK ARCHITECTURE

Providing in package power supplies for integrated circuits

Integrated circuit package system employing device stacking and method of manufacture thereof

Electronic component used for wiring and method for manufacturing the same

Semiconductor device and method of manufacturing the same

METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGNING APPARATUS, SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, PACKAGE AND SEMICONDUCTOR INTEGRATED CIRCUIT

HEAT SPREADER FOR SEMICONDUCTOR PACKAGE

Semiconductor package having discrete components and system containing the package

Power semiconductor module and method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor device and method of fabrication

IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods

SEMICONDUCTOR DEVICE

Semiconductor chip package

Leadframe having delamination resistant die pad

Semiconductor chip package

Multi-Connect Lead

Semiconductor device

Semiconductor-on-insulator with back side heat dissipation

Multi-die DC-DC buck power converter with efficient packaging

Copper alloy bonding wire for semiconductor device

Method for exposing and cleaning insulating coats from metal contact surfaces

Semiconductor device having grooved leads to confine solder wicking

SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD WITH FOLDED EDGE

Near chip scale package integration process

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Dual-level package

Electronic circuit device

Multilayer dielectric substrate and semiconductor package

RESIN VARNISH USED FOR ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

System and method to reduce the bondwire/trace inductance

Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other

Semiconductor device and method of manufacturing semiconductor device

Simplified multichip packaging and package design

Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device

Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces

Lighting device, display, and method for manufacturing the same

Ribbon connecting electrical components

Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY ELECTROPLATING

Semiconductor optical interconnection device and semiconductor optical interconnection method

Die-to-die electrical isolation in a semiconductor package

Chip scale module package in BGA semiconductor package

Semiconductor chip package and method for designing the same

Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof

Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element

Systems and Methods of Improved Heat Dissipation with Variable Pitch Grid Array Packaging

Package structure

Semiconductor device and manufacturing method of the same

Semiconductor Chip Secured to Leadframe by Friction

LEAD FRAME, AND ELECTRONIC PART USING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Lead frame routed chip pads for semiconductor packages

Leadframe, leadframe type package and lead lane

Method of assembling a multi-component electronic package

Semiconductor device and semiconductor device manufacturing method

Power converter integrated circuit floor plan and package

Light-emitting device and manufacturing method thereof

Wire payout measurement and calibration techniques for a wire bonding machine

Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packages

SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING THE SAME

Process for producing a semiconductor device

Methods for producing an ultrathin semiconductor circuit

Method of manufacturing semiconductor device

Semiconductor device and method for producing the same

Coil transducer isolator packages

Linked semiconductor module unit and electronic circuit-integrated motor vehicle device using same

Radio-frequency system in package including antenna

Power module and vehicle-mounted inverter using the same

PACKAGE PROCESS AND PACKAGE STRUCTURE

Layered chip package

Semiconductor device including two heat sinks and method of manufacturing the same

Semiconductor device bonding wire and wire bonding method

Semiconductor package and method of forming the same

Near chip scale semiconductor packages

Semiconductor package structure and package method thereof

Package manufacturing method and semiconductor device

FLAT CHIP PACKAGE AND FABRICATION METHOD THEREOF

Multi-chip package and method of providing die-to-die interconnects in same

Semiconductor packaging structure having conductive gel to package semiconductor device

IC PACKAGE DESIGN WITH STRESS RELIEF FEATURE

Semiconductor device with embedded interconnect pad

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

Integrated circuit package system using heat slug

Semiconductor chip

Integrated Direct Conversion Detector Module

METHAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

Semiconductor device and manufacturing method thereof

Methods of operating electronic devices, and methods of providing electronic devices

ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

Pressure-Sensitive Adhesive Tape

MEMORY CARD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof

Adhesive film for semiconductor and semiconductor device using the adhesive film

Semiconductor package with substrate having single metal layer and manufacturing methods thereof

Integrated circuit package system with redistribution layer and method for manufacturing thereof

Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Wafer level stack structure for system-in-package and method thereof

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONTACT PADS AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof

Integrated circuit packaging system with a dual substrate package and method of manufacture thereof

Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof

EQUIPOTENTIAL PAD CONNECTION

Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds

Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same

Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure

Lead frame design to improve reliability

Method for assembling stackable semiconductor packages

High frequency storing case and high frequency module

Semiconductor device that suppresses malfunctions due to noise generated in internal circuit

Mounting substrate and electronic apparatus

Semiconductor package having substrate with solder ball connections and method of fabricating the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND METHOD OF MANUFACTURING THE SAME

Method of forming wire bonds in semiconductor devices

Methods to fabricate integrated circuits by assembling components

Semiconductor device having a sealing resin and method of manufacturing the same

Chip packaging method and structure thereof

Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof

Integrated circuit package having a castellated heatspreader

Integrated circuit package stacking system with redistribution and method of manufacture thereof

SEMICONDUCTOR PACKAGE, STACK MODULE, CARD, AND ELECTRONIC SYSTEM

Package-on-package technology for fan-out wafer-level packaging

Integrated circuit packaging system with a stack package and method of manufacture thereof

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Processes and structures for IC fabrication

Methods for interconnecting bonding pads between components

Enhanced integrated circuit package

Integrated circuit packaging system with high lead count and method of manufacture thereof

Stacked chip package structure with leadframe having inner leads with transfer pad

IC PACKAGE HAVING AN INDUCTOR ETCHED INTO A LEADFRAME THEREOF