Method of making semiconductor package having exposed heat spreader

Protection for an integrated circuit chip containing confidential data

Radio-frequency system in package including antenna

A SEMICONDUCTOR HAVING A COPPER-BASED METALLIZATION STACK WITH A LAST ALUMINUM METAL LINE LAYER

Semiconductor packages having leadframe-based connection arrays

Interposer and stacked chip package

Circuit substrate and method of manufacture

Semiconductor/printed circuit board assembly, and computer system

Semiconductor integrated circuit

SEMICONDUCTOR DEVICE

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Low cost bonding pad and method of fabricating same

Method and apparatus that provides differential connections with improved ESD protection and routing

Two-step high bottleneck type capillary for wire bonding device

Power module

Prevention of Sn whisker growth for high reliability electronic devices

Method for the interconnection of active and passive components and resulting thin heterogeneous component

Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

Flip-chip semiconductor device manufacturing method

Method of manufacturing a wafer level package with a cap structure for hermetically sealing a micro device

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Output amplifier structure with bias compensation

Semiconductor package with heat sink, stack package using the same and manufacturing method thereof

Semiconductor package structure and method of manufacture

SEMICONDUCTOR DEVICE

Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing

Packaged device and method of forming same

Stackable semiconductor package and method for its fabrication

Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate

Integrated circuit stacking system with integrated passive components

Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides

Integrated circuit package system with lead structures including a dummy tie bar

Semiconductor device having a heat spreader exposed from a seal resin

Ultra-thin quad flat no-lead (QFN) package

Semiconductor devices including voltage switchable materials for over-voltage protection

SEMICONDUCTOR DEVICE

Method and device for connecting chips

Method of fabricating an exposed die package

Integrated circuit package system with heat sink

Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure

Method of forming a leaded molded array package

Micro chip-scale-package system

Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate

Method of manufacturing a semiconductor device

INTEGRATED CIRCUIT PACKAGE SYSTEM

Enhancing shock resistance in semiconductor packages

Reversible leadless package and methods of making and using same

Method and apparatus for forming a DMD window frame with molded glass

Integrated circuit package system with channel

INTEGRATED CIRCUIT PACKAGE SYSTEM

Wafer scale heat slug system

Semiconductor device and method for producing it, and use of an electrospinning method

Semiconductor device

INTEGRATED CIRCUIT PACKAGE SYSTEM

Semiconductor chip having bond pads

Semiconductor chip having bond pads

Package and package module of the package

Chip and package structure

Microelectronic connection component

Bumped chip carrier package using lead frame and method for manufacturing the same

Stacked integrated circuit leadframe package system

Integrated circuit package system including ribbon bond interconnect

Semiconductor device

Semiconductor chip package with a metal substrate and semiconductor module having the same

Low voltage drop and high thermal performance ball grid array package

Integrated circuit package system with heat dissipation enclosure

Integrated circuit package system using heat slug

Method for fabricating semiconductor package

Semiconductor package system with thermal die bonding

Integrated circuit package system with mold clamp line critical area having widened conductive traces

Integrated circuit package system with a heat sink

Integrated circuit package system including shield

Offset integrated circuit package-on-package stacking system

Chip stack package and manufacturing method thereof

Method for fabricating semiconductor package with stacked chips

Semiconductor device and method of manufacturing the same

Integrated circuit package to package stacking system

Integrated circuit package system with multi-planar paddle

Semiconductor device

Semiconductor chip having bond pads

Wire bonding method

Semiconductor device, fabrication method therefor, and film fabrication method

Micro lead frame packages and methods of manufacturing the same

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

BRACE FOR WIRE LOOP

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Packaging methods

Mm-wave antenna using conventional IC packaging

Constant voltage diode

Ball grid array (BGA) package and method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device

Reduction of macro level stresses in copper/low-K wafers

Coupling substrate for semiconductor components and method for producing the same

Method for making stacked integrated circuits (ICs) using prepackaged parts

Single chip and stack-type chip semiconductor package and method of manufacturing the same

Multi-stack chip package with wired bonded chips

IC card with bonding wire connections of different lengths

IC card

Electrode package for semiconductor device

Power semiconductor module

Lead arrangement and chip package using the same

Low profile semiconductor package

Semiconductor device and a method of manufacturing the same

IC card

CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Power module having at least two substrates

Manufacturing method for magnetic sensor and lead frame therefor

Ultrathin leadframe BGA circuit package

Method of making stacked die package

Fabrication method for a chip packaging structure

METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD

Board on chip package and method of manufacturing the same

Electronic assembly having graded wire bonding

Chip stack structure having shielding capability and system-in-package module using the same

Semiconductor device and manufacturing method thereof

Semiconductor chip with post-passivation scheme formed over passivation layer

Structure and self-locating method of making capped chips

Structure and method of making capped chips having vertical interconnects

Semiconductor device

Back-face and edge interconnects for lidded package

Package device with electromagnetic interference shield

Electronic-part built-in substrate and manufacturing method therefor

Active device bases and leadframes utilizing the same

Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture

Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die

Methods for a multiple die integrated circuit package

Integrated circuit package system including high-density small footprint system-in-package

Packaging for high speed integrated circuits

Substrate frame

LEADFRAME FOR SEMICONDUCTOR PACKAGES

Integrated circuit packaging

Multiple die integrated circuit package

Three-dimensionally integrated electronic assembly

High frequency chip packages with connecting elements

Method and apparatus for attaching a workpiece to a workpiece support

Bond Surface Conditioning System for Improved Bondability

Complex RF device and method for manufacturing the same

Semiconductor heat-transfer method

Semiconductor component and method for production of a semiconductor component

Embedded inductor and application thereof

Embedded inductor element and chip package applying the same

Semiconductor device with improved encapsulation

Integrated circuit package encapsulating a hermetically sealed device

Semiconductor device with reduced package cross-talk and loss

Semiconductor device and method for producing the same

Integrated chip device in a package

Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking

Integrated circuit mounting for thermal stress relief useable in a multi-chip module

Circuit device and method of manufacturing the same

Semiconductor structure and method of assembly

Semiconductor structure and method of manufacture

Multi-chip package structure

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Lead frame having outer leads coated with a four layer plating

Housed DRAM chip for high-speed applications

Production process for manufacturing such semiconductor package

Leadframes for improved moisture reliability of semiconductor devices

Electronic module and method of assembling the same

Thin package system with external terminals

Bond pad structure

Semiconductor device and method for manufacturing thereof

Electronic part mounting substrate and method for producing same

Semiconductor component and method for contracting said semiconductor component

Method for applying a structure of joining material to the back surfaces of semiconductor chips

CHIP PACKAGE METHOD

Method of improving power distribution in wirebond semiconductor packages

Encapsulation of a chip module

Semiconductor device with multiple designation marks

Re-enforced ball-grid array packages for semiconductor products

Power semiconductor device in lead frame employing connecting element with conductive film

Integrated circuit package system using etched leadframe

Semiconductor insulation structure

Decoupling capacitor closely coupled with integrated circuit

Stack structure of carrier board embedded with semiconductor components and method for fabricating the same

Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside

Power semiconductor module with overcurrent protective device

Conductor substrate, semiconductor device and production method thereof

Semiconductor package with position member

Chip package having with asymmetric molding and turbulent plate downset design

Apparatus and method for providing bypass capacitance and power routing in QFP package

Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages

Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

Electronic component packaging structure and method for producing the same

Semiconductor device

Universal chip package structure

Support structures for semiconductor devices

Bond pads and methods for fabricating the same

Manufacturing method for semiconductor device

Arrangement of conductive pads on grid array package and on circuit board

Electronic apparatus

Semiconductor module having a coupling substrate, and methods for its production

Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same

Integrated circuit package system

Semiconductor packaging process and carrier for semiconductor package

Lead frame package structure with high density of lead pins arrangement

Semiconductor device with front side metallization and method for the production thereof

Microelectronic interconnect substrate and packaging techniques

Microelectronic package having multiple conductive paths through an opening in a support substrate

Method of manufacturing a semiconductor device including a bump forming process

Semiconductor device and a manufacturing method of the same

Microelectronic packages and methods therefor

Method of forming a magnetic device having a conductive clip

CHIP PACKAGE STRUCTURE

Relay board and semiconductor device having the relay board

Electronic device and manufacturing method of the same

Semiconductor device

Semiconductor chip and semiconductor device

Electronic device, semiconductor device using same, and method for manufacturing semiconductor device

Semiconductor device having metallic lead and electronic device having lead frame

Semiconductor device and a manufacturing method of the same

Method of forming a molded array package device having an exposed tab and structure

Integrated circuit package system with multi-surface die attach pad

Method of forming a power module with a magnetic device having a conductive clip

Method of assembly for multi-flip chip on lead frame on overmolded IC package

Semiconductor constructions comprising multi-level patterns of radiation-imageable material

Die package and method for making the same

PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE

Methods for protecting metal surfaces

Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor package

Flash memory card

Flash memory card

Packaged die on PCB with heat sink encapsulant and methods

Cavity chip package

Package with barrier wall and method for manufacturing the same

Package of leadframe with heatsinks

Power semiconductor module with MOS chip

Molded semiconductor package

Insulated gate semiconductor device having a clamping element to clamp gate-emitter voltage and method of manufacturing thereof

Semiconductor device with a resin-sealed optical semiconductor element

Electronic plug unit

Semiconductor device and a method of manufacturing the same

Semiconductor manufacturing method

Method of forming an electrical contact

Method for manufacturing an adhesive substrate with a die-cavity sidewall

Method for manufacturing substrate with cavity

Method of forming a semiconductor device

Method for manufacturing substrate with cavity

THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY

Decoupling capacitor closely coupled with integrated circuit

Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices

Optical module with can package

Wire sweep resistant semiconductor package and manufacturing method therefor

Complete power management system implemented in a single surface mount package

Complete power management system implemented in a single surface mount package

QFN/SON compatible package with SMT land pads

Method of encapsulating packaged microelectronic devices with a barrier

SEMICONDUCTOR DEVICE

Semiconductor package with internal shunt resistor

BGA package with stacked semiconductor chips and method of manufacturing the same

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Integrated circuit protruding pad package system

Integrated circuit package system with adhesive restraint

Method for producing bonding connection of semiconductor device

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Image sensing device package structure

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Monitoring deformation and time to logically constrain a bonding process

INDUCTIVE STRUCTURE

Manufacturing method of a semiconductor device to suppress generation of whiskers

Method of forming an electrical contact

Method of manufacturing quad flat non-leaded semiconductor package

Semiconductor chip having bond pads

Method of manufacturing a semiconductor device

Semiconductor device having metallic plate with groove

External contact material for external contacts of a semiconductor device and method of making the same

Semiconductor chip having bond pads and multi-chip package

System in package (SIP) structure

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials

Structure of IC packaging and method forming the same

Semiconductor component and method of assembling the same

Multi-chip stack structure

Carrier-free semiconductor package with stand-off member and fabrication method thereof

Electronic circuit module and manufacturing method thereof

Semiconductor device with operation mode set by external resistor

Semiconductor chip package and method of manufacturing the same

Method and apparatus for decoupling conductive portions of a microelectronic device package

Semiconductor device having a probing region

Semiconductor package and manufacturing method thereof

THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME

Multi-chip stacking package structure

MATRIX PACKAGE SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND MOLDING PROCESS THEREOF

Low height vertical sensor packaging

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device and method of manufacturing the same

Semiconductor device, lead frame used in the semiconductor device and electronic equipment using the semiconductor device

Resin mold type semiconductor device

Semiconductor package with a conductive post and wiring pattern

Die pad for semiconductor packages and methods of making and using same

Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness

Semiconductor device and method of manufacturing the same

Multi-chip package type semiconductor device

Semiconductor module

Solid image pickup unit and camera module

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology