Encapsulation of circuit components to reduce thermal cycling stress

Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Low cost method to produce high volume lead frames

Microfeature systems including adhered microfeature workpieces and support members

Integrated circuit package-in-package system

Method of manufacturing semiconductor device

Thermally conductive resin sheet and power module using the same

High frequency semiconductor device

Semiconductor package, ID generating system thereof, ID recognizing system thereof, ID recognition method thereof, semiconductor integrated circuit chip, ID generating system thereof, ID recognizing system thereof, and ID recognition method thereof

Bonding apparatus

Semiconductor device with chip-on-board structure

Semiconductor device with a number of bonding leads and method for producing the same

Semiconductor device

Flip chip package with advanced electrical and thermal properties for high current designs

Semiconductor device and manufacturing method thereof

High frequency arrangement

Semiconductor device

Semiconductor device and its writing method

Electronic component with stacked semiconductor chips and method for producing the same

Semiconductor device

Semiconductor packages and methods for making and using same

Module card structure

Semiconductor package having improved adhesiveness and ground bonding

Semiconductor device with semiconductor chip mounted in package

Dual row leadframe and fabrication method

Package stacking lead frame system

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Apparatus and method for bonding wires

Wire bonding method

Semiconductor device with micro connecting elements and method for producing the same

Current sensor

Forming a cap above a metal layer

Semiconductor device

Semiconductor device

Component arrangement for series terminal for high-voltage applications

Substrate for an FBGA semiconductor component

Method for producing an FBGA component and substrate for carrying out the method

Semiconductor device and method of manufacturing the same

Ground arch for wirebond ball grid arrays

Input stage of semiconductor device with multiple pads of common function, and multi-chip package having the same

Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices

Chip package and producing method thereof

Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures

Semiconductor device and process for fabrication thereof

Semiconductor package with low and high-speed signal paths

Semiconductor storage device, semiconductor device, and manufacturing method therefor

IC chip coating material and vacuum fluorescent display device using same

Perimeter matrix ball grid array circuit package with a populated center

Methods of adhering microfeature workpieces, including a chip, to a support member

Minimized wire bonds in transient blocking unit packaging

Semiconductor apparatus

Semiconductor device and method of making the same

Molded package and semiconductor device using molded package

Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner

High performance IC package and method

Ball grid array package

Interposers with flexible solder pad elements

Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof

Nested integrated circuit package on package system

Integrated circuit package system using interposer

Semiconductor device with gold coatings, and process for producing it

Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods

Multi-leadframe semiconductor package and method of manufacture

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Smart card, smart card module, and a method for production of a smart card module

Wire bonding method

Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

Fabrication of stacked microelectronic devices

Semiconductor device and a method of manufacturing the same

Device packages

Method of embedding semiconductor element in carrier and embedded structure thereof

Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages

Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

Method of fabricating a semiconductor stacked multi-package module having inverted second package

Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA)

Chip-stacked semiconductor package and method for fabricating the same

Device packages having stable wirebonds

Semiconductor module

Image pick-up inspection equipment and method

Novel method for copper wafer wire bonding

Device package

Semiconductor package system with cavity substrate

Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages

Semiconductor device and method of manufacturing the same

Chip packaging structure adapted to reduce electromagnetic interference

Method and apparatus for packaging an electronic chip

Integrated circuit device having encapsulant dam with chamfered edge

Semiconductor device

Transducer assembly, capillary and wire bonding method using the same

Molding tool and a method of forming an electronic device package

Printed wiring board having a solder pad and a method for manufacturing the same

Semiconductor manufacturing method for die bonding

Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same

Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line

Manufacturing method of semiconductor device

Integrated circuit die connection methods and apparatus

Thermal enhanced package for block mold assembly

Electronic component for radio frequency applications and method for producing the same

Integrated circuit package encapsulating a hermetically sealed device

Semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing a semiconductor device

Semiconductor package with crossing conductor assembly and method of manufacture

Package structure and fabrication method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device

Bilayer aluminum last metal for interconnects and wirebond pads

Surface mount semiconductor device

Chip package and producing method thereof

Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same

Chip on board leadframe for semiconductor components having area array

Chip-type noise filter, manufacturing method thereof, and semiconductor package

Semiconductor device with sense structure

Method and apparatus for forming a low profile wire loop

Ribbon bonding tool and process

Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them

Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces

System-in-package wireless communication device comprising prepackaged power amplifier

VSAT block up converter (BUC) chip

Method of making a compliant interconnect assembly

Method in the fabrication of a memory device

Fabrication of stacked microelectronic devices

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Method for making a semiconductor multi-package module having inverted bump chip carrier second package

Circuit board and manufacturing method therefor and semiconductor package and manufacturing method therefor

Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof

Structure for joining a semiconductor package to a substrate using a solder column

Multi-surface IC packaging structures and methods for their manufacture

Multimedia card and transfer molding method

Semiconductor device and method of fabricating same

Low profile ball-grid array package for high power

Semiconductor package using flexible film and method of manufacturing the same

Apparatus of clamping semiconductor devices using sliding finger supports

Cooling structure of solid state and formation thereof with integrated package

Die paddle clamping method for wire bond enhancement

Thin array plastic package without die attach pad and process for fabricating the same

Integrated packaged having magnetic components

Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same

Semiconductor device

Semiconductor apparatus and manufacturing method

Electronic component and leadframe for producing the component

Semiconductor device having a particular electrode structure

High temperature, stable SiC device interconnects and packages having low thermal resistance

Package for gallium nitride semiconductor devices

Method for making a semiconductor multipackage module including a processor and memory package assemblies

Semiconductor chip stack package having dummy chip

Lead-frame-based semiconductor package and lead frame thereof

Lead frame routed chip pads for semiconductor packages

Leadframe and semiconductor package made using the leadframe

On-pad broadband matching network

Semiconductor device with split pad design

Support device for monolithically integrated circuits

Wire loop, semiconductor device having same and wire bonding method

Memory chip and semiconductor device using the memory chip and manufacturing method of those

Method of manufacturing a cavity package

Semiconductor device having signal line and reference potential planes separated by a vertical gap

Semiconductor device fabricating apparatus and semiconductor device fabricating method

Semiconductor package and fabrication method of the same

Semiconductor device package and manufacturing method thereof

BGA package substrate and method of fabricating same

Semiconductor device with improved arrangement of a through-hole in a wiring substrate

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Mounting pad structure for wire-bonding type lead frame packages

Semiconductor package having passive component disposed between semiconductor device and substrate

Method for manufacturing semiconductor device having a pair of heat sinks

Lead frame for semiconductor device

NANO IC packaging

Multi-chip package mounted memory card

Circuit device and portable device with symmetrical arrangement

DFN semiconductor package having reduced electrical resistance

Leadframe designs for plastic cavity transistor packages

Semiconductor package having enhanced heat dissipation and method of fabricating the same

Semiconductor package device having reduced mounting height and method for manufacturing the same

Dual flat non-leaded semiconductor package

Low cost lead-free preplated leadframe having improved adhesion and solderability

On-chip circuit pad structure

Semiconductor device

Wire bonds having pressure-absorbing balls

Adhesive of folder package

Method for cutting lead terminal of package type electronic component

Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package

Semiconductor device

Packaging for electronic modules

Stacked electronic component and manufacturing method thereof

Arrangement for energy conditioning

Intelligent high-power amplifier module

Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors

Chip support of a leadframe for an integrated circuit package

Copper interconnect

Semiconductor device for high frequency power amplification

Semiconductor device having exposed heat dissipating metal plate

Integrated circuit packaging device and method for matching impedance

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module

High power light emitting diode device

Micromechanical getter anchor

Power semiconductor device

Multi-chip package structure

Stack chip package

Microelectronic packages using a ceramic substrate having a window and a conductive surface region

Accessible electronic storage apparatus

Semiconductor device package

Stacked-type semiconductor device

Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication

Semiconductor integrated circuit device and method of manufacturing the same

Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device

Semiconductor package and lead frame therefor

Semiconductor device and method of fabricating the same

INTEGRATED CIRCUIT PACKAGE WITH INNER GROUND LAYER

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Ball grid array IC substrate with over voltage protection function

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Semiconductor device and radio communication device

Semiconductor device and manufacturing method therefor

Method of marking a low profile packaged semiconductor device

Packaged semiconductor die and manufacturing method thereof

Package that integrates passive and active devices with or without a lead frame

Methods of forming semiconductor packages

Semiconductor package with a controlled impedance bus

Module

Leadframe and packaged light emitting diode

Bonding pad structure

Carrier with metal bumps for semiconductor die packages

PACKAGED CHIP CAPABLE OF LOWERING CHARACTERISTIC IMPEDANCE

Semiconductor chip having coolant path, semiconductor package and package cooling system using the same

Multi lead frame power package

Ball grid array substrate having window and method of fabricating same

System for implementing a configurable integrated circuit

Semiconductor device with a substrate having a spiral shaped coil

Manufacturing method of a quad flat no-lead package structure

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Multi-chip package structure

Multi-chip package structure

Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component

Packaged electronic devices, and method for making same

Semiconductor device package with reduced leakage

Methods of making and using a floating lead finger on a lead frame

Packages for encapsulated semiconductor devices and method of making same

Use of a down-bond as a controlled inductor in integrated circuit applications

Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film

Monolithic microwave integrated circuit compatible FET structure

PCB, manufacturing method thereof and semiconductor package implementing the same

Semiconductor device and manufacturing method thereof

Memory package

Semiconductor device package

Compact system module with built-in thermoelectric cooling

BOND POSITIONING METHOD FOR WIRE-BONDING PROCESS AND SUBSTRATE FOR THE BOND POSITIONING METHOD

Housing for power semiconductor modules

Transceiver using low temperature co-fired ceramic method

Multi-chip module

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Multi-chip module having bonding wires and method of fabricating the same

Thermally enhanced package for an integrated circuit

Heat dissipating semiconductor package and fabrication method thereof

High density package interconnect wire bond strip line and method therefor

Flash preventing substrate and method for fabricating the same

Lead frame for semiconductor device

Semiconductor package, manufacturing method thereof and IC chip

Integrated circuit with stacked-die configuration utilizing substrate conduction

Multi-part lead frame with dissimilar materials

Semiconductor device and a method of manufacturing the same

Electrical-interference-isolated transistor structure

Semiconductor package having improved adhesion and solderability

Electronic component and a panel

Methods for fabricating stiffeners for flexible substrates

Carrier-free semiconductor package and fabrication method thereof

Semiconductor memory device and defect remedying method thereof

Thermal management of surface-mount circuit devices

Liquid metal thermal interface material system

Coolant cooled type semiconductor device

Printed circuit board having a bond wire shield structure for a signal transmission line

Semiconductor device, its manufacturing method, and radio communication device

Packaging structure with a plurality of drill holes formed directly below an underfill layer

Semiconductor package and fabrication method thereof

Semiconductor device and method of fabricating the same

Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packaging

Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method

Memory module having interconnected and stacked integrated circuits

Semiconductor package, memory card including the same, and mold for fabricating the memory card

Lead frame assemblies and decoupling capacitors

Sharp corner lead frame

Semiconductor package and manufacturing method thereof

Power semiconductor device

Memory cards and method of fabricating the memory cards

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Methods for assembling a stack package for high density integrated circuits

Bond pad for ball grid array package

Multi-chip module

Semiconductor device and manufacturing method of semiconductor device

Bond pad structure for gold wire bonding to copper low K dielectric silicon devices

Wire bond interconnection

Semiconductor device

Heat stud for stacked chip package

Chip package mechanism

Semiconductor device with improved heat dissipation

connection arrangement for micro lead frame plastic packages

Microelectronic assemblies incorporating inductors