207827 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#2702Semiconductor package and method for manufacturing the same and semiconductor package module having the same
#2703Multiple die stacking for two or more die
#2704Microelectronic package with stacked microelectronic units and method for manufacture thereof
#2705Hermetic Surface Mount Packages for Diodes and Transistors
#2706Package-on-package assembly with wire bond vias
#2707Interfaces and die packages, and appartuses including the same
#2708SEMICONDUCTOR DEVICE
#2709Package-on-package assembly with wire bond vias
#2710Package-on-package assembly with wire bond vias
#2711Dual interlock heatsink assembly for enhanced cavity PBGA packages, and method of manufacture
#2712MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
#2713Low impedance gate control method and apparatus
#2714Semiconductor packages and electronic systems including the same
#2715Method for producing a power semiconductor arrangement
#2716Semiconductor package
#2717Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
#2718Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
#2719Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
#2720Low-inductive semiconductor module
#2721Semiconductor package
#2722SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
#2723Semiconductor device
#2724FLASH MEMORY CARD WITHOUT A SUBSTRATE AND ITS FABRICATION METHOD
#2725Semiconductor device
#2726Power module package
#2727Multi-die semiconductor package
#2728Method of manufacturing an electronic device package
#2729Method for manufacturing a chip packaging structure
#2730Snubber circuit and method of using bipolar junction transistor in snubber circuit
#2731Snubber circuit and method of using bipolar junction transistor in snubber circuit
#2732Semiconductor apparatus
#2733TRANSISTOR STRUCTURE AND RELATED TRANSISTOR PACKAGING METHOD THEREOF
#2734Multi-chip packages providing reduced signal skew and related methods of operation
#2735Chip packaging structure and manufacturing method for the same
#2736Semiconductor device and manufacturing method of the same
#2737Semiconductor chip
#2738Method for manufacturing a package-on-package type semiconductor device
#2739Semiconductor devices and methods of assembling same
#2740Electronic circuit device
#2741Semiconductor chip comprising a directional coupler having a specific main line and sub-line arrangement
#2742Method for making a sensor device using a graphene layer
#2743SYSTEM AND METHOD FOR PROVIDING IMPROVED IMPEDANCE MATCHING TO RF POWER TRANSISTOR USING SHUNT INDUCTANCE
#2744Die having wire bond alignment sensing structures
#2745Semiconductor chip with bonding wire and method for making the same
#2746Power device and method of packaging same
#2747QFN DEVICE AND LEAD FRAME THEREFOR
#2748Small-Outline Package for a Power Transistor
#2749Light-reflective anisotropic conductive adhesive agent, and light emitting device
#2750Method for manufacturing electronic apparatus
#2751Manufacturing method thereof and a semiconductor device
#2752Back-to-back stacked dies
#2753SYSTEM WITH A DEFECT TOLERANT CONFIGURABLE IC
#2754UNIVERSAL PRINTED CIRCUIT BOARD AND MEMORY CARD INCLUDING THE SAME
#2755Multiple die in a face down package
#2756MANUFACTURING METHOD THEREOF AND A SEMICONDUCTOR DEVICE
#2757Semiconductor device
#2758Shielded gate trench MOSFET package
#2759Manufacturing method using multi-step adhesive curing for sealed semiconductor device
#2760Semiconductor package structure with common gold plated metal conductor on die and substrate
#2761Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
#2762Semiconductor device reducing risks of a wire short-circuit and a wire flow
#2763Semiconductor package and system
#2764Light emitting device and method for manufacturing light emitting device
#2765Method for assembling at least one chip using a fabric, and fabric including a chip device
#2766DISGUISING TEST PADS IN A SEMICONDUCTOR PACKAGE
#2767Semiconductor device
#2768Bonded wire semiconductor device
#2769Semiconductor arrangement
#2770Semiconductor packages and electronic systems including the same
#2771POWER DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
#2772Integrated circuit with electromagnetic intrachip communication and methods for use therewith
#2773Substrate for integrated modules
#2774Semiconductor device
#2775Semiconductor device
#2776Semiconductor device and method of manufacturing the same
#2777Method of manufacturing a semiconductor device
#2778Stacked die semiconductor package
#2779SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME
#2780METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK
#2781Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
#2782RF transistor packages with high frequency stabilization features and methods of forming RF transistor packages with high frequency stabilization features
#2783Bond pad configurations for semiconductor dies
#2784SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SAME
#2785Apparatus and methods for quad flat no lead packaging
#2786Power device having a specific range of distances between collector and emitter electrodes
#2787Power module and method for manufacturing the same
#2788Semiconductor device packages with solder joint enhancement element and related methods
#2789Chip-stacked semiconductor package
#2790SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#2791SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS
#2792SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
#2793Method of fabricating semiconductor package having substrate with solder ball connections
#2794Method of manufacturing semiconductor device
#2795Power semiconductor module
#2796Semiconductor device and manufacturing method thereof
#2797System on a chip with interleaved sets of pads
#2798High breakdown voltage integrated circuit isolation structure
#2799Semiconductor device, method of manufacturing the semiconductor device, and electronic device
#2800Optical communications device having electrical bond pads that are protected by a protective coating, and a method for applying the protective coating
#2801Externally Wire Bondable Chip Scale Package in a System-in-Package Module
#2802Semiconductor package having electrode on side surface, and semiconductor device
#2803DC/DC CONVERTOR POWER MODULE PACKAGE INCORPORATING A STACKED CONTROLLER AND CONSTRUCTION METHODOLOGY
#2804Integrated circuit packaging system with a lead and method of manufacture thereof
#2805Methods and arrangements relating to semiconductor packages including multi-memory dies
#2806Semiconductor device and manufacturing method
#2807Semiconductor device with heat spreader
#2808Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#2809Antenna device and wireless apparatus
#2810Electrical connection for multichip modules
#2811Semiconductor package
#2812Semiconductor device with heat spreader
#2813Semiconductor device with heat spreader
#2814Semiconductor storage device and manufacturing method thereof
#2815Electronic device and manufacturing thereof
#2816HEATER BLOCK FOR WIRE BONDING SYSTEM
#2817Chip with sintered connections to package
#2818Impedence controlled packages with metal sheet or 2-layer RDL
#2819Chip package structure and method of making the same
#2820METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#2821Delta modulated low power EHF communication link
#2822Semiconductor device
#2823PRINTED CIRCUIT BOARD (PCB) INCLUDING A WIRE PATTERN, SEMICONDUCTOR PACKAGE INCLUDING THE PCB, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE PCB, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE
#2824Stacked electronic component and manufacturing method thereof
#2825CHIP PACKAGE
#2826Semiconductor device including Schottky barrier diode
#2827Light emitting device package and lighting system
#2828Method of manufacturing semiconductor device
#2829High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
#2830Amplifier component comprising a compensation element
#2831Integrated circuit apparatus, systems, and methods
#2832SEMICONDUCTOR DEVICE
#2833Thermally enhanced semiconductor package with exposed parallel conductive clip
#2834Circuit board having bypass pad
#2835Method for making solder-top enhanced semiconductor device of low parasitic packaging impedance
#2836METHOD FOR PROCESSING CIRCUIT IN PACKAGE
#2837Apparatus and methods for electronic amplification
#2838Semiconductor device and a manufacturing method thereof
#2839Semiconductor device and method for manufacturing the same
#2840UTILIZING A JUMPER CHIP IN PACKAGES WITH LONG BONDING WIRES
#28413D interconnection structure and method of manufacturing the same
#2842Manufacturing electronic device having contact elements with a specified cross section
#2843Power semiconductor module
#2844Solar cell assembly II
#2845Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof
#2846Semiconductor device and method of manufacturing same
#2847INTEGRATED PASSIVE COMPONENT
#2848Vertical power transistor die packages and associated methods of manufacturing
#2849Module comprising a semiconductor chip
#2850Method for Assemblying a Semiconductor Chip Package with Deflection-Resistant Leadfingers
#2851Semiconductor device, semiconductor device design method, semiconductor design apparatus, and program
#2852SEMICONDUCTOR DEVICE
#2853SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2854Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion
#2855Integrated circuit chip package and manufacturing method thereof
#2856Semiconductor device and method of forming shielding layer over active surface of semiconductor die
#2857Semiconductor device and manufacturing method of the same
#2858Package with multiple dies
#2859SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME
#2860Power amplifier
#2861Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#2862Multi-chip module with stacked face-down connected dies
#2863Semiconductor device and method of manufacturing the same
#2864Stacked chip-on-board module with edge connector
#2865Semiconductor device
#2866Semiconductor device and manufacturing method thereof
#2867Integrated circuit with electromagnetic communication
#2868SEMICONDUCTOR DEVICE
#2869Multi-chip package and method of providing die-to-die interconnects in same
#2870Semiconductor device
#2871Semiconductor device
#2872Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
#2873Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
#2874Semiconductor device and radio communication device
#2875Compact low-flare solid-state imaging apparatus and electronic system comprising a compact low-flare solid-state imaging apparatus
#2876Integrated Circuit Package Security Fence
#2877Microstructure device comprising a face to face electromagnetic near field coupling between stacked device portions and method of forming the device
#2878Semiconductor device
#2879MONOLITHIC INTEGRATED CAPACITORS FOR HIGH-EFFICIENCY POWER CONVERTERS
#2880Integrated circuit package including miniature antenna
#2881Method for manufacturing semiconductor devices having a glass substrate
#2882Package structure for DC-DC converter
#2883Lead frame and semiconductor device
#2884Flip chip semiconductor device
#2885Integrated circuit packaging system with step mold and method of manufacture thereof
#2886Integrated circuit packaging system with filled vias and method of manufacture thereof
#2887Integrated circuit packaging system with interconnects and method of manufacture thereof
#2888Integrated circuit packaging system with interconnects and method of manufacture thereof
#2889Integrated circuit packaging system with lead frame etching and method of manufacture thereof
#2890Integrated circuit packaging system with pads and method of manufacture thereof
#2891SEMICONDUCTOR DEVICE
#2892INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEVELING STANDOFF AND METHOD OF MANUFACTURE THEREOF
#2893Wiring board comprising wirings arranged with crest and trough
#2894Manufacturing method of semiconductor device
#2895Electronic device for switching currents and method for producing the same
#2896Semiconductor device
#2897Manufacturing method of semiconductor device, and semiconductor device
#2898Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof
#2899Package and high frequency terminal structure for the same
#2900Low cost high frequency device package and methods
#2901Method of manufacturing power semiconductor device
#2902Mixed wire bonding profile and pad-layout configurations in IC packaging processes for high-speed electronic devices
#2903Stacked semiconductor component having through wire interconnect (TWI) with compressed wire
#2904Carrier-free semiconductor package
#2905SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES
#2906STACKED DIE POWER CONVERTER
#2907Apparatus and methods for reducing impact of high RF loss plating
#2908IGBT power semiconductor package having a conductive clip
#2909III-nitride transistor stacked with diode in a package
#2910III-nitride transistor stacked with FET in a package
#2911Wire bond pad system and method
#2912Semiconductor device having a bus configuration which reduces electromigration
#2913SEMICONDUCTOR CIRCUIT AND SWITCHING POWER SUPPLY APPARATUS
#2914Semiconductor apparatus, method for manufacturing the same and electric device
#2915Semiconductor package including multiple chips and separate groups of leads
#2916Stacked multi-die electronic device with interposed electrically conductive strap
#2917Semiconductor device and method of forming bond wires between semiconductor die contact pads and conductive TOV in peripheral area around semiconductor die
#2918Semiconductor device and semiconductor device mounting structure
#2919Determining intra-die wirebond pad placement locations in integrated circuit
#2920Wiring pattern having a stub wire
#2921Semiconductor device, method for manufacturing the same, and power supply unit
#2922LIGHT EMITTING DEVICE PACKAGE
#2923SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ELECTRONIC CIRCUIT
#2924Manufacturing method of semiconductor device
#2925Semiconductor device and manufacturing method therefor
#2926Sensor arrangement and chip comprising additional fixing pins
#2927Device and associated semiconductor package for limiting drain-source voltage of transformer-coupled push pull power conversion circuit
#2928RFID integrated circuit with integrated antenna structure
#2929Semiconductor device
#2930High bandwidth passive switching current sensor
#2931CIRCUIT ARRANGEMENT AND MANUFACTURING METHOD THEREOF
#2932SEMICONDUCTOR PACKAGES HAVING LEAD FRAMES
#2933Integrated shunt resistor with external contact in a semiconductor package
#2934Semiconductor device and method for manufacturing the same
#2935Method for manufacturing semiconductor device including removing a resin burr
#2936Rule-based semiconductor die stacking and bonding within a multi-die package
#2937Capacitive coupler packaging structure
#2938Circuit substrate and method of manufacturing same
#2939Semiconductor device and method of manufacturing the semiconductor device
#2940METHOD FOR JOINING BONDING WIRE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#2941Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors
#2942Flow sensors having nanoscale coating for corrosion resistance
#2943Semiconductor device and wiring board
#2944Semiconductor package and method for fabricating the same
#2945Method of manufacturing semiconductor device
#2946Multi chip module, method for operating the same and DC/DC converter
#2947Semiconductor device and method of manufacture thereof
#2948Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area around the Device for Electrical Interconnection to Other Devices
#2949Stacked half-bridge package with a current carrying layer
#2950SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME
#2951POWER SEMICONDUCTOR DEVICE PACKAGING
#2952Semiconductor die package and method for making the same
#2953Stacked half-bridge package with a common conductive clip
#2954Manufacturing method of semiconductor device
#2955Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires
#2956SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#2957Semiconductor device having separated heatsink and chip mounting portion
#2958Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device
#2959Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus
#2960Semiconductor package with semiconductor core structure and method of forming same
#2961Stacked-chip device
#2962Semiconductor device and a method of manufacturing the same
#2963High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistor
#2964High power semiconductor package with conductive clips and flip chip driver IC
#2965High power semiconductor package with multiple conductive clips
#2966High power semiconductor package with conductive clip on multiple transistors
#2967High power semiconductor package with conductive clip
#2968Leadless semiconductor package with routable leads, and method of manufacture
#2969LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
#2970Semiconductor package and method of fabricating the same
#2971Semiconductor packages
#2972Ultrasonic wire bonding method for a semiconductor device
#2973Method of making a copper wire bond package
#2974Dual-leadframe multi-chip package and method of manufacture
#2975Semiconductor power device having a super-junction structure
#2976Electronic component employing a layered frame
#2977Enhanced stacked microelectronic assemblies with central contacts
#2978Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#2979Power transistor output match network with high Q RF path and low Q low frequency path
#2980High-frequency power amplifier device
#2981Microelectronic package and method of manufacturing same
#2982Localized alloying for improved bond reliability
#2983Method of manufacturing non-leaded package structure
#2984SEMICONDUCTOR DEVICE
#2985Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#2986Light emitting diode (LED) devices, systems, and methods
#2987Optical module
#2988Semiconductor device for battery power voltage control
#2989Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
#2990Semiconductor device including a DC-DC converter with schottky barrier diode
#2991SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
#2992Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections
#2993SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES
#2994Integrated circuit packaging system with multiple row leads and method of manufacture thereof
#2995Semiconductor device and semiconductor package
#2996Integrated circuits secure from invasion and methods of manufacturing the same
#2997Semiconductor device including a DC-DC converter
#2998Multi-chip package and method of manufacturing thereof
#2999System and method for integrated waveguide packaging
#3000LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME