Audio power amplifier package

Die warpage control

Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same

Semiconductor device and semiconductor memory device

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING

Power semiconductor arrangement

Semiconductor component comprising copper metallizations

Semiconductor device with copper wirebond sites and methods of making same

Semiconductor device

Ball grid array substrate package and solder pad

Integrated circuit package system with mold lock subassembly

Power semiconductor module

Integrated circuit package system with multiple die

Semiconductor device

Integrated circuit packaging system with base structure device

Integrated circuit package system with leadframe array

METHOD AND APPARATUS FOR PACKAGE-TO-BOARD IMPEDANCE MATCHING FOR HIGH SPEED INTEGRATED CIRCUITS

Glass cap molding package, manufacturing method thereof and camera module

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Electronic device

Method of applying encapsulant to wire bonds

Wire bond encapsulant application control

Method of reducing wire bond profile height in integrated circuits mounted to circuit boards

Method of adhering wire bond loops to reduce loop height

Method of wire bond encapsulation profiling

Method for forming BGA package with increased standoff height

Integrated circuit support for low profile wire bond

MULTI-BAND TUNABLE RESONANT CIRCUIT

Multi-chip package for reducing parasitic load of pin

ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT

Integrated circuit package system with multiple device units

Stacked dual-die packages, methods of making, and systems incorporating said packages

Integrated circuit packaging system with interposer

Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards

Semiconductor device having decoupling capacitor formed on substrate where semiconductor chip is mounted

Semiconductor device and method of forming interconnect structure in non-active area of wafer

Integrated circuit packaging system with passive components

Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card

Semiconductor device and manufacturing method of the same

Method of manufacturing integrated circuit package system with warp-free chip

Integrated circuit package system with under paddle leadfingers

Semiconductor package and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Center Conductor to Integrated Circuit for High Frequency Applications

Semiconductor package and method of reducing electromagnetic interference between devices

Semiconductor device

Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards

Wire bonding system utilizing multiple positioning tables

Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards

Three dimensional packaging optimized for high frequency circuitry

Wafer level package with cavities for active devices

Method of manufacturing a semiconductor device

Method for fabricating multi-chip stacked package

Manufacturing method of semiconductor device with a mold resin having a mold release agent

Thermally enhanced package structure

Carrier assembly for an integrated circuit

Package, packaging method and substrate thereof for sliding type thin fingerprint sensor

Power integrated circuit with high insensitivity to parasitic inductances of wires for connection to a package and package for said integrated circuit

High voltage interlock system and control strategy

Minimizing the number of external terminals required when compensation is to be provided for signal drop in bond wire of a package in which an integrated circuit is provided

Semiconductor device, and manufacturing method of semiconductor device

Integrated circuit package system with package encapsulation having recess

Semiconductor mounting bonding wire

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

Semiconductor device with double-sided electrode structure and its manufacturing method

Integrated circuit package system with delamination prevention structure

Integrated circuit package system with multi-chip module

Electric device, stack of electric devices, and method of manufacturing a stack of electric devices

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A STACKED INTEGRATED CIRCUIT PACKAGE

Multilayer wiring substrate, method of manufacturing the same, and semiconductor device

Package for monolithic compound semiconductor (CSC) devices for DC to DC converters

Intergrated circuit packaging with improved die bonding

Integrated circuit package system with dual connectivity

Integrated circuit package system with external interconnects at high density

Integrated circuit package system with leads separated from a die paddle

Integrated circuit package-in-package system with leads

Thermal enhanced upper and dual heat sink exposed molded leadless package

Multi-Chip Stacked Package Structure

Molded semiconductor device including IC-chip covered with conductor member

Formation of circuitry with modification of feature height

Three-Dimensional Memory-Based Three-Dimensional Memory Module

Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom

Manufacturing process for a quad flat non-leaded chip package structure

MANUFACTURING PROCESS FOR A QUAD FLAT NON-LEADED CHIP PACKAGE STRUCTURE

Semiconductor connection component

Manufacturing process for a quad flat non-leaded chip package structure

Manufacturing process for a chip package structure

Manufacturing process for a chip package structure

Manufacturing process for a chip package structure

Electronic device having stack-type semiconductor package and method of forming the same

Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket

Chip module and a fabrication method thereof

Stack chip and stack chip package having the same

Package structure for multiple die stack

Structure of high performance combo chip and processing method

Multi-chip semiconductor device

Dual-sided chip attached modules

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

Semiconductor device package structure

Semiconductor package embedded in substrate, system including the same and associated methods

Singulated semiconductor package

Semiconductor device with leadframe including a diffusion barrier

Chip package with asymmetric molding

Semiconductor package and method of assembling a semiconductor package

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Multilayer semiconductor device

Manufacturing process for a Quad Flat Non-leaded chip package structure

SEMICONDUCTOR PACKAGE HAVING A GRID ARRAY OF PIN-ATTACHED BALLS

Method of manufacturing a semiconductor device including plural semiconductor chips

Optoelectronic circuit with a photoreceptor and a laser diode, and module comprising the same

Semiconductor device and manufacturing method of the same

Imaging device and method for a bonding apparatus

Bidirectional switch module

Semiconductor device

Semiconductor apparatus

Semiconductor apparatus

Stack-type semiconductor package, method of forming the same and electronic system including the same

SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME

Semiconductor device with non-overlapped circuits

MULTIPLE CHIP SEMICONDUCTOR DEVICE

Method and structure for increased wire bond density in packages for semiconductor chips

Structure of high performance combo chip and processing method

Stacked chip package with redistribution lines

Semiconductor device and method of manufacturing the same

Post passivation structure for a semiconductor device and packaging process for same

Semiconductor device and plural semiconductor elements with suppressed bending

IC package having IC-to-PCB interconnects on the top and bottom of the package substrate

Ball grid array package enhanced with a thermal and electrical connector

STACKED SEMICONDUCTOR PACKAGE WITH A REDUCED VOLUME

CO-PACKAGED HIGH-SIDE AND LOW-SIDE NMOSFETS FOR EFFICIENT DC-DC POWER CONVERSION

Integrated Circuit Package with Passive Component

Integrated circuit package system employing an offset stacked configuration

Integrated circuit package-in-package system with side-by-side and offset stacking

Semiconductor memory package

BONDING-PATTERNED DEVICE AND ELECTRONIC COMPONENT

Self locking and aligning clip structure for semiconductor die package

Method of manufacturing semiconductor device having plural dicing steps

APPARATUS TO SAW WAFER AND HAVING NOZZLE TO REMOVE BURRS IN SCRIBE LANES, METHOD OF SAWING WAFER, AND SEMICONDUCTOR PACKAGE FABRICATED BY THE SAME

Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material

Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Semiconductor device

METHOD OF MANUFACTURING A COMBINED MULTILAYER CIRCUIT BOARD HAVING EMBEDDED CHIPS

Wirebond pad for semiconductor chip or wafer

Semiconductor packaging method

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

Multilayer ceramic substrate and method for producing same

Micro-power source module

Semiconductor device having a semiconductor chip mounted on an insulator film and coupled with a wiring layer, and method for manufacturing the same

CORNER I/O PAD DENSITY

Semiconductor device, substrate and semiconductor device manufacturing method

Package structure and manufacturing method thereof

DIE STACKING IN MULTI-DIE STACKS USING DIE SUPPORT MECHANISMS

Semiconductor package having buss-less substrate

Package structure and manufacturing method thereof

Method of Manufacture and Identification of Semiconductor Chip Marked For Identification with Internal Marking Indicia and Protection Thereof by Non-black Layer and Device Produced Thereby

Semiconductor package structure

STACK PACKAGE AND METHOD OF FABRICATING THE SAME

LEAD FRAME STRUCTURE

Semiconductor chip stack-type package and method of fabricating the same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Multi-chip module package

Semiconductor component

Lead frame with non-conductive connective bar

Electronic component with buffer layer

Semiconductor device and printed circuit board

Method of manufacturing semiconductor device with electrode for external connection and semiconductor device obtained by means of said method

Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

Method for producing shock and tamper resistant microelectronic devices

WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND WIRING BOARD ASSEMBLY

Planar magnetic device and power supply IC package using same

Multi-substrate region-based package and method for fabricating the same

Semiconductor element and semiconductor device

Microelectronic package

Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking

Cu-Mo substrate and method for producing same

Multidirectional Semiconductor Device Package Thermal Enhancement Systems and Methods

Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing

Power semiconductor device

INTEGRATED DEVICE AND CIRCUIT SYSTEM

Light emitting element

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A PACKAGED INTEGRATED CIRCUIT

Fabrication method of an organic substrate having embedded active-chips

Cascode current sensor for discrete power semiconductor devices

Semiconductor circuit and switching power supply apparatus

ADHESION STRUCTURE FOR A PACKAGE APPARATUS

Near chip scale package integration process

Integrated Circuit Having a Plurality of Connection Pads and Integrated Circuit Package

Method of fabricating stacked assembly including plurality of stacked microelectronic elements

METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED DIE

Semiconductor structure and semiconductor manufacturing method

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof

Power semiconductor module

Packaging substrate and application thereof

Mounting assembly of semiconductor packages prevent soldering defects caused by substrate warpage

Leadframe-based semiconductor package

SEMICONDUCTOR DEVICE

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

Thermally enhanced ball grid array package formed in strip with one-piece die-attached exposed heat spreader

Heat slug and semiconductor package

BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME

Adhesive bleed prevention method and product produced from same

Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same

Power electronics devices with integrated gate drive circuitry

Output control device, and AC/DC power source device, circuit device, LED backlight circuit device, and switching DC/DC converter device each using output control device

SEMICONDUCTOR DEVICE

Semiconductor device manufacturing method

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

SEMICONDUCTOR DEVICE

Arrangement of stacked integrated circuit dice having a direct electrical connection

Bridge type pad structure of a semiconductor device

Semiconductor chip package and method for designing the same

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

INTEGRATED CIRCUIT

Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication

Integrated circuit packaging system for fine pitch substrates

SEMICONDUCTOR SUBSTRATES CONNECTED WITH A BALL GRID ARRAY

Integrated Support Structure for Stacked Semiconductors With Overhang

Semiconductor device and lead frame

Integrated circuit package system with multiple devices

Lead frame package apparatus and method

SEMICONDUCTOR PACKAGE APPARATUS

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Component and assemblies with ends offset downwardly

Rearrangement sheet, semiconductor device and method of manufacturing thereof

METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING

Method for forming semiconductor package and mold cast used for the same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies

Connector with build-in control unit and its application

MCU with integrated voltage isolator to provide a galvanic isolation between input and output

Tapered dielectric and conductor structures and applications thereof

Semiconductor device

CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Electrical connections for multichip modules

Bond pad stacks for ESD under pad and active under pad bonding

Integrated circuit having a semiconductor substrate with a barrier layer

Semiconductor device and method for manufacturing the same

Semiconductor device with heat sink and method for manufacturing the same

Heat extraction from packaged semiconductor chips, scalable with chip area

Stacked integrated circuit leadframe package system

LEAD FRAME, SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME

Semiconductor device package

Thin plastic leadless package with exposed metal die paddle

Thin semiconductor die packages and associated systems and methods

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS

Semiconductor device and method of manufacturing the same

Sensor package

Semiconductor device

Light emitting device and method of manufacturing the same

Dual cavity, high-heat dissipating printed wiring board assembly

Methods of attaching a die to a substrate

Method for forming side wirings

Functional-Element-Mounted Module, Process for Producing the Same, Resin Sealing Plate for Use Therein, and Substrate Structure for Resin Sealing

PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME

Semiconductor device with offset stacked integrated circuits

Memory card and its manufacturing method

Semiconductor assembly having a housing

Semiconductor device sealed in a resin section and method for manufacturing the same

Semiconductor apparatus having side surface wiring

Circuit module and electrical component

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of manufacturing the same

Semiconductor device having double side electrode structure and method of producing the same

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE PROVIDED WITH WIRING BOARD, METHOD FOR MANUFACTURING SUCH ELECTRONIC DEVICE AND WIRING BOARD FOR SUCH ELECTRONIC DEVICE

Method for packaging semiconductor dies having through-silicon vias

Semiconductor device

Semiconductor device and manufacturing method of the same

QUAD FLAT PACKAGE WITH EXPOSED COMMON ELECTRODE BARS

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Method of manufacturing printed wiring board

Capacitive isolator

METHOD OF MANUFACTURING INTERCONNECT SUBSTRATE AND SEMICONDUCTOR DEVICE

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Fretting and whisker resistant coating system and method

Electronic assemblies without solder and methods for their manufacture

Semiconductor assembly

Integrated circuit package system with flexible substrate and mounded package

Integrated circuit with electromagnetic intrachip communication and methods for use therewith

Semiconductor module, and hybrid vehicle drive device including the same

Electronic device which disconnects first and second terminals upon lapse of a prescribed device lifetime

Semiconductor chip package and method of manufacturing the same

Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip

Stacked semiconductor device and semiconductor memory device

Integrated circuit package system with wire-in-film isolation barrier

Multichip module package and fabrication method

Heat-conductive package structure

Microelectronic package element and method of fabricating thereof

Packaged semiconductor assemblies and methods for manufacturing such assemblies

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Lead frame, semiconductor package including the lead frame and method of forming the lead frame

Integrated circuit package for semiconductor devices with improved electric resistance and inductance

Fusion quad flat semiconductor package