Semiconductor device and its manufacture

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

Integrated circuit and manufacturing process facilitating selective configuration for electromagnetic compatibility

Semiconductor chip

AVOIDING ELECTRICAL SHORTS IN PACKAGING

Low profile wire bonded USB device

Method of forming a wafer level package

Semiconductor device

Electronic circuit arrangement and method for producing an electronic circuit arrangement

Compact power semiconductor package and method with stacked inductor and integrated circuit die

Surface-mount type crystal oscillator

Formation of a hybrid integrated circuit device

Semiconductor element, semiconductor device, and fabrication method thereof

Reconstituted wafer level stacking

DOWNHOLE TOOL

Managed Memory Component

Semiconductor package with leads on a chip having multi-row of bonding pads

Package with multiple dies

ISOLATOR AND METHOD OF MANUFACTURING THE SAME

Infrared proximity sensor package with reduced crosstalk

Integrated circuits with phase change devices

Low cost high frequency device package and methods

Integrated circuit package system with package integration

Integrated circuit package system with offset stacking and anti-flash structure

Semiconductor device and method of forming integrated passive device module

Multi-die wafer level packaging

Thermal mechanical flip chip die bonding

Semiconductor device and optical pickup device

Method of manufacturing a printed wiring board

Semiconductor device

Microwave chip supporting structure

Circuit board having bypass pad

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLIP CHIP

Semiconductor package

Semiconductor device

Thick metal interconnect with metal pad caps at selective sites and process for making the same

Method of forming stacked die package

Semiconductor device with resin mold

Quad flat no-lead (QFN) packages

Controller chip mounted on a memory chip with re-wiring lines

SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

Methods and systems for packaging integrated circuits

Integrated circuit package system with interconnect lock

Integrated circuit packaging system with interposer

Mountable integrated circuit package system with mountable integrated circuit die

Semiconductor device and manufacturing method of the same

Semiconductor device

Electronic device

Integrated circuit package system with offset stacking

Leadframe having die attach pad with delamination and crack-arresting features

Integrated circuit package system for shielding electromagnetic interference

Method of opening pad in semiconductor device

Electronic device including an inductor

Semiconductor apparatus

Semiconductor component

Integrated circuit packaging system with leadframe interposer and method of manufacture thereof

Disguising test pads in a semiconductor package

Thick metal interconnect with metal pad caps at selective sites and process for making the same

Semiconductor device and touch sensor device

METAL-CERAMIC COMPOSITE SUBSTRATE AND METHOD OF ITS MANUFACTURE

COLD WELD HERMETIC MEMS PACKAGE AND METHOD OF MANUFACTURE

FORMING EDGE METALLIC CONTACTS AND USING COULOMB FORCES TO IMPROVE OHMIC CONTACT

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Laminated ceramic package

Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire

Forming large planar structures from substrates using edge Coulomb forces

Assembling stacked substrates that can form cylindrical inductors and adjustable transformers

Using coulomb forces to form 3-D reconfigurable antenna structures

Wire bonding personalization and discrete component attachment on wirebond pads

Integrated circuit package-on-package stacking system and method of manufacture thereof

Semiconductor device and method of manufacturing the same

Fabrication method of semiconductor package

Molded Leadless Packages and Assemblies Having Stacked Molded Leadless Packages

CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE INCLUDING THE CIRCUIT MEMBER

Method for attaching a semiconductor die to a leadframe, and a semiconductor device

Chip-stacked package structure with asymmetrical leadframe

Flip-chip leadframe semiconductor package

Lead frame and semiconductor device provided with lead frame

Semiconductor device

Electronic device

Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor

Embedded package security tamper mesh

Integrated circuit package system with shield

Integrated circuit package system for electromagnetic isolation

Secure connector grid array package

Component attach methods and related device structures

MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE

Surface mount device

Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter

Leaded stacked packages having elevated die paddle

Data transfer between chips in a multi-chip semiconductor device with an increased data transfer speed

LCD Driver IC and Method for Manufacturing the Same

Touch screen system with light reflection

System-in-package

Wafer level package integration and method

Wafer level die integration and method

Multi-chip stack structure and method for fabricating the same

Metal foil interconnection of electrical devices

Chip package

Semiconductor device and method of making integrated passive devices

COMBINATION SUBSTRATE

SEMICONDUCTOR PACKAGE STRUCTURE, APPLICATIONS THEREOF AND MANUFACTURING METHOD OF THE SAME

Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device

Semiconductor device

INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH STACKING VIA INTERCONNECT

Integrated circuit package-on-package system with anti-mold flash feature

Electronic device having profiled elements extending from planar surfaces

Method of fabricating a semiconductor device having a heat sink with an exposed surface

Semiconductor module with switching components and driver electronics

Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same

Packaged semiconductor device and method of manufacturing the packaged semiconductor device

Semiconductor device with less power supply noise

Semiconductor device having a stacked multi structure that has layered insulated gate-type bipolar transistors

Vacuum package and manufacturing process thereof

Method and apparatus for manufacturing semiconductor module

ASSEMBLING OF DOUBLED-SIDE STACKING PULRAL CHIPS

Electronic component with wire bonds in low modulus fill encapsulant

Integrated circuit package having reversible ESD protection

Semiconductor device and method of manufacturing the same

Method of producing multiple semiconductor devices

Integrated circuit packaging system with carrier and method of manufacture thereof

Adhesive on wire stacked semiconductor package

Semiconductor package and packaging method for balancing top and bottom mold flows from window

Semiconductor power device package having a lead frame-based integrated inductor

Leadframe based flash memory cards

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Work clamp and wire bonding apparatus

Method of making a connection component with posts and pads

Semiconductor device

Substrate based unmolded package

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND LEAD FRAME, AND METHOD FOR MANUFACTURING THE SAME

Stacked dual MOSFET package

Circuit device and method of manufacturing the same

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

Power module and method of fabricating the same

Stacked-die package for battery power management

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

Drop-mold conformable material as an encapsulation for an integrated circuit package system

Integrated circuit package system with package substrate having corner contacts

Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device

THERMAL CONDUCTOR LIDS FOR AREA ARRAY PACKAGED MULTI-CHIP MODULES AND METHODS TO DISSIPATE HEAT FROM MULTI-CHIP MODULES

SURFACE MOUNT PACKAGE WITH ENHANCED STRENGTH SOLDER JOINT

SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS

SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS

Semiconductor power module packages with simplified structure and methods of fabricating the same

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

PACKAGE-ON-PACKAGE WITH IMPROVED JOINT RELIABILITY

POP (package-on-package) semiconductor device

Power device packages and methods of fabricating the same

LEADFRAME FOR LEADLESS PACKAGE

Integrated circuit package system with insulator over circuitry

CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Integrated circuit package-in-package system with wire-in-film encapsulant

POP (package-on-package) device encapsulating soldered joints between external leads

Multilayer dielectric substrate and semiconductor package

Electrical device and method

Optoelectronic device

DEVICE AND METHOD FOR PRODUCING A BONDING CONNECTION

Apparatus and method for producing a bonding connection

Substrate for mounting electronic part and electronic part

MANUFACTURING METHOD OF LOW TEMPERATURE CO-FIRED CERAMICS SUBSTRATE

Integrated circuit with intra-chip clock interface and methods for use therewith

Semiconductor device with bonding pad

Method for removing bubbles from adhesive layer of semiconductor chip package

Imaging device and method for a bonding apparatus

Semiconductor package and mounting method thereof

Semiconductor device and method for manufacturing thereof

SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS

Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads

Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region

Stacked semiconductor package

Semiconductor chip package

Self-aligning structures and method for integrated circuits

Clip mount for integrated circuit leadframes

Lead frame structure and applications thereof

Semiconductor device having spacer formed on semiconductor chip connected with wire

Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistance

Electrostatic discharge (ESD) protection structure

Method of forming an inductor on a semiconductor wafer

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Method of fabricating circuit board

METHOD FOR POWER SEMICONDUCTOR MODULE FABRICATION, ITS APPARATUS, POWER SEMICONDUCTOR MODULE AND ITS JUNCTION METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

Semiconductor Package Thermal Performance Enhancement and Method

Electronic Circuit Package

Interposer and semiconductor device

Semiconductor package

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Structures and methods for stack type semiconductor packaging

Mountable integrated circuit package system with mounting interconnects

Semiconductor package and semiconductor device

Integrated circuit package system with array of external interconnects

SEMICONDUCTOR CHIP PACKAGE HAVING METAL BUMP AND METHOD OF FABRICATING SAME

Integrated circuit package

Reduction of package height in a stacked die configuration

Integrated circuit package system with dual connectivity

SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON VIAS FOR HIGH CURRENT,HIGH FREQUENCY, AND HEAT DISSIPATION

Light source and method of controlling light spectrum of an LED light engine

Coated lead frame

High-Density Fine Line Structure And Method Of Manufacturing The Same

Packaged gallium nitride material transistors and methods associated with the same

Semiconductor device and method for adjusting characteristics thereof

JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

DIE-ATTACH MATERIAL OVERFLOW CONTROL FOR DIE PROTECTION IN INTEGRATED CIRCUIT PACKAGES

Wiring board of semiconductor device, semiconductor device, electronic apparatus, mother board, method of manufacturing wiring board of semiconductor device, method of manufacturing mother board and method of manufacturing electronic apparatus

High capacity memory with stacked layers

Device with a plurality of semiconductor chips

Device including a semiconductor chip having a plurality of electrodes

Solder-top enhanced semiconductor device for low parasitic impedance packaging

Chip structure

SEMICONDUCTOR DEVICE HAVING A FINE PITCH BONDPAD

CHIP PACKAGE STRUCTURE AND ITS FABRICATION METHOD

SEMICONDUCTOR PACKAGE

Semiconductor integrated circuit device, PDP driver, and plasma display panel

Mountable integrated circuit package system with substrate having a conductor-free recess

Stacked package and method of manufacturing the same

Semiconductor package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND ITS FABRICATION PROCESS

Non-leaded semiconductor package structure

Direct-connect signaling system

Silicon substrate for package

Semiconductor structure and method of manufacture

Method of packaging an LED array module

PRINTED CIRCUIT BOARD HAVING ADHESIVE LAYER AND SEMICONDUCTOR PACKAGE USING THE SAME

Semiconductor chip with coil element over passivation layer

Stacked packaging improvements

Semiconductor package having increased resistance to electrostatic discharge

Power semiconductor module method

Power recovery circuit based on partial standing waves

Power Integrated Circuit with Bond-Wire Current Sense

Semiconductor substrate including first and second recognition marks and method for manufacturing semiconductor device

Electrically enhanced wirebond package

Chip package structure and method of manufacturing the same

Semiconductor package and method for fabricating the same

Wafer level stacked die packaging

SEMICONDUCTOR DEVICE, LAYERED TYPE SEMICONDUCTOR DEVICE USING THE SAME, BASE SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Device including a housing for a semiconductor chip including leads extending into the housing

Power semiconductor module

Semiconductor package, module, system having solder ball coupled to chip pad and manufacturing method thereof

Packaged microchip with spacer for mitigating electrical leakage between components

Integrated circuit package

Method for connecting a die attach pad to a lead frame and product thereof

Integrated circuit package with etched leadframe for package-on-package interconnects

Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure

Semiconductor light emitting device, method of manufacturing the same, and semiconductor light emitting device package using the same

Package for a light emitting element

Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance

Electronic device

Method for bonding a wire conductor laid on a substrate

Integrated circuit package including wire bonds

Method of forming premolded lead frame

Method for Singulating a Group of Semiconductor Packages that Contain a Plastic Molded Body

Layout schemes and apparatus for high performance DC-DC output stage

Semiconductor package and method for fabricating the same

SOI on package hypersensitive sensor

Integrated circuit underfill package system

Semiconductor device and method of manufacturing the same

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

Semiconductor device and manufacturing method of the same

Connecting structure for connecting at least one semiconductor component to a power semiconductor module

Semiconductor device

Semiconductor device

SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR THE SAME

Semiconductor package and substrate for the same

Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire

Semiconductor apparatus with decoupling capacitor

Wiring board, semiconductor apparatus and method of manufacturing them

Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Method for fabricating heat dissipating semiconductor package

Roll-on encapsulation method for semiconductor packages

Method of manufacturing semiconductor device

Die offset die to bonding

Circuit device

Die offset die to die bonding

Integrated circuit package system including die having relieved active region

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR SUBSTRATE

Semiconductor device

Semiconductor package having marking layer

Stackable semiconductor package having plural pillars per pad

Semiconductor Device Package

Memory Packages Having Stair Step Interconnection Layers

Partitioned Integrated Circuit Package with Central Clock Driver

Stacked-type chip package structure and method of fabricating the same

Lead frame, electronic component including the lead frame, and manufacturing method thereof

Wireless semiconductor package for efficient heat dissipation

STACKABLE INTEGRATED CIRCUIT PACKAGE

Semiconductor device

Semiconductor device having grooved leads to confine solder wicking

Dual capillary IC wirebonding

Stacked semiconductor device and fabricating method thereof

Manufacturing process of leadframe-based BGA packages

Flip chip package with advanced electrical and thermal properties for high current designs

Method for thin semiconductor packages

Shielding Apparatus and Manufacturing Method Thereof

Carrier body for components or circuits

Integrated circuit package including miniature antenna

Method of reducing memory card edge roughness by edge coating

METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY PARTICLE BLASTING