207827 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
Semiconductor device for smoothing the voltage of the end face of a drain of a high frequency semiconductor chip
#3002Radiofrequency amplifier
#3003Semiconductor chip and semiconductor device
#3004Detector array with a through-via interposer
#3005MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME
#3006Integrated circuit package system with stacked die
#3007Clip interconnect with encapsulation material locking feature
#3008Compensation network for RF transistor
#3009Semiconductor device and electronic device
#3010Stacked packaged integrated circuit devices
#3011Multi-chip module
#3012MODULE HOUSING AND METHOD FOR MANUFACTURING A MODULE HOUSING
#3013Semiconductor device
#3014Integrated circuit device having die bonded to the polymer side of a polymer substrate
#3015Using bump bonding to distribute current flow on a semiconductor power device
#3016Electronic devices
#3017Method for semiconductor leadframes in low volume and rapid turnaround
#3018PACKAGE STRUCTURE
#3019Method for semiconductor leadframes in low volume and rapid turnaround
#3020ULTRA THIN DIE TO IMPROVE SERIES RESISTANCE OF A FET
#3021Package and high frequency terminal structure for the same
#3022METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS
#3023SEMICONDUCTOR DEVICE
#3024Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#3025Semiconductor package with bonding wires of reduced loop inductance
#3026ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#3027Power semiconductor module
#3028Nitride semiconductor element and nitride semiconductor package
#3029Chip-scale semiconductor die packaging method
#3030Multi-chip stacking method to reduce voids between stacked chips
#3031Quad flat package with exposed paddle
#3032Systems and methods for ESD protection for RF couplers in semiconductor packages
#3033DIFFERENTIAL SIGNAL TRANSMISSION LINE, IC PACKAGE, AND METHOD FOR TESTING SAID DIFFERENTIAL SIGNAL TRANSMISSION LINE AND IC PACKAGE
#3034Semiconductor packages and methods for producing the same
#3035SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS
#3036Resin-sealed semiconductor device and method for fabricating the same
#3037Dual lead frame semiconductor package and method of manufacture
#3038SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#3039Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
#3040Method for Producing an Electrical Circuit and Electrical Circuit
#3041Base plate
#3042ANTENNA
#3043Reversible top/bottom MEMS package
#3044Chip design having integrated fuse and method for the production thereof
#3045Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product
#3046Integrated circuit packaging system with lead frame and method of manufacture thereof
#3047Semiconductor device having die pads isolated from interconnect portion and method of assembling same
#3048Package structure with micro-electromechanical element and manufacturing method thereof
#3049LIGHT EMITTING DIODE PACKAGE STRUCTURE
#3050Chip Package
#3051Methods and apparatus for a stacked-die interposer
#3052Device with semiconductor die attached to a leadframe
#3053HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS
#3054Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
#3055Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package
#3056Semiconductor device
#3057Leadframe package structure and manufacturing method thereof
#3058Mixed wire semiconductor lead frame package
#3059Submount and manufacturing method thereof
#3060PACKAGE SUBSTRATE
#3061SEMICONDUCTOR DEVICE
#3062Method of manufacturing semiconductor device
#3063Semiconductor device packages stacked together having a redistribution layer
#3064POWER MODULE AND METHOD FOR MANUFACTURING THE SAME
#3065Delamination resistant device package having raised bond surface and mold locking aperture
#3066Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereof
#3067Brace for wire bond
#3068Manufacturing method of semiconductor device
#3069MULTI-CHIP PACKAGE
#3070Semiconductor power module and method of manufacturing the same
#3071Circuit device having an improved heat dissipitation, and the method of manufacturing the same
#3072Lead frame, semiconductor device, and method of manufacturing semiconductor device
#3073Multi-chip semiconductor packages and assembly thereof
#3074Semiconductor device and manufacturing method therefor
#3075Semiconductor device and a method of manufacturing the same
#3076Semiconductor chip package
#3077Semiconductor device
#3078Communication device
#3079Semiconductor Package for Higher Power Transistors
#3080Semiconductor module including a switch and non-central diode
#3081Module with silicon-based layer
#3082Method for mounting luminescent device
#3083Integrated circuit with intra-chip clock interface and methods for use therewith
#3084Chip to dielectric waveguide interface for sub-millimeter wave communications link
#3085High frequency amplifier
#3086Flexible distributed LED-based light source and method for making the same
#3087Metal can impedance control structure
#3088Stacked multi-die packages with impedance control
#3089Ball grid array semiconductor package and method of manufacturing the same
#3090Impedance controlled packages with metal sheet or 2-layer RDL
#3091Semiconductor device package and method of making a semiconductor device package
#3092Semiconductor device with parasitic bipolar transistor
#3093Integrated power converter package with die stacking
#3094TSOP with impedance control
#3095Transition from a chip to a waveguide port
#3096SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR
#3097Electronic device comprising a chip disposed on a pin
#3098Method of making a high frequency device package
#3099Connector assembly and method of manufacture
#3100Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding
#3101SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE DIES AND A COMMON NODE STRUCTURE
#3102MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
#3103Complex semiconductor device for use in mobile equipment
#3104Semiconductor component and method of manufacture
#3105Power amplifier circuit
#3106Semiconductor device and method of manufacturing the same
#3107Semiconductor device
#3108Semiconductor module and method for production thereof
#3109Semiconductor device having a pin mounted heat sink
#3110Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect
#3111Package structure for DC-DC converter
#3112Semiconductor packages having increased input/output capacity and related methods
#3113Control device of semiconductor device
#3114LED light source unit for backlight of liquid crystal display, and liquid crystal display
#3115Multi-chip package with offset die stacking
#3116Semiconductor device with pads of enhanced moisture blocking ability
#3117Lead frame for semiconductor device
#3118Semiconductor device and method of blowing fuse thereof
#3119Semiconductor device integrated with converter and package structure thereof
#3120MULTI-CHIP PACKAGES
#3121Leadless array plastic package with various IC packaging configurations
#3122Method of manufacturing semiconductor device
#3123SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#3124Semiconductor storage device and a method of manufacturing the semiconductor storage device
#3125Semiconductor package
#3126Package structure
#3127Semiconductor device and method for manufacturing thereof
#3128Semiconductor device
#3129Singulation method for semiconductor package with plating on side of connectors
#3130Semiconductor device
#3131Semiconductor device and method of manufacturing the same, and power supply apparatus
#3132Method of manufacturing leadless integrated circuit packages having electrically routed contacts
#3133Semiconductor memory device and semiconductor memory card
#3134Semiconductor device production method and semiconductor device
#3135Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module
#3136Leadframe, leadframe type package and lead lane
#3137Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame
#3138Wireless communication device and semiconductor package device having a power amplifier therefor
#3139Stitch bump stacking design for overall package size reduction for multiple stack
#3140Impedance controlled electrical interconnection employing meta-materials
#3141SEMICONDUCTOR DEVICE
#3142Integrated inductor
#3143Power semiconductor chip with a formed patterned thick metallization atop
#3144Monolithic microwave integrated circuit
#3145SEMICONDUCTOR DEVICE WITH LESS POWER SUPPLY NOISE
#3146Method for forming a patterned thick metallization atop a power semiconductor chip
#3147SEMICONDUCTOR DEVICE
#3148WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BONDING OF WIRE BONDS
#3149Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board
#3150Systems and Methods for Heat Dissipation Using Thermal Conduits
#3151Stacked assembly including plurality of stacked microelectronic elements
#3152Semiconductor integrated circuit device
#3153Self-aligning structures and method for integrated chips
#3154Integrated circuit packaging system with die paddle and method of manufacture thereof
#3155SEMICONDUCTOR DEVICE
#3156Semiconductor device, electronic apparatus, and method of manufacturing semiconductor device
#3157Package and fabrication method of the same
#3158Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds
#3159Electronic component mounting device and method for producing the same
#3160Circuit Device
#3161Solder joint inspection
#3162Integrated circuit package with voltage distributor
#3163Semiconductor device with die stack arrangement including staggered die and efficient wire bonding
#3164Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces
#3165SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3166Semiconductor element with semiconductor die and lead frames
#3167Power semiconductor device
#3168Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same
#3169METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAME
#3170Method of manufacturing circuit device
#3171Device and manufacturing method of the same
#3172Doherty amplifier and semiconductor device
#3173Circuit device and method of manufacturing the same
#3174Semiconductor device
#3175SEMICONDUCTOR PACKAGE
#3176Semiconductor device and method of manufacturing the same
#3177LED-BASED LIGHT EMITTING DEVICES
#3178Semiconductor device for driving electric motor
#3179Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame
#3180Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom
#3181Power module
#3182Power module
#3183Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#3184Semiconductor and a method of manufacturing the same
#3185Stacked semiconductor package and method of fabricating the same
#3186Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same
#3187Stackable molded microelectronic packages with area array unit connectors
#3188Semiconductor device and heat sink with 3-dimensional thermal conductivity
#3189Method for manufacturing semiconductor devices having a glass substrate
#3190THERMAL FLEX CONTACT CARRIERS #2
#3191Method of manufacturing semiconductor device
#3192Semiconductor device assembly and method thereof
#3193SEMICONDUCTOR DEVICE
#3194Multi-chip package including chip address circuit
#3195Resin-encapsulated semiconductor device
#3196High density chip stacked package, package-on-package and method of fabricating the same
#3197Semiconductor device
#3198Semiconductor device
#3199Multi-chip package module and a doped polysilicon trench for isolation and connection
#3200Semiconductor device for DC-DC converter including high side and low side semiconductor switches
#3201Semiconductor package having a stacked structure
#3202Internal packaging of a semiconductor device mounted on die pads
#3203Semiconductor package with an embedded printed circuit board and stacked die
#3204Semiconductor apparatus including resin case
#3205Semiconductor module and method of manufacturing the same
#3206Thermally and electrically enhanced ball grid array package
#3207Corrugated die edge for stacked die semiconductor package
#3208Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate
#3209Semiconductor device with the leads projected from sealing body
#3210Semiconductor device with lead terminals having portions thereof extending obliquely
#3211Semiconductor storage device and manufacturing method thereof
#3212Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe
#3213Semiconductor device with heat spreader
#3214Multilayer structures for magnetic shielding
#3215Boost converter with integrated high power discrete FET and low voltage controller
#3216Method of manufacturing semiconductor device, and bonding apparatus
#3217Stacked package and method of manufacturing the same
#3218Semiconductor device and snubber device having a SiC-MOSFET and a Zener diode
#3219Electrical microfilament to circuit interface
#3220Circuit arrangement with shunt resistor
#3221Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#3222Three-dimensional semiconductor integrated circuit
#3223Voltage Spike Protection for Power DMOS Devices
#3224Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof
#3225Semiconductor package having gap-filler injection-friendly structure
#3226Semiconductor device
#3227Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device
#3228Etched surface mount islands in a leadframe package
#3229Combined packaged power semiconductor device
#3230Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material
#3231PACKAGED LEDS WITH PHOSPHOR FILMS, AND ASSOCIATED SYSTEMS AND METHODS
#3232Semiconductor integrated circuit device and method of manufacturing the same
#3233Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer
#3234NO LEAD PACKAGE WITH HEAT SPREADER
#3235Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires
#3236Method of manufacturing semiconductor device
#3237Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein
#3238Surface mountable device
#3239High-frequency module including a conductor with a slot therein and a conductive wire crossing over the slot and physically contacting the conductor
#3240Stacked package
#3241Multi-chip package with pillar connection
#3242Integrated circuit apparatus, systems, and methods
#3243SEMICONDUCTOR DEVICE
#3244Pad configurations for an electronic package assembly
#3245Semiconductor device and production method thereof
#3246Semiconductor component and method of manufacture
#3247INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF
#3248Integrated circuit packaging system with magnetic film and method of manufacture thereof
#3249AC switch having compound semiconductor MOSFETs
#3250Semiconductor device and manufacturing method of the same
#3251Method for manufacturing a semiconductor component and structure therefor
#3252Liquid discharge head and manufacturing method therefor
#3253Reception circuit and signal reception method
#3254Inductive circuit arrangement
#3255Microelectronic packages having cavities for receiving microelectronic elements
#3256Semiconductor device with respective electrode pad rows and respective external electrodes electrically connected and arranged in the respective end portions of the substrate
#3257SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS
#3258LEAD FRAME, ELECTRONIC COMPONENT INCLUDING THE LEAD FRAME, AND MANUFACTURING METHOD THEREOF
#3259Integrated circuit packaging system with multiple row leads and method of manufacture thereof
#3260Semiconductor chip package including a lead frame
#3261Semiconductor device with substrate-side exposed device-side electrode and method of fabrication
#3262Semiconductor device and method of manufacturing the same
#3263Semiconductor module with electrical switching elements
#3264Semiconductor module device and driving apparatus having the same
#3265Electrical connections for multichip modules
#3266Microelectronic assembly with joined bond elements having lowered inductance
#3267Leadless integrated circuit packaging system and method of manufacture thereof
#3268Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
#3269Integrated circuit packaging system with isolated pads and method of manufacture thereof
#3270Semiconductor apparatus and power supply circuit
#3271Integrated circuit package system with laminate base
#3272Method for manufacturing a semiconductor component
#3273Stacked electronic component and manufacturing method thereof
#3274Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
#3275Stacked-die package for battery power management
#3276LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#3277Power Electronic Device Package
#3278Internal matching transistor
#3279Bonding wire profile for minimizing vibration fatigue failure
#3280Semiconductor Device with Circuit for Reduced Parasitic Inductance
#3281Thin film light emitting diode
#3282Method for interconnecting electrical device to a module
#3283Fuel gauge circuit and battery pack
#3284Semiconductor device
#3285Integrated circuit with supply line intra-chip clock interface and methods for use therewith
#3286Stacked semiconductor package and method for manufacturing the same
#3287Semiconductor device and power semiconductor device
#3288Interdigitated conductive support for GaN semiconductor die
#3289Dual capillary IC wirebonding
#3290SUBSTRATE FOR AN ELECTRICAL DEVICE
#3291Semiconductor device and a manufacturing method of the same
#3292Semiconductor device and manufacturing method thereof
#3293Wire bond interconnection and method of manufacture thereof
#3294Semiconductor device and method of manufacturing the same
#3295Semiconductor chip with post-passivation scheme formed over passivation layer
#3296Package structure enhancing molding compound bondability
#3297LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#3298SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF
#3299Semiconductor device
#3300Cutting blade for a wire bonding system