207827 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
No-exposed-pad quad flat no-lead (QFN) packaging structure and method for manufacturing the same
#2402High-frequency module
#2403Shielded gate trench MOSFET package
#2404Semiconductor module and method for manufacturing same
#2405Semiconductor package
#2406Semiconductor chip with modified regions for dividing the chip
#2407SEMICONDUCTOR DEVICE
#2408Method and apparatus for constructing an isolation capacitor in an integrated circuit
#2409Field effect transitor and semiconductor device using the same
#2410Semiconductor device, wireless device, and storage device
#2411High current, low switching loss SiC power module
#2412Multi-chip package and method of manufacturing the same
#2413Enhanced stacked microelectronic assemblies with central contacts
#2414Window ball grid array (BGA) semiconductor packages
#2415Dual-flag stacked die package
#2416Semiconductor device
#2417Current sensors and methods
#2418Medical apparatus and X-ray high voltage apparatus
#2419Semiconductor device
#2420Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance
#2421Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function
#2422Electric connection method
#2423Semiconductor package including multiple chips and separate groups of leads
#2424Solderless die attach to a direct bonded aluminum substrate
#2425Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#2426Semiconductor device, and manufacturing method for same
#2427Device including a semiconductor chip and wires
#2428Semiconductor device and manufacturing method of the same
#2429Semiconductor package including stacked chips and a redistribution layer (RDL) structure
#2430Semiconductor device, semiconductor device design method, semiconductor device design apparatus, and program
#2431Semiconductor device
#2432Manufacturing and evaluation method of a semiconductor device
#2433Methods and arrangements relating to semiconductor packages including multi-memory dies
#2434Method of forming a power module with a magnetic device having a conductive clip
#2435Power MOSFETs with improved efficiency for multi-channel class D audio amplifiers and packaging therefor
#2436Half-bridge package with a conductive clip
#2437Stackable microelectronic package structures
#2438Semiconductor device
#2439Die package structure
#2440Illumination device with inclined light emitting element disposed on a transparent substrate
#2441Method of manufacturing semiconductor device
#2442Stacked semiconductor package including connections electrically connecting first and second semiconductor packages
#2443Multi-chip package assembly with improved bond wire separation
#2444External storage device and method of manufacturing external storage device
#2445Stacked half-bridge package
#2446Stub minimization using duplicate sets of signal terminals
#2447Power semiconductor device
#2448Sensor system and cover device for a sensor system
#2449Semiconductor device
#2450Waterfall wire bonding
#2451Semiconductor device and microphone
#2452Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
#2453Semiconductor device and method of manufacturing the same
#2454Stack packages having token ring loops
#2455Semiconductor package with multiple conductive clips
#2456Apparatus and methods for reducing impact of high RF loss plating
#2457Devices and systems for power conversion circuits
#2458Power module
#2459Semiconductor integrated circuit device
#2460Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows
#2461Semiconductor die package and method for making the same
#2462Normally off power electronic component
#2463Semiconductor module
#2464Semiconductor device and method of manufacturing the same
#2465Power module semiconductor device
#2466Semiconductor device including alternating source and drain regions, and respective source and drain metallic strips
#2467Semiconductor device including gate drivers around a periphery thereof
#2468Semiconductor device including a redistribution layer and metallic pillars coupled thereto
#2469Semiconductor device
#2470High frequency device
#2471Semiconductor packages and electronic systems including the same
#2472Electronic devices with embedded die interconnect structures, and methods of manufacture thereof
#2473Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
#2474Packaged microelectronic components
#2475Semiconductor device
#2476Wire bonding apparatus and bonding method
#2477Amplifier circuit
#2478Semiconductor packages utilizing leadframe panels with grooves in connecting bars
#2479Method of manufacturing semiconductor device
#2480Semiconductor package having an over-temperature protection circuit utilizing multiple temperature threshold values
#2481Semiconductor package having unified semiconductor chips
#2482Semiconductor module
#2483Semiconductor device and method of manufacturing the same
#2484Semiconductor package having multi-phase power inverter with internal temperature sensor
#2485IGBT die structure with auxiliary P well terminal
#2486Microelectronic assembly with impedance controlled wirebond and reference wirebond
#2487Semiconductor device and manufacturing method thereof
#2488Semiconductor device and manufacturing method thereof
#2489Control and driver circuits on a power quad flat no-lead (PQFN) leadframe
#2490Power quad flat no-lead (PQFN) package having control and driver circuits
#2491Semiconductor package with bonding wires of reduced loop inductance
#2492Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)
#2493Dual-leadframe multi-chip package
#2494Microelectronic assembly with impedance controlled wirebond and conductive reference element
#2495Power RF amplifiers
#2496Illumination device capable of decreasing shadow of lighting effect
#2497Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#2498Open source power quad flat no-lead (PQFN) package
#2499Leadframe for semiconductor packages
#2500Semiconductor device with stacked semiconductor chips
#2501Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter
#2502Solid-state image pickup element and solid-state image pickup element mounting structure
#2503Power semiconductor housing with redundant functionality
#2504Device mounting board and semiconductor power module
#2505Semiconductor device
#2506Semiconductor device including semiconductor chip mounted on lead frame
#2507Semiconductor device
#2508Method and apparatus for multi-chip structure semiconductor package
#2509Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier
#2510Method of manufacturing semiconductor device
#2511Semiconductor device and lead frame used for the same
#2512Semiconductor device and method for manufacturing thereof
#2513Multi-chip packaging structure and method
#2514Semiconductor memory card
#2515Semiconductor devices with impedance matching-circuits
#2516Voltage regulator using N-type substrate
#2517Semiconductor device and manufacturing method of the same
#2518Power quad flat no-lead (PQFN) package
#2519Stacked die power converter
#2520Integrated circuit
#2521Multilayer packaged semiconductor device and method of packaging
#2522Semiconductor device and semiconductor package
#2523Semiconductor unit and semiconductor device using the same
#2524Semiconductor device
#2525Copper ball bond features and structure
#2526Method of manufacturing semiconductor device
#2527High temperature interconnect assemblies for high temperature electronics utilizing transition pads
#2528Integrated circuit packaging system with array contacts and method of manufacture thereof
#2529Semiconductor device for preventing a progression of a crack in a solder layer and method of manufacturing the same
#2530Semiconductor device stack with bonding layer and wire retaining member
#2531Embedded package security tamper mesh
#2532Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
#2533Explosion-protected semiconductor module
#2534High-frequency device including high-frequency switching circuit
#2535Semiconductor device and method of manufacturing the same
#2536Semiconductor device with embedded interconnect pad
#2537Electric device package comprising a laminate and method of making an electric device package comprising a laminate
#2538Semiconductor device and method for manufacturing semiconductor device
#2539Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die
#2540Monolithic bidirectional silicon carbide switching devices
#2541Microelectronic packages having cavities for receiving microelectronic elements
#2542Semiconductor device and method for manufacturing semiconductor device
#2543Packaged semiconductor die with power rail pads
#2544High speed signal conditioning package
#2545Chip card module
#2546Apparatus and method for harvesting energy in an electronic device
#2547Chip stack packages, system in packages including the same, and methods of operating the same
#2548Semiconductor device and method of manufacturing the same
#2549Light emitting device package
#2550Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices
#2551Differential return loss supporting high speed bus interfaces
#2552Semiconductor package and method for fabricating the same
#2553Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same
#2554Chip package and method of manufacturing the same
#2555Semiconductor packages having multiple lead frames and methods of formation thereof
#2556Power amplifier modules including related systems, devices, and methods
#2557Semiconductor device capable of switching operation modes and operation mode setting method therefor
#2558Semiconductor package structure having an air gap and method for forming
#2559Electronic device including silicon carbide diode dies
#2560Semiconductor device including a gate wiring connected to at least one semiconductor chip
#2561Electro-thermal cooling devices and methods of fabrication thereof
#2562Semiconductor device packaging having plurality of wires bonding to a leadframe
#2563Carrier-free land grid array IC chip package and preparation method thereof
#2564Semiconductor modules and methods of formation thereof
#2565Methods, circuits and systems for a package structure having wireless lateral connections
#2566Integrated circuit packaging system with tiebar-less design and method of manufacture thereof
#2567Manufacturing method of light-emitting device
#2568TEST VEHICLES FOR ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGES
#2569Package-on-package assembly with wire bond vias
#2570Solderless die attach to a direct bonded aluminum substrate
#2571Semiconductor device and a method of manufacturing the same
#2572Method of manufacturing electronic device and electronic device
#2573Semiconductor module and method for manufacturing the same
#2574Semiconductor device and manufacturing method thereof
#2575Semiconductor package having reliable electrical connection and assembling method
#2576PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF
#2577Circuit module such as a high-density lead frame array (HDA) power module, and method of making same
#2578Semiconductor device
#2579Substrate-less stackable package with wire-bond interconnect
#2580Capacitance structure
#2581Semiconductor power module and method of manufacturing the same
#2582Multi-chip package with offset die stacking and method of making same
#2583Integrated circuit apparatus, systems, and methods
#2584Semiconductor device packages with solder joint enhancement elements
#2585Semiconductor element housing package and semiconductor device equipped with the same
#2586Structure and Method for Inductors Integrated into Semiconductor Device Packages
#2587Method of manufacturing a semiconductor device including through silicon plugs
#2588Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact
#2589Lead structures with vertical offsets
#2590Inductor
#2591Thin film light emitting diode
#2592Method of manufacturing leadless integrated circuit packages having electrically routed contacts
#2593Circuit device
#2594Circuit device
#2595Circuit device
#2596Chip assembly and chip assembling method
#2597Vertically packaged integrated circuit
#2598Semiconductor Devices and Methods of Manufacturing and Using Thereof
#2599Semiconductor module with a semiconductor chip and a passive component and method for producing the same
#2600Semiconductor device
#2601Leadless array plastic package with various IC packaging configurations
#2602Offset interposers for large-bottom packages and large-die package-on-package structures
#2603SYSTEM AND METHODS FOR WIRE BONDING
#2604Power module
#2605Multi-chip light emitter packages and related methods
#2606Semiconductor device and method of manufacturing the semiconductor device
#2607Electronic devices with multiple amplifier stages and methods of their manufacture
#2608Stacked semiconductor device and method of manufacturing the same
#2609Integrated circuit package and method of forming the same
#2610Providing voltage isolation on a single semiconductor die
#2611Electronic apparatus, a method for deciding a failure, and a method for estimating a fatigue life
#2612Monolithic Power Converter Package with Through Substrate vias
#2613Semiconductor device and a manufacturing method thereof
#2614Dual power converter package using external driver IC
#2615PCB based RF-power package window frame
#2616Semiconductor packages and methods of formation thereof
#2617Multichip power semiconductor device
#2618Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same
#2619Stacked packaged integrated circuit devices, and methods of making same
#2620Semiconductor device
#2621Multi-chip light emitter packages and related methods
#2622Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#2623Semiconductor integrated circuit device
#2624Microelectronic package
#2625Manufacturing method of semiconductor device, semiconductor device, and semiconductor crystal growth substrate
#2626High performance power module
#2627Chip assembly and chip assembling method
#2628Integrated circuit chip using top post-passivation technology and bottom structure technology
#2629Joint structure for substrates and methods of forming
#2630Packaged integrated device die between an external and internal housing
#2631Power module
#2632Protection layers for conductive pads and methods of formation thereof
#2633Copper interconnects having a titanium-platinum-titanium assembly between copper and compound semiconductor
#2634Semiconductor device and method for manufacturing semiconductor device
#2635Semiconductor device and method of manufacturing the same
#2636Power semiconductor module with method for manufacturing a sintered power semiconductor module
#2637High voltage semiconductor devices including electric arc suppression material and methods of forming the same
#2638Method for package-on-package assembly with wire bonds to encapsulation surface
#2639Devices and methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structure
#2640Power system, power module therein and method for fabricating power module
#2641Semiconductor device with die stack arrangement including staggered die and efficient wire bonding
#2642Interconnect crack arrestor structure and methods
#2643Power module and output circuit
#2644Package-on-package assembly with wire bond vias
#2645Semiconductor package structure
#2646Package manufacturing method and semiconductor device
#2647PCB HAVING INDIVIDUAL REFLECTIVE STRUCTURE AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE USING THE SAME
#2648Memory device comprising programmable command-and-address and/or data interfaces
#2649SEMICONDUCTOR DEVICE INCLUDING VOLTAGE CONVERTER CIRCUIT, AND METHOD OF MAKING THE SEMICONDUCTOR DEVICE
#2650Packaged integrated circuit using wire bonds
#2651Method of manufacturing semiconductor device and semiconductor device
#2652Processes and structures for IC fabrication
#2653Semiconductor substrate and semiconductor chip
#2654Semiconductor device
#2655Electromagnetic resonance coupler
#2656Semiconductor storage device
#2657Molding method for COB-EUSB devices and metal housing package
#2658Package leadframe for dual side assembly
#2659Power semiconductor module and method of manufacturing the same
#2660Integrated circuit package and method of assembling an integrated circuit package
#2661Stackable microelectronic package structures
#2662Chip package structure
#2663Integrated Circuit Device With Wire Bond Connections
#2664Semiconductor device and method for manufacturing the same
#2665Method of fabricating a packaged semiconductor
#2666Gate driver with digital ground
#2667Chip-on-lead package and method of forming
#2668Semiconductor package with a bridge interposer
#2669Integrated circuit packages having redistribution structures
#2670Semiconductor package including stacked semiconductor chips and a redistribution layer
#2671SEMICONDUCTOR DEVICE
#2672Integrated circuit packaging system with terminals and method of manufacture thereof
#2673Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect
#2674Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe
#2675Encapsulated control module for a motor vehicle
#2676Semiconductor device having a chip mounting portion on which a separated plated layer is disposed
#2677Multi-chip package with a supporting member and method of manufacturing the same
#2678Semiconductor package
#2679Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
#2680Semiconductor package structure and manufacturing method thereof
#2681Power semiconductor package with conductive clip
#2682Alloyed 2N copper wires for bonding in microelectronics devices
#2683Structure for high-speed signal integrity in semiconductor package with single-metal-layer substrate
#2684Device having multiple wire bonds for a bond area and methods thereof
#2685Packaged die for heat dissipation and method therefor
#2686Semiconductor device including cladded base plate
#2687Integrated circuit having staggered bond pads and I/O cells
#2688Semiconductor device and manufacturing method thereof
#2689Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#2690SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#2691Thermal pad shorts test for wire bonded strip testing
#2692METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
#2693SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#2694Sensor device manufacturing method and sensor device
#2695Semiconductor module and method for manufacturing semiconductor module
#2696METHOD AND JIG FOR MANUFACTURING SEMICONDUCTOR DEVICE
#2697Low forward voltage rectifier
#2698High frequency circuit device
#2699Low stray inductance power module
#2700Compact wirebonded power quad flat no-lead (PQFN) package