207827 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE CONTAINING STACKED SEMICONDUCTOR CHIPS
#3302Semiconductor device with stacked semiconductor chips
#3303Semiconductor on semiconductor substrate multi-chip-scale package
#3304Method of making a connection component with posts and pads
#3305Integrated circuits with multiple I/O regions
#3306Power block and power semiconductor module using same
#3307Semiconductor device and lead frame used for the same
#3308Lead frame package structure for side-by-side disposed chips
#3309Power semiconductor device packaging
#3310Semiconductor device packages with electromagnetic interference shielding
#3311Semiconductor package structure and package process
#3312Device for protecting an electronic integrated circuit housing against physical or chemical ingression
#3313Method of manufacturing a power transistor module and package with integrated bus bar
#3314Method for manufacturing integrated circuit package system with under paddle leadfingers
#3315Semiconductor memory device
#3316Semiconductor device having multiple semiconductor elements
#3317Stacked semiconductor package
#3318Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#3319Chip package structure and method of making the same
#3320Semiconductor device capable of switching operation modes
#3321Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#3322Power semiconductor module
#3323Method of manufacturing semiconductor device
#3324Semiconductor device
#3325Leadframe package for high-speed data rate applications
#3326OPTO-ELECTRONIC TRANSCEIVER MODULE SYSTEM
#3327ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE
#3328SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#3329Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof
#3330SEMICONDUCTOR DEVICE
#3331SEMICONDUCTOR LAMINATION PACKAGE AND METHOD OF PRODUCING SEMICONDUCTOR LAMINATION PACKAGE
#3332Stacked chip package with redistribution lines
#3333Heat dissipation by through silicon plugs
#3334Semiconductor package with through silicon vias
#3335LIGHT-EMITTING DIODE CHIP AND PACKAGE STRUCTURE THEREOF
#3336Semiconductor device and manufacturing method of the same
#3337Semiconductor device
#3338SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME
#3339Semiconductor device
#3340SEMICONDUCTOR DEVICE
#3341Semiconductor device
#3342Integrated circuit packaging system with leads and method of manufacture thereof
#3343Integrated circuit packaging system with an intermediate pad and method of manufacture thereof
#3344Semiconductor device package having a jumper chip and method of fabricating the same
#3345Dual-leadframe multi-chip package and method of manufacture
#3346Semiconductor memory device and manufacturing the same
#3347Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#3348Power MOS transistor device and switch apparatus comprising the same
#3349Semiconductor substrate and semiconductor chip
#3350Semiconductor device and manufacturing method of the same
#3351Method of sensing magnitude of current through semiconductor power device
#3352Layered chip package with wiring on the side surfaces
#3353Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces
#3354Leadframe based multi terminal IC package
#3355Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device
#3356High power semiconductor device for wireless applications and method of forming a high power semiconductor device
#3357Integrated circuit package for semiconductior devices with improved electric resistance and inductance
#3358Electronic circuit device
#3359METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO PARTS
#3360CONNECTING PAD PRODUCING METHOD
#3361Semiconductor package and semiconductor device
#3362SEMICONDUCTOR DEVICE
#3363Multi-surface IC packaging structures
#3364Thin package system with external terminals and method of manufacture thereof
#3365Semiconductor device capable of switching operation mode and operation mode setting method therefor
#3366Semiconductor device
#3367Semiconductor device and optical pickup device
#3368SEMICONDUCTOR POWER DEVICE HAVING A STACKED DISCRETE INDUCTOR STRUCTURE
#3369High Frequency Power Supply Module Having High Efficiency and High Current
#3370Manufacturing method for semiconductor package
#3371Microwave circuit package
#3372Printed circuit board (PCB) including a wire pattern, semiconductor package including the PCB, electrical and electronic apparatus including the semiconductor package, method of fabricating the PCB, and method of fabricating the semiconductor package
#3373Electronic component
#3374Resin-sealed electronic control device and method of fabricating the same
#3375Current sensors and methods
#3376Semiconductor circuit and switching power supply apparatus
#3377Two-shelf interconnect
#3378Method of manufacturing a semiconductor device
#3379LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH
#3380Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
#3381Led lead frame structure
#3382Semiconductor package
#3383Semiconductor apparatus and endoscope apparatus
#3384RFID integrated circuit with integrated antenna structure
#3385Semiconductor device
#3386Lead frame ball grid array with traces under die
#3387Semiconductor device and electronic device
#3388Semiconductor storage device and manufacturing method thereof
#3389Method for manufacturing semiconductor device
#3390Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same
#3391Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly
#3392Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
#3393Semiconductor device and a method of manufacturing the same
#3394Rule-based semiconductor die stacking and bonding within a multi-die package
#3395SEMICONDUCTOR PACKAGE
#3396Stacked semiconductor package
#3397Semiconductor package
#3398Semiconductor package of a flipped MOSFET and its manufacturing method
#3399LEAD FRAME FOR SEMICONDUCTOR DIE
#3400SEMICONDUCTOR DEVICE
#3401Semiconductor device
#3402Power semiconductor device
#3403Semiconductor module and portable apparatus provided with semiconductor module
#3404Method of manufacturing a semiconductor device
#3405LED assembly with a protective frame
#3406LED PACKAGE
#3407Method of manufacturing a semiconductor device
#3408Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole
#3409PACKAGE FOR SYNCHRONOUS RECTIFIER MODULE
#3410High frequency semiconductor device
#3411Interconnection structure
#3412Interconnection structure and its design method
#3413Stacked package of semiconductor device
#3414Semiconductor device
#3415Etched recess package on package system
#3416Multi-chip package having frame interposer
#3417Semiconductor device
#3418NON-DIRECT BOND COPPER ISOLATED LATERAL WIDE BAND GAP SEMICONDUCTOR DEVICE
#3419Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation
#3420Semiconductor device module
#3421ELECTRONIC COMPONENT PACKAGE, METHOD FOR PRODUCING THE SAME AND INTERPOSER
#3422Semiconductor device
#3423Chip packaging with metal frame pin grid array
#3424Semiconductor device and manufacturing method thereof
#3425Chip module
#3426SEMICONDUCTOR PACKAGE
#3427Dual die semiconductor package
#3428EMI shielding package structure and method for fabricating the same
#3429Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material
#3430Semiconductor chip assembly with post/base heat spreader and plated through-hole
#3431Method of teaching eyepoints for wire bonding and related semiconductor processing operations
#3432SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#3433Method of manufacturing semiconductor device
#3434High frequency amplifier
#3435Electronic devices and components for high efficiency power circuits
#3436Laser optical path detection
#3437WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCOTOR PACKAGE HAVING THE WIRING SUBSTRATE
#3438Semiconductor device sealed in a resin section and method for manufacturing the same
#3439Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof
#3440Tape wiring substrate and tape package using the same
#3441Die package including multiple dies and lead orientation
#3442Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products
#3443Semiconductor device including a DC-DC converter having a metal plate
#3444Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation
#3445Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems
#3446Method for manufacturing electronic device and electronic device
#3447SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#3448Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof
#3449Semiconductor chip package assembly with deflection-resistant leadfingers
#3450Semiconductor device and method of manufacturing the same
#3451SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#3452Fabrication method of semiconductor package structure
#3453Method of manufacturing semiconductor device
#3454Semiconductor device and DC-to-DC converter
#3455Inductive relayed coupling circuit between substrates
#3456Quad flat no lead (QFN) package
#3457Integrated circuit packaging system having planar interconnect and method for manufacture thereof
#3458Semiconductor package and stack semiconductor package having the same
#3459Semiconductor package
#3460Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs
#3461Semiconductor package structure
#3462Image sensor packaging structure with black encapsulant
#3463SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS
#3464Disguising test pads in a semiconductor package
#3465Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts
#3466Method of manufacturing semiconductor device
#3467Device and method for limiting drain-source voltage of transformer-coupled push pull power conversion circuit
#3468Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element
#3469Systems employing a stacked semiconductor package
#3470Radio frequency amplifier with effective decoupling
#3471Microelectronic assembly with joined bond elements having lowered inductance
#3472Lead frame land grid array with routing connector trace under unit
#3473MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE
#3474Window ball grid array (BGA) semiconductor packages
#3475Integrated circuit package with embedded components
#3476Integrated circuit package system employing device stacking
#3477Flow sensors having nanoscale coating for corrosion resistance
#3478Semiconductor connection component
#3479External storage device and method of manufacturing external storage device
#3480Integrated circuit packaging system with bond wire pads and method of manufacture thereof
#3481Semiconductor device having a microcomputer chip mounted over a memory chip
#3482Integrated circuit packaging system with a stackable package and method of manufacture thereof
#3483Ball grid array package enhanced with a thermal and electrical connector
#3484Chip assembly with chip-scale packaging
#3485Semiconductor device, substrate and semiconductor device manufacturing method
#3486Semiconductor die package including IC driver and bridge
#3487Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
#3488High voltage semiconductor device including a free wheel diode
#3489Semiconductor device and method of manufacturing the same
#3490Method of forming at least one bonding structure
#3491Leadframe for leadless package, structure and manufacturing method using the same
#3492SEMICONDUCTOR DEVICE WITH FILTER CIRCUIT
#3493Semiconductor device
#3494AREA REDUCTION FOR SURFACE MOUNT PACKAGE CHIPS
#3495Semiconductor device and method of manufacturing the same
#3496Multi-chip stacked package and its mother chip to save interposer
#3497Semiconductor device with sealed semiconductor chip
#3498Leadframe for leadless package, structure and manufacturing method using the same
#3499Heat radiation member for a semiconductor package with a power element and a control circuit
#3500Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof
#3501Semiconductor device, and communication apparatus and electronic apparatus having the same
#3502Semiconductor device and inspection method therefor
#3503Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
#3504Method for manufacturing semiconductor package system with die support pad
#3505Process to form semiconductor packages with external leads
#3506Pressure-bonded ball diameter detecting apparatus and pressure-bonded ball diameter detecting method
#3507Universal IO unit, associated apparatus and method
#3508Alternator with synchronous rectification equipped with an improved electronic power module
#3509Semiconductor device
#35103D interconnection structure and method of manufacturing the same
#3511Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region
#3512Thermal enhanced upper and dual heat sink exposed molded leadless package and method
#3513Packaged device and method of manufacturing the same
#3514Semiconductor device
#3515Semiconductor device and lead frame thereof
#3516Semiconductor device including first semiconductor chip including first pads connected to first terminals, and second semiconductor chip including second pads connected to second terminals
#3517Electrical bond connection system
#3518Multi-layer thick-film RF package
#3519Light emitting device and method for manufacturing the same
#3520SEMICONDUCTOR DEVICE
#3521ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE AND AN ELECTRICAL CONDUCTOR WITHIN A VIA AND A PROCESS OF FORMING THE SAME
#3522Power semiconductor module and method for operating a power semiconductor module
#3523Integrated circuit packaging system with interconnect and method of manufacture thereof
#3524Integrated Circuit Packaging with Split Paddle
#3525Bonding apparatus and bonding method
#3526Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#3527Semiconductor memory device and semiconductor memory card using the same
#3528SEMICONDUCTOR PACKAGE AND DC-DC CONVERTER
#3529Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package
#3530Semiconductor package and system
#3531POWER AND SIGNAL DISTRIBUTION OF INTEGRATED CIRCUITS
#3532Integrated circuit packaging system with leads and method of manufacture thereof
#3533Semiconductor device packaging including a power semiconductor element
#3534Method of making a semiconductor chip assembly with a post/base/post heat spreader
#3535Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
#3536Power semiconductor module
#3537Semiconductor apparatus and chip selection method thereof
#3538Power semiconductor module and method for operating a power semiconductor module
#3539Semiconductor device and method for manufacturing the same
#3540Microelectronic assembly with impedance controlled wirebond and conductive reference element
#3541Power module assembly with reduced inductance
#3542Semiconductor chip assembly with post/base/post heat spreader
#3543Light-emitting diode package
#3544SUBSTRATE-MOUNTED CIRCUIT MODULE HAVING COMPONENTS IN A PLURALITY OF CONTACTING PLANES
#3545Method of manufacturing semiconductor device and method of manufacturing electronic device
#3546Method for connecting a die assembly to a substrate in an integrated circuit
#3547Hybrid package
#3548Semiconductor package and method for fabricating the same
#3549Semiconductor device
#3550Microelectronic assembly with impedance controlled wirebond and conductive reference element
#3551Lead frame and intermediate product of semiconductor device
#3552Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same
#3553Package structure of photodiode and forming method thereof
#3554MULTICHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
#3555Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
#3556Method for manufacturing a package-on-package type semiconductor device
#3557Area reduction for die-scale surface mount package chips
#3558Leadframe packages having enhanced ground-bond reliability
#3559Area reduction for surface mount package chips
#3560STACK-TYPE SOLID-STATE DRIVE
#3561SEMICONDUCTOR DEVICE WITH DOUBLE-SIDED ELECTRODE STRUCTURE AND ITS MANUFACTURING METHOD
#3562Semiconductor device and manufacturing method thereof
#3563Area reduction for electrical diode chips
#3564Semiconductor Device
#3565Semiconductor chip assembly with post/base heat spreader with ESD protection layer
#3566Semiconductor device
#3567Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrate
#3568Electrical connection for multichip modules
#3569Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#3570Semiconductor device and method for manufacturing the same
#3571Semiconductor package with integrated interference shielding and method of manufacture thereof
#3572SEMICONDUCTOR PACKAGE WITH SECTIONED BONDING WIRE SCHEME
#3573Semiconductor integrated circuit and multi-chip module
#3574Die stacking system and method
#3575Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure
#3576Lead frame and method of manufacturing the same
#3577Multi-chip module for battery power control
#3578Self locking and aligning clip structure for semiconductor die package
#3579Molded leadframe substrate semiconductor package
#3580POWER DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME
#3581Manufacturing method of semiconductor device
#3582Power semiconductor module and method for operating a power semiconductor module
#3583Electronic device
#3584SEMICONDUCTOR DEVICE
#3585Semiconductor device with copper wire having different width portions
#3586RF transistor packages with internal stability network including intra-capacitor resistors and methods of forming RF transistor packages with internal stability networks including intra-capacitor resistors
#3587SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE AND LEAD FRAME, COMPRISING A BENT CONTACT SECTION
#3588MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES AND ITS FABRICATION METHOD
#3589Multiple die layout for facilitating the combining of an individual die into a single die
#3590Semiconductor integrated circuit
#3591Manufacturing method of semiconductor device
#3592Method of manufacturing semiconductor device
#35933D smart power module
#3594Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#3595Method of fabricating a high-temperature compatible power semiconductor module
#3596SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
#3597Semiconductor package with semiconductor core structure and method of forming the same
#3598Integration of SMD components in an IC housing
#3599Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#3600Semiconductor device and manufacturing method of the same