Method for mounting an electronic part on a substrate using a liquid containing metal particles

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Structure and method for bond pads of copper-metallized integrated circuits

Taped semiconductor device and method of manufacture

Semiconductor device having capacitive insulation means and communication terminal using the device

Circuit device and method of manufacturing the same

Power module package structure

Semiconductor device

Encapsulated power semiconductor assembly

Varied-thickness heat sink for integrated circuit (IC) package

Graded liquid crystal polymer package

Semiconductor BGA package having a segmented voltage plane

System for assembling electronic components of an electronic system

Stacked semiconductor package assembly having hollowed substrate

Image sensitive electronic device packages

Semiconductor device

Method for efficiently producing removable peripheral cards

Tab package connecting host device element

Lead frame, semiconductor device, method for producing semiconductor device, and injection mold

Methods of making integrated circuits

Semiconductor bond pad structures and methods of manufacturing thereof

Chip package and wire bonding process thereof

Panel and semiconductor device having a composite plate with semiconductor chips

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Integrated circuit with substantially perpendicular wire bonds

Semiconductor device

System and method for die attach using a backside heat spreader

Semiconductor package and leadframe therefor having angled corners

Semiconductor chip with coil element over passivation layer

Composite material, electrical circuit or electric module

Jig structure for manufacturing an image sensor

Semiconductor integrated circuit device

CHIP PACKAGE STRUCTURE

Methods and apparatuses for encapsulating microelectronic devices

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Wafer level pre-packaged flip chip systems

Multi-chip module and methods

Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same

Wafer level pre-packaged flip chip

Semiconductor device packages with substrates for redistributing semiconductor device electrodes

SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same

Low cost power semiconductor module without substrate

Semiconductor device

Stacked chip package with redistribution lines

LED package structure and method making of the same

System-in-a-package based flash memory card

Semiconductor package and stack arrangement thereof

Leadframeless package structure and method

Backside method for fabricating semiconductor components with conductive interconnects

Microelectronic imagers and methods of packaging microelectronic imagers

Light emitting device package and method for manufacturing the same

Adherence of a solid-state image-sensing device to a substrate

Method and device for producing a bondable area region on a carrier

NANO IC

Screen mask

Method of reducing process steps in metal line protective structure formation

Wafer level pre-packaged flip chip

Wafer-level electro-optical semiconductor manufacture fabrication method

Offset integrated circuit package-on-package stacking system

Integrated circuit package including miniature antenna

Magnetic assist manufacturing to reduce mold flash and assist with heat slug assembly

Wafer level pre-packaged flip chip system

Flip chip package having protective cap and method of fabricating the same

Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection

Semiconductor module provided with contacts extending through the package

Lid used in package structure and the package structure having the same

Multi stack packaging chip and method of manufacturing the same

Lead frame and resin-encapsulated semiconductor device

Lead-free semiconductor device

Semiconductor device with sealed semiconductor chip

Method for encapsulating a semiconductor device and semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor component in a housing with mechanically inforcing flat conductor webs

Wire loop, semiconductor device having same and wire bonding method

Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame

Au alloy bonding wire

Bond pad structure comprising multiple bond pads with metal overlap

Multiple chip package module including die stacked over encapsulated package

Semiconductor device with passivation layer covering wiring layer

Semiconductor device and fabrication method thereof

Package for receiving electronic parts, and electronic device and mounting structure thereof

Semiconductor device with substrate having penetrating hole having a protrusion

Wirebonded device packages for semiconductor devices having elongated electrodes

Large die package and method for the fabrication thereof

SEMICONDUCTOR PACKAGE HAVING ULTRA-THIN THICKNESS AND METHOD OF MANUFACTURING THE SAME

Bondwire utilized for coulomb counting and safety circuits

Spot heat wirebonding

Methods of forming wire bonds for semiconductor constructions

Multi-chip module and method of manufacture

Multiple etch-stop layer deposition scheme and materials

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions

Semiconductor device

Three dimensional packaging optimized for high frequency circuitry

Semiconductor power module package

Methods for providing bias to a monolithic microwave integrated circuit

Power switching control device for electric systems

Wire bonded semiconductor device having low inductance and noise

Memory packages having stair step interconnection layers

Electronic component and electronic configuration

Microelectronic component and assembly having leads with offset portions

Method of manufacturing a semiconductor apparatus

Multi-chip semiconductor package

Semiconductor device with a rewiring level and method for producing the same

Circuit board with built-in electronic component and method for manufacturing the same

Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam

Semiconductor device assemblies with compliant spring contact structures

Fabrication of compliant spring contact structures and use thereof

Semiconductor device and method of manufacturing the same

Method of manufacturing a semiconductor device

Semiconductor device with terminals, and method of manufacturing the same

Method of making a multi-chip electronic package having laminate carrier

Circuit device

Semiconductor die edge reconditioning

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Standoffs for centralizing internals in packaging process

Semiconductor device and electronic device

Semiconductor device with electrically isolated ground structures

Device packages having a III-nitride based power semiconductor device

Lead frame for semiconductor package and method of manufacturing the same

Shielding arrangement to protect a circuit from stray magnetic fields

Semiconductor device having surface mountable external contact areas and method for producing the same

Substrate for mounting electronic part and electronic part

Multilayer printed wiring board

Leadframe with encapsulant guide and method for the fabrication thereof

Method of forming a substrateless semiconductor package

Electronic device

Semiconductor device with self-aligning contactless interface

Production method of a multilayer ceramic substrate

Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

Coolant cooled type semiconductor device

Semiconductor device and manufacturing method thereof

Non-cavity semiconductor packages

Bonding pad for a packaged integrated circuit

BGA semiconductor chip package and mounting structure thereof

Semiconductor package accomplishing fan-out structure through wire bonding

Thermally enhanced semiconductor package and fabrication method thereof

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Pillar grid array package

High density direct connect LOC assembly

Multilevel semiconductor module and method for fabricating the same

Thin multiple semiconductor die package

Semiconductor device having resin-sealed area on circuit board thereof

ELECTRICAL PACKAGE STRUCTURE INCLUDING CHIP WITH POLYMER THEREON

Lead frame for semiconductor package

Semiconductor device and chip-stack semiconductor device

Semiconductor chip mounting body and manufacturing method thereof

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein

Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density

Method for fabricating semiconductor components with through wire interconnects

Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating

Semiconductor package substrate having contact pad protective layer formed thereon

Ball grid array package stack

Chip package

Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package

Reinforced bond pad for a semiconductor device

Structure and assembly method of integrated circuit package

Semiconductor device

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same

Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement

Strobe light control circuit and IGBT device

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

Leadless semiconductor package and manufacturing method thereof

Method of manufacturing enhanced thermal dissipation integrated circuit package

Method of manufacturing flexible circuit substrate

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING CONTACT PAD PROTECTIVE LAYER FORMED THEREON AND METHOD FOR FABRICATING THE SAME

Ball grid array package and process for manufacturing same

Molding method for foldover package

Semiconductor device and manufacturing method thereof

Semiconductor device and an image sensing device

Semiconductor device to be applied to various types of semiconductor package

Stacked die package

Chip package with dam bar restricting flow of underfill

Multi-chip package and method for manufacturing the same

Method of mounting an integrated circuit package in an encapsulant cavity

ELECTRONIC DEVICE PACKAGE

Packaged semiconductor device and method of manufacture using shaped die

Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip

High density integrated circuit having multiple chips and employing a ball grid array (BGA) and method for making same

Semiconductor device and a manufacturing method of the same

Circuit device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides

Stacked-type semiconductor device and method of manufacturing the same

Vertically integrated system-in-a-package

Memory card with connecting portions for connection to an adapter

Memory card with connecting portions for connection to an adapter

IC card and method of manufacturing the same

Semiconductor device and method of manufacturing the same, metal component and method of manufacturing the same

Lead frame for a magnetic sensor

Electronic package with a stepped-pitch leadframe

Lead frame and semiconductor device

Semiconductor module and method of manufacturing the same

Package structure having mixed circuit and composite substrate

Semiconductor device and method of manufacturing the same

Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same

Bonding wire cleaning unit and method of wire bonding using same

Laser bonding tool with improved bonding accuracy

CURRENT SENSOR

Circuit device

Device for controlling a vehicle

Package structure and fabrication thereof

Method of manufacturing a semiconductor device

Universal interconnect die

Stacked die-in-die BGA package with die having a recess

Method of manufacturing semiconductor device

Microelectronics devices, having vias, and packaged microelectronic devices having vias

Vertically stacked semiconductor device

Schottky diode device with aluminum pickup of backside cathode

Integrated circuit for communications modules

Integrated circuit carrier

Semiconductor structure with RF element

Secure system for tracking elements using tags

Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

Semiconductor device having a functional surface

Semiconductor packaging mold and method of manufacturing semiconductor package using the same

Semiconductor device including an arrangement for detection of tampering

LED package structure and method for making the same

Device and applications for passive RF components in leadframes

System for tracking elements using tags

Method for producing a wire connection

Signal transmission arrangement and method

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Flip-chip adaptor package for bare die

Semiconductor device

Electronic assembly with integral thermal transient suppression

Microelectronic component assemblies with recessed wire bonds and methods of making same

Three-dimensional package

Double density method for wirebond interconnect

Semiconductor device and manufacturing method for the same

Semiconductor device package

Miniature optical element for wireless bonding in an electronic instrument

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Contact securing element for bonding a contact wire and for establishing an electrical connection

Method, device and system for bonding a semiconductor element

Semiconductor device and a method for manufacturing the same

Preparation of semiconductor device

Stray field shielding structure for semiconductors

Method for manufacturing a semiconductor package with a laminated chip cavity

Solder masks used in encapsulation, assemblies including the solar mask, and methods

Circuit device

Electronic package with integrated capacitor

Current regulator having a transistor and a measuring resistor

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Printed wiring board and method for manufacturing the same

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Chip package and fabricating method thereof

Semiconductor device, semiconductor body and method of manufacturing thereof

Heat spreader and package structure utilizing the same

Semiconductor power module

Impedance matching external component connections with uncompensated leads

Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads

Semiconductor component having stiffener, circuit decal and terminal contacts

Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices have conductive complementary structures

High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package

Semiconductor device

Integrated circuit card and a method for manufacturing the same

Low profile small outline leadless semiconductor device package

Electrical device allowing for increased device densities

Stacked microfeature devices

Method of manufacture of ceramic composite wiring structures for semiconductor devices

LOCAL MULTILAYERED METALLIZATION

Microelectronic devices and methods for forming interconnects in microelectronic devices

Semiconductor integrated circuit and semiconductor device

Ultra thin dual chip image sensor package structure and method for fabrication

Carrier for substrate film

Semiconductor device and a manufacturing method of the same

Nano memory, light, energy, antenna and strand-based systems and methods

Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device

Semiconductor device having a plastic housing and external connections and method for producing the same

HEAT SINK AND PACKAGE STRUCTURE

HIP PACKAGE STRUCTURE

Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded

Stack semiconductor package formed by multiple molding and method of manufacturing the same

Chip-packaging with bonding options having a plurality of package substrates

Integrated circuit package system with die and package combination

Die structure of package and method of manufacturing the same

Semiconductor package with passive device integration

Integrated circuit package with lead fingers extending into a slot of a die paddle

Semiconductor light emitting device

Methods for assembling semiconductor devices and interposers

Carrier for substrate film

MULTI-CHIP BALL GRID ARRAY PACKAGE

Package for high frequency usages and its manufacturing method

Integrated circuit with staggered differential wire bond pairs

Integrated connection arrangements

Ultra thin dual chip image sensor package structure and method for fabrication

Chip stack employing a flex circuit

Integrated circuit and wireless IC tag

Encapsulation method for semiconductor device having center pad

Semiconductor package having double layer leadframe

Semiconductor device, electrode member and electrode member fabrication method

Semiconductor device package, method of manufacturing the same, and semiconductor device

Method of making reinforced semiconductor package