Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface

Manufacturing method of semiconductor device

Manufacturing method of semiconductor device

Semiconductor device and manufacturing the same

Epoxy resin composition and semiconductor device

DC/DC converter

Integrated circuit package system with L-shaped leadfingers

Integrated circuit package system with bonding lands

Cap layer for an aluminum copper bond pad

Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same

Apparatus for integrated input/output circuit and verification method thereof

Ball grid array package

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic circuit, a semiconductor device and a mounting substrate

Substrate of chip package and chip package structure thereof

Semiconductor package including transformer or antenna

Chip package and stacked structure of chip packages

Semiconductor module and method of manufacturing the same

Semiconductor device

Semiconductor apparatus containing multi-chip package structures

Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies

Method of manufacturing circuit device

RF module including control IC without the aid of a relay pad

Hermetically sealed ceramic package

Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor

Semiconductor chip package having an adhesive tape attached on bonding wires

Wafer level chip packaging

Integrated circuit package system with exposed interconnects

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER

Power composite integrated semiconductor device and manufacturing method thereof

Integrated circuit package system with heat sink

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

Connection structure and method for fabricating the same

Method of fabricating a 3-D package stacking system

Semiconductor device

Semiconductor device

Semiconductor component with semiconductor chip and adhesive film, and method for its production

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Coreless substrate and manufacturing thereof

Customizable power and ground pins

Multi-chip module for battery power control

COL-TSOP with nonconductive material for reducing package capacitance

Semiconductor device and method of manufacturing the same

Method of producing a semiconductor device by forming an oxide film on a resin layer

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Ceramic multilayer substrate

Active area bonding compatible high current structures

Method for producing a surface-mountable semiconductor component

Method for manufacturing physical quantity sensor

Method and structure for coupling two microcircuits

Semiconductor device

Integrated circuit package system including zero fillet resin

Plurality of devices attached by solder bumps

Semiconductor device with an improved solder joint

Semiconductor device having through contact blocks with external contact areas

Semiconductor device

Stacked integrated circuit package system with face to face stack configuration

Semiconductor device package and methods for producing same

Stacked semiconductor structure and fabrication method thereof

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Highly reliable, cost effective and thermally enhanced AuSn die-attach technology

Lead frame including suspending leads having trenches formed therein

Semiconductor device and manufacturing method thereof

Semiconductor device, electronic device, and manufacturing method of the same

Interdigitated conductive lead frame or laminate lead frame for GaN die

Electronic module with stacked semiconductors

Bond capillary design for ribbon wire bonding

Method for setting capillary contact position data and wire bonding apparatus using the same

Ground shields for semiconductors

Interconnect substrate, semiconductor device, and method of manufacturing the same

Wafer level chip scale package system

INTEGRATED CIRCUIT SYSTEM WITH WAFERSCALE SPACER SYSTEM

Fabrication of an integrated circuit package

Method of packaging semiconductor die without lead frame or substrate

Method of manufacturing semiconductor device

Hybrid multilayer substrate and method for manufacturing the same

Micromechanical Getter Anchor

Semiconductor device and method of manufacturing thereof

Circuit device

Structure and method for bond pads of copper-metallized integrated circuits

Wiring board and semiconductor apparatus

Power semiconductor component having chip stack

Semiconductor device

Bonding pad structure

Plastic ball grid array package with integral heatsink

Thin integrated circuit device packages for improved radio frequency performance

Integrated circuit underfill package system

Semiconductor package

Circuit board, semiconductor package having the same, and method of manufacturing the circuit board

Semiconductor module having a semiconductor chip stack and method

Stack of semiconductor chips

Functional device-mounted module and a process for producing the same

INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING DIE-ATTACH PAD WITH ELEVATED BONDLINE THICKNESS

Multi-chips module package and manufacturing method thereof

Aluminum leadframes for semiconductor QFN/SON devices

Semiconductor device

Method of manufacturing semiconductor device including bonding pad and fuse elements

Semiconductor device including fuse elements and bonding pad

Wafer level package having floated metal line and method thereof

Warpage-reducing packaging design

Method of manufacturing multi-layer wiring board

Methods for fabricating stiffeners for flexible substrates

Semiconductor apparatus manufacturing method

Optical bond-wire interconnections and a method for fabrication thereof

Semiconductor device and manufacturing method of them

Semiconductor device sealed with electrical insulation sealing member

Flip-attached and underfilled stacked semiconductor devices

Multilayer integrated circuit for RF communication and method for assembly thereof

Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein

Wafer level stack structure for system-in-package and method thereof

Stack chip and stack chip package having the same

Semiconductor device, interposer chip and manufacturing method of semiconductor device

Low profile semiconductor system having a partial-cavity substrate

Integrated circuit package system including wide flange leadframe

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

Semiconductor memory card

CHIP CARD MODULE

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

Padless die support integrated circuit package system

Integrated circuit package system with multiple molding

Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)

Circuit board and package structure thereof

Methods for fabricating chip-scale packages having carrier bonds

Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package

Electronic component and method for its assembly

OVERMOLDED OPTICAL PACKAGE

Nonvolatile memory system

Semiconductor device and electric apparatus

Semiconductor package, substrate with conductive post, stacked type semiconductor device, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor device

Method of wire bonding over active area of a semiconductor circuit

Method of wire bonding over active area of a semiconductor circuit

Semiconductor chip package with attached electronic devices, and integrated circuit module having the same

Integrated circuit having second substrate to facilitate core power and ground distribution

Method of wire bonding over active area of a semiconductor circuit

Interconnects with interlocks

Carbon nanotube circuit component structure

Thermally enhanced semiconductor package and method of producing the same

Semiconductor wafer scale package system

Managed memory component

METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT

Semiconductor package structure and fabrication method thereof

Semiconductor package with integrated heatsink and electromagnetic shield

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Leadless lead-frame

Low cost method to produce high volume lead frames

Semiconductor package

Semiconductor package structure and fabrication method thereof

Semiconductor package and process for making the same

CHIP PACKAGE WITH BUILT-IN CAPACITOR STRUCTURE

CIRCUIT BOARD, CIRCUIT APPARATUS, AND METHOD OF MANUFACTURING THE CIRCUIT BOARD

Strip for integrated circuit packages having a maximized usable area

Method of manufacturing wiring substrate

Semiconductor device package and method for manufacturing same

Method for fabricating a flip chip system in package

SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF

Ceramic circuit board, method for making the same, and power module

Printed circuit board and method of manufacturing semiconductor package using the same

Millimeter-wave radar apparatus and millimeter radar system using the same

Arrangement and method impedance matching

Semiconductor device and electronic component module using the same

Semiconductor component and apparatus for production of a semiconductor component

Power semiconductor module

Semiconductor-element mounting substrate, semiconductor device, and electronic equipment

Through-hole contacts in a semiconductor device

Method for manufacturing mold type semiconductor device

SEMICONDUCTOR PACKAGE HAVING IMPROVED SOLDER JOINT RELIABILITY AND METHOD OF FABRICATING THE SAME

Structure of Ball Grid Array package

Semiconductor device

Pad layout

Electrical connections made with dissimilar metals

Circuit module

Connecting module having passive components

Package optical chip with conductive pillars

Managed memory component

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Multi-chip ball grid array package and method of manufacture

Electronic circuit package

Integrated circuit package-in-package system

Low profile managed memory component

Stacked integrated circuit package-in-package system

Multi-chip package system

Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates

Interconnected IC packages with vertical SMT pads

Circuit board and electronic assembly

Package structure of thin lead-frame

Overhang integrated circuit package system

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor device

Rounded contact fingers on substrate/PCB for crack prevention

Method for manufacturing high-frequency module device

Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages

Method of fabricating leadframe based flash memory cards including singulation by straight line cuts

Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package

ARRAY CIRCUIT SUBSTRATE AND WIRE BONDING PROCESS USING THE SAME

Forced heat transfer apparatus for heating stacked dice

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Hidden plating traces

Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling same

Electrical ground method for ball stack package

Multichip leadframe package

Test pads on flash memory cards

Package method for flash memory card and structure thereof

Chip-spacer integrated radio frequency ID tags, methods of making same, and systems containing same

Microelectronic packages and methods therefor

Microelectronic devices and methods for manufacturing microelectronic devices

Electronic circuit device and manufacturing method thereof

Semiconductor package having improved thermal performance

System to wirebond power signals to flip-chip core

Semiconductor device with semiconductor device components embedded in a plastic housing composition

Chip packaging structure without leadframe

Semiconductor device and method of manufacturing the same

Vertical power semiconductor component, semiconductor device and methods for the production thereof

Semiconductor device having a metal plate conductor

Multi-chip package sharing temperature-compensated self-refresh signal and method thereof

Power Semiconductor Circuit And Method Of Manufacturing A Power Semiconductor Circuit

Semiconductor device

Semiconductor chip and semiconductor device

Stacked packages with interconnecting pins

Packaged chip having features for improved signal transmission on the package

Techniques for packaging multiple device components

Semiconductor component including semiconductor chip and method for producing the same

Hermetically sealed integrated circuits and method

Package having exposed integrated circuit device

Plating bar design for high speed package design

Semiconductor device having semiconductor element, insulation substrate and metal electrode

Circuit board, semiconductor device, and manufacturing method of circuit board

Semiconductor device and electronic control unit using the same

Method for fabricating semiconductor packages, and structure and method for positioning semiconductor components

Leadframe and method of manufacturing the same

Ribbon bonding in an electronic package

Wire bonding system and method of use

Stackable molded packages and methods of making the same

Package for high power density devices

Schottky Diode Device with Aluminum Pickup of Backside Cathode

Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

Heat spreader and package structure utilizing the same

SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device with thermoplastic resin to reduce warpage

Stack package of ball grid array type

Semiconductor device and manufacturing method of the same

Packaging method of a plurality of chips stacked on each other and package structure thereof

Device package

Semiconductor package structure and method of manufacture

Semiconductor die structure featuring a triple pad organization

Semiconductor package

HEAT FIXTURE FOR WIRE BONDING

Semiconductor device module structure

Electronics package with an integrated circuit device having post wafer fabrication integrated passive components

Multi-strand substrate for ball-grid array assemblies and method

Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors

Negative thermal expansion material filler for low CTE composites

Combination quad flat no-lead and thin small outline package

Integrated circuit having bond pad with improved thermal and mechanical properties

Space-efficient package for laterally conducting device

Semiconductor device and mold for resin-molding semiconductor device

FINE-SIZED CHIP PACKAGE STRUCTURE

Semiconductor device having a molded package

Electrical microfilament to circuit interface

Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

System-in-package structure

Thermal enhanced upper and dual heat sink exposed molded leadless package

Semiconductor device

Microelectronic devices having a curved surface and methods for manufacturing the same

Integrated circuit devices including compliant material under bond pads and methods of fabrication

Multichip stacking structure

Semiconductor package having increased resistance to electrostatic discharge

Semiconductor chip mounted interposer, semiconductor device, semiconductor chip interposer fabrication method, bare chip mounted interposer, and interposer sheet

Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same

Structure and method for thin single or multichip semiconductor QFN packages

Chip package structure

Surface processing agent for tin or tin alloy material

Carbon nanotube reinforced metallic layer

System and method for implementing transformer on package substrate

Metal-base circuit board and its manufacturing method

Microelectronic component assemblies having lead frames adapted to reduce package bow

Method of making exposed pad ball grid array package

Sensor system having a substrate and a housing, and method for manufacturing a sensor system

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device with a wiring substrate and method for producing the same

Semiconductor module and manufacturing method thereof

Package substrate

Metal core, package board, and fabricating method thereof

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes

MEMORY CARD

Chip package structure

Microelectronic package having a stiffening element and method of making same

Leadless semiconductor package and method of manufacture

Semiconductor components having through wire interconnects (TWI)

Method of manufacturing a semiconductor package using lead frame having through holes or hollows therein

High-temperature solder, high-temperature solder paste and power semiconductor using same

Interconnection element for BGA housings and method for producing the same

Semiconductor device having high frequency components and manufacturing method thereof

Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing

Circuit under pad structure and bonding pad process

Individualized low parasitic power distribution lines deposited over active integrated circuits