Semiconductor device

Electronic device and method for fabricating the same

Processes and structures for IC fabrication

Processes and structures for beveled slope integrated circuits for interconnect fabrication

High-voltage semiconductor device

Image sensor package and image sensing module using same

AU ALLOY WIRE FOR BALL BONDING

Processes for IC fabrication

Processes and structures for IC fabrication

Radio frequency unit analog level detector and feedback control system

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

Method and apparatus for no lead semiconductor package

Semiconductor device

Manufacturing method of a lead frame

In-package microelectronic apparatus, and methods of using same

INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USING THE INTERPOSER SUBSTRATE, MANUFACTURING METHOD OF INTERPOSER SUBSTRATE, AND MANUFACTURING METHOD OF LSI CHIP

Electronic element packaging module

High Frequency Wiring Board, Package for Housing Electronic Component, Electronic Device, and Communication Apparatus

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

MULTI-CHIP SEMICONDUCTOR PACKAGE

Semiconductor apparatus and manufacturing method of the same

Integrated package

Semiconductor Device and Method of Manufacturing the Same

Semiconductor device

Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support

Method for connecting a die attach pad to a lead frame and product thereof

Semiconductor die attachment method using non-conductive screen print and dispense adhesive

Method of manufacturing layered chip package

METHOD OF MANUFACTURING DICING DIE-BONDING FILM

Optical module and method for manufacturing same

Method of manufacturing electronic device and electronic device

Ceramic substrate part and electronic part comprising it

Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module

Packaged electronic devices having die attach regions with selective thin dielectric layer

Semiconductor device

Joint structure and electronic component

Electronic component and method of connecting with multi-profile bumps

Integrated circuit packaging system with interposer interconnections and method of manufacture thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WIREBOND STRUCTURES

Semiconductor device

Lead frame, lead frame fabrication, and semiconductor device

Semiconductor device and method of forming IPD structure using smooth conductive layer and bottom-side conductive layer

LED package structure with fuse

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME

Bonding apparatus and bonding stage height adjustment method for the bonding apparatus

Aluminum bond pads with enhanced wire bond stability

Semiconductor package with position member

Semiconductor device and method of manufacturing the same

Power semiconductor device and method for its production

Solid state switch arrangement

Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device

Semiconductor device and method for fabricating the same

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor chip package with post electrodes

SEMICONDUCTOR PACKAGE USING CONDUCTIVE PLUG TO REPLACE SOLDER BALL

Semiconductor package

Method for semiconductor leadframes in low volume and rapid turnaround

QUAD FLAT PACKAGE STRUCTURE HAVING EXPOSED HEAT SINK, ELECTRONIC ASSEMBLY AND MANUFACTURING METHODS THEREOF

Method for fabrication of a semiconductor device and structure

Semiconductor device having surface protective films on bond pad

Semiconductor device

Arrangement for energy conditioning

BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE

Substrate for electrical device

Bonding apparatus and wire bonding method

Method for fabrication of a semiconductor device and structure

Semiconductor device with an improved solder joint

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

LID FOR A FUNCTIONAL PART AND A PROCESS FOR ITS MANUFACTURE

Heat sink and assembly or module unit

Semiconductor package, lead frame, and wiring board with the same

Lens support and wirebond protector

Circuit board having bypass pad

Semiconductor power module

Semiconductor die having a redistribution layer

Semiconductor device

Stackable Package Having Embedded Interposer and Method for Making the Same

SUBSTRATE HAVING EMBEDDED SINGLE PATTERNED METAL LAYER, AND PACKAGE APPLIED WITH THE SAME, AND METHODS OF MANUFACTURING OF THE SUBSTRATE AND PACKAGE

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

COPPER PLATE BONDING FOR HIGH PERFORMANCE SEMICONDUCTOR PACKAGING

Integrated circuit packaging system with leads and transposer and method of manufacture thereof

Semiconductor device

Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal

Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURE

Method for fabricating QFN semiconductor package

Die down ball grid array packages and method for making same

Power semiconductor module including substrates spaced from each other

Antennas using chip-package interconnections for millimeter-wave wireless communication

Semiconductor chip and semiconductor device including the same

Techniques for packaging multiple device components

Die Exposed Chip Package

Mold lock on heat spreader

SEMICONDUCTOR CHIP PACKAGE

Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same

Semiconductor Device Package Having Chip With Conductive Layer

QFN semiconductor package

QFN semiconductor package

LEAD FRAME FOR SEMICONDUCTOR DEVICE

High power ceramic on copper package

SEMICONDUCTOR DEVICE

Semiconductor device driving bridge-connected power transistor

Photo detector

Massively parallel interconnect fabric for complex semiconductor devices

Optoelectronic system

Molded housing used in force fit method

Bonding wire for semiconductor device

Package with multiple dies

Methodology for processing a panel during semiconductor device fabrication

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Fabrication method of semiconductor integrated circuit device

IC card with terminals for direct access to internal components

Method for manufacturing a rigid power module suited for high-voltage applications

Semiconductor device

Electronic component for surface mounting

Plastic package and method of fabricating the same

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor device

System and method for multi-chip module die extraction and replacement

Semiconductor package including power ball matrix and power ring having improved power integrity

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

Substrate for a microelectronic package and method of fabricating thereof

SEMICONDUCTOR DEVICE

Semiconductor packages and electronic systems including the same

Multi-chip stacked package

Integrated circuit package system with offset stacking and anti-flash structure

Microelectronic packages fabricated at the wafer level and methods therefor

Semiconductor package with multiple chips and substrate in metal cap

Semiconductor device and method of manufacturing semiconductor device

Leadframe

Power lead-on-chip ball grid array package

Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference

Semiconductor device and method for manufacturing metallic shielding plate

Semiconductor device, method of manufacturing the same, and silane coupling agent

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Semiconductor device including an inductor that is inductively coupled to another inductor

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

FLEXIBLE JOINT

Method for Mounting Flip Chip and Substrate Used Therein

Method of fabricating stacked semiconductor structure

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

Multi-chip packages providing reduced signal skew and related methods of operation

Interposer substrate including capacitor for adjusting phase of signal transmitted in same interposer substrate

Semiconductor device and manufacturing method thereof

IC package reducing wiring layers on substrate and its carrier

INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND SUBSTRATE PROCESSING METHOD

Chip package structure and manufacturing method thereof for effectively lowering manufacturing costs and improving yield and reliability of the chip package structure

Semiconductor chip package

Electronic device package

Stacked chip package structure with leadframe having bus bar

Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof

Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof

Stacked chip package structure with leadframe having bus bar

Integrated circuit package system with leaded package and method for manufacturing thereof

Panel, semiconductor device and method for the production thereof

Semiconductor component having through wire interconnect (TWI) with compressed wire

SEMICONDUCTOR MODULE

Method of forming an inductor on a semiconductor wafer

High breakdown voltage semiconductor device and high voltage integrated circuit

Semiconductor chip pad structure and method for manufacturing the same

Semiconductor integrated circuit device and method of manufacturing same

Solder layer, heat sink using such a solder layer and method for manufacturing such a heat sink

Active area bonding compatible high current structures

Semiconductor package and method of packaging semiconductor devices

Manufacturing method of semiconductor integrated circuit device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Widebody coil isolators

Exposed die pad package with power ring

Semiconductor device capable of switching operation modes

SEMICONDUCTOR DEVICE

Microelectronic packages and methods therefor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electrode structure and its manufacturing method, and semiconductor module

Interconnection of IC Chips by Flex Circuit Superstructure

Assembling substrates that can form 3-D structures

Semiconductor device, manufacturing method thereof, and electronic device

Semiconductor device and method for manufacturing the same

Stacked chips package having feed-through electrode connecting the first and second semiconductor components via an adhesive layer

SEMICONDUCTOR DEVICE

Stacked microfeature devices

Power semiconductor module comprising a connection device with internal contact spring connection elements

Semiconductor package and manufacturing method thereof

Stacked semiconductor package and method of manufacturing thereof

Staircase shaped stacked semiconductor package

Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof

Package-on-package interconnect stiffener

Relay board and semiconductor device having the relay board

Semiconductor die package and method for making the same

Semiconductor device and manufacturing method thereof

ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Manufacturing method of advanced quad flat non-leaded package

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package to remove power noise using ground impedance

Semiconductor device and a method of manufacturing the same

Method of fabricating a two-sided die in a four-sided leadframe based package

Method of manufacturing a semiconductor device including plural semiconductor chips

STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS

Fabrication method of multi-chip stack structure

Manufacturing method of bottom substrate of package

SYSTEMS AND METHODS FOR AFFIXING A SILICON DEVICE TO A SUPPORT STRUCTURE

Semiconductor optical communication module and manufacturing method thereof

RF POWER AMPLIFIER CIRCUIT UTILIZING BONDWIRES IN IMPEDANCE MATCHING

DC/DC converter package having separate logic and power ground terminals

Semiconductor package having underfill agent dispersion

Electronic device and method of manufacturing same

Semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

MULTI-DIE PACKAGE WITH IMPROVED HEAT DISSIPATION

Semiconductor device with I/O cell and external connection terminal and method of manufacturing the same

Method of manufacturing semiconductor device

Method of making chip-on-lead package

Stacked memory device including a pre-decoder/pre-driver sandwiched between a plurality of inter-decoders/inter-drivers

Integrated circuit chip using top post-passivation technology and bottom structure technology

ELECTRONIC DEVICE

Assembly of radiofrequency chips

Assembly of electronic components

Stacked multichip package

Integrated circuit package system with multiple device units and method for manufacturing thereof

Packaged microelectronic devices and associated systems

Chip packages

Through-hole contacts in a semiconductor device

Semiconductor package and method of forming

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor device

Semiconductor device with hollow and throughhole and method of manufacturing same

Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof

Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor

Semiconductor packages and electronic systems including the same

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof

Integrated circuit packaging system having dual sided connection and method of manufacture thereof

Integrated circuit packaging system with package stacking and method of manufacture thereof

Integrated circuit packaging system with stacked configuration and method of manufacture thereof

Semiconductor device and method of manufacturing same

Semiconductor device and manufacturing method therefor

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST TYPE INTERCONNECTOR AND METHOD OF MANUFACTURE THEREOF

Multichip discrete package

Lead frame and method for manufacturing circuit device using the same

Circuit device having funnel shaped lead and method for manufacturing the same

Semiconductor device and method of forming a shielding layer between stacked semiconductor die

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor module and camera module mounting said semiconductor module

Multilayer wiring substrate having a castellation structure

Wafer level packaging using flip chip mounting

Integrated circuit packaging system with interposer and method of manufacture thereof

Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module

Film-like adhesive, adhesive sheet, and semiconductor device using same

Multi-chip packages including extra memory chips to define additional logical packages and related devices

Semiconductor package

Power module

Structure and Method for Thin Single or Multichip Semiconductor QFN Packages

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

IO cell with multiple IO ports and related techniques for layout area saving

Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site

SEMICONDUCTOR DEVICE, AND STACKED STRUCTURE, PACKAGE, MODULE, AND ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of manufacturing the same

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Methods and systems for packaging integrated circuits

SEMICONDUCTOR DEVICE

Stack type semiconductor package apparatus

Semiconductor package

Integrated circuit packaging system with layered packaging and method of manufacture thereof

Semiconductor device and wire bonding method

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

Lead frame and semiconductor package having the same

Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die

Semiconductor device and semiconductor package having the same

Making a semiconductor device having conductive through organic vias

SEMICONDUCTOR PACKAGE SUBSTRATE INCLUDING FUSES, SEMICONDUCTOR DEVICE PACKAGE, SEMICONDUCTOR MODULE AND ELECTRONIC APPARATUS INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND BACKSIDE ILLUMINATION SOLID-STATE IMAGING DEVICE

Semiconductor device having finger electrodes

Semiconductor device and method for manufacturing the same

Package substrate with a cavity, semiconductor package and fabrication method thereof

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SHEET

Multiple layer strain gauge

Fabrication method of semiconductor integrated circuit device

Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die

Method for manufacturing capacitor embedded in interposer

FLMP buck converter with a molded capacitor and a method of the same

Microelectronic packages and methods therefor

Microelectronic assembly with impedance controlled wirebond and reference wirebond

WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE WIRING BOARD COMPOSITE BODY AND THE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM

Semiconductor device

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Thee-dimensional integrated semiconductor device and method for manufacturing same

INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND PACKAGING METHOD THEREOF

Flexible packaging for chip-on-chip and package-on-package technologies

Semiconductor device, electronic device and method of manufacturing semiconductor device, having electronic component, sealing resin and multilayer wiring structure

Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die

Wire loop and method of forming the wire loop

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Multi-die semiconductor package with heat spreader