Semiconductor package and method of manufacturing the semiconductor package

Integrated circuit packaging system with circuitry stacking and method of manufacture thereof

CHIP PACKAGE AND PROCESS THEREOF

Resin-sealed semiconductor device and method of manufacturing the same

Semiconductor device including vertical transistor and horizontal transistor

Printed wiring board and method for manufacturing the same

Semiconductor package

SEMICONDUCTOR DEVICE PACKAGE WITH DOWN-SET LEADS

Folded lands and vias for multichip semiconductor packages

Metal oxide semiconductor field effect transistor integrating a capacitor

Method of integrating a MOSFET with a capacitor

MEMS device package with vacuum cavity by two-step solder reflow method

Impedance optimized chip system

Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging

Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond

Semiconductor device, and power conversion device using semiconductor device

Electronic devices with extended metallization layer on a passivation layer

Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof

CONNECTION DEVICE BEWTEEN TRANSISTOR AND LEAD FRAME

Semiconductor package and method for packaging the same

Encapsulant interposer system with integrated passive devices and manufacturing method therefor

Semiconductor device with electromagnetic interference shielding

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Hybrid Packaged Gate Controlled Semiconductor Switching Device Using GaN MESFET

Power semiconductor device

DEVICES AND METHOD FOR MANUFACTURING A DEVICE

Electronic component

High frequency circuit having multi-chip module structure

Semiconductor device

Interposer chip and manufacturing method thereof

Electronic device and method of manufacturing the same

Electronic part and method of manufacturing the same

QFN SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD STRUCTURE ADAPTED FOR THE SAME

Flexible contactless wire bonding structure and methodology for semiconductor device

Semiconductor memory device and semiconductor memory card

Method for manufacturing semiconductor device

Wireless transmission system and wireless transmission method

Illumination apparatus

Circuit board having bypass pad

Semiconductor device

Semiconductor device

Integrated circuit

Electronic device and manufacturing method therefor

Semiconductor device

Ball-grid-array package, electronic system and method of manufacture

Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portion

Manufacturing method for integrating a shunt resistor into a semiconductor package

INTERPOSER, MODULE, AND ELECTRONICS DEVICE INCLUDING THE SAME

Integrated circuit device and electronic equipment

Semiconductor package requiring reduced manufacturing processes

Wireless communication unit and semiconductor device having a power amplifier therefor

Integrated circuit device and electronic apparatus

WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE

Multi-die package

Semiconductor device and method for manufacturing the same

Semiconductor package and package-on-package semiconductor device

Semiconductor device package having features formed by stamping

Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors

High frequency field-effect transistor

METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED CIRCUIT CHIP AND ELECTRONIC DEVICE

Semiconductor device

METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGNING APPARATUS, SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, PACKAGE AND SEMICONDUCTOR INTEGRATED CIRCUIT

Semiconductor device and method of fabrication

SEMICONDUCTOR DEVICE

Semiconductor chip package

Semiconductor chip package

Multi-Connect Lead

Semiconductor device

Multi-die DC-DC buck power converter with efficient packaging

Semiconductor device having grooved leads to confine solder wicking

SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD WITH FOLDED EDGE

Dual-level package

Multilayer dielectric substrate and semiconductor package

System and method to reduce the bondwire/trace inductance

Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other

Simplified multichip packaging and package design

Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device

Lighting device, display, and method for manufacturing the same

Ribbon connecting electrical components

Die-to-die electrical isolation in a semiconductor package

Chip scale module package in BGA semiconductor package

Semiconductor chip package and method for designing the same

Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof

Systems and Methods of Improved Heat Dissipation with Variable Pitch Grid Array Packaging

Semiconductor device and manufacturing method of the same

LEAD FRAME, AND ELECTRONIC PART USING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Lead frame routed chip pads for semiconductor packages

Leadframe, leadframe type package and lead lane

Semiconductor device and semiconductor device manufacturing method

Power converter integrated circuit floor plan and package

Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packages

Radio-frequency system in package including antenna

Layered chip package

Package manufacturing method and semiconductor device

FLAT CHIP PACKAGE AND FABRICATION METHOD THEREOF

Multi-chip package and method of providing die-to-die interconnects in same

Semiconductor device with embedded interconnect pad

Semiconductor chip

Semiconductor device and manufacturing method thereof

MEMORY CARD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor package with substrate having single metal layer and manufacturing methods thereof

Wafer level stack structure for system-in-package and method thereof

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof

Lead frame design to improve reliability

Semiconductor device that suppresses malfunctions due to noise generated in internal circuit

Semiconductor package having substrate with solder ball connections and method of fabricating the same

Method of forming wire bonds in semiconductor devices

SEMICONDUCTOR PACKAGE, STACK MODULE, CARD, AND ELECTRONIC SYSTEM

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Processes and structures for IC fabrication

Methods for interconnecting bonding pads between components

Integrated circuit packaging system with high lead count and method of manufacture thereof

Stacked chip package structure with leadframe having inner leads with transfer pad

IC PACKAGE HAVING AN INDUCTOR ETCHED INTO A LEADFRAME THEREOF

Semiconductor device

Processes and structures for IC fabrication

Processes and structures for beveled slope integrated circuits for interconnect fabrication

Radio frequency unit analog level detector and feedback control system

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device

Manufacturing method of a lead frame

Electronic element packaging module

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

MULTI-CHIP SEMICONDUCTOR PACKAGE

Semiconductor apparatus and manufacturing method of the same

Semiconductor device

Method of manufacturing layered chip package

Optical module and method for manufacturing same

Method of manufacturing electronic device and electronic device

Joint structure and electronic component

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor package

Method for semiconductor leadframes in low volume and rapid turnaround

QUAD FLAT PACKAGE STRUCTURE HAVING EXPOSED HEAT SINK, ELECTRONIC ASSEMBLY AND MANUFACTURING METHODS THEREOF

Semiconductor device

Substrate for electrical device

Semiconductor package, lead frame, and wiring board with the same

Lens support and wirebond protector

Circuit board having bypass pad

Semiconductor power module

Semiconductor device

Integrated circuit packaging system with leads and transposer and method of manufacture thereof

Semiconductor device

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

Method for fabricating QFN semiconductor package

Die down ball grid array packages and method for making same

Antennas using chip-package interconnections for millimeter-wave wireless communication

Semiconductor chip and semiconductor device including the same

Die Exposed Chip Package

Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same

Semiconductor Device Package Having Chip With Conductive Layer

QFN semiconductor package

QFN semiconductor package

LEAD FRAME FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor device driving bridge-connected power transistor

Optoelectronic system

Molded housing used in force fit method

Package with multiple dies

IC card with terminals for direct access to internal components

Semiconductor device

Electronic component for surface mounting

Plastic package and method of fabricating the same

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor device

Semiconductor package including power ball matrix and power ring having improved power integrity

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

SEMICONDUCTOR DEVICE

Semiconductor packages and electronic systems including the same

Integrated circuit package system with offset stacking and anti-flash structure

Power lead-on-chip ball grid array package

Semiconductor device and method for manufacturing metallic shielding plate

Semiconductor device, method of manufacturing the same, and silane coupling agent

Semiconductor device including an inductor that is inductively coupled to another inductor

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

Method of fabricating stacked semiconductor structure

Multi-chip packages providing reduced signal skew and related methods of operation

Semiconductor device and manufacturing method thereof

IC package reducing wiring layers on substrate and its carrier

Semiconductor chip package

Electronic device package

Stacked chip package structure with leadframe having bus bar

Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof

Stacked chip package structure with leadframe having bus bar

Panel, semiconductor device and method for the production thereof

Semiconductor component having through wire interconnect (TWI) with compressed wire

SEMICONDUCTOR MODULE

Manufacturing method of semiconductor integrated circuit device

Widebody coil isolators

Exposed die pad package with power ring

Semiconductor device capable of switching operation modes

SEMICONDUCTOR DEVICE

Semiconductor device and method for manufacturing the same

Staircase shaped stacked semiconductor package

Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof

Relay board and semiconductor device having the relay board

Semiconductor die package and method for making the same

Semiconductor device and manufacturing method thereof

Method of fabricating a two-sided die in a four-sided leadframe based package

Method of manufacturing a semiconductor device including plural semiconductor chips

STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS

Fabrication method of multi-chip stack structure

RF POWER AMPLIFIER CIRCUIT UTILIZING BONDWIRES IN IMPEDANCE MATCHING

DC/DC converter package having separate logic and power ground terminals

Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly

MULTI-DIE PACKAGE WITH IMPROVED HEAT DISSIPATION

Semiconductor device with I/O cell and external connection terminal and method of manufacturing the same

Method of manufacturing semiconductor device

Stacked memory device including a pre-decoder/pre-driver sandwiched between a plurality of inter-decoders/inter-drivers

Integrated circuit chip using top post-passivation technology and bottom structure technology

Stacked multichip package

Integrated circuit package system with multiple device units and method for manufacturing thereof

Semiconductor device

Semiconductor packages and electronic systems including the same

Semiconductor device and method of manufacturing same

Semiconductor device and manufacturing method therefor

Multichip discrete package

Lead frame and method for manufacturing circuit device using the same

Circuit device having funnel shaped lead and method for manufacturing the same

Semiconductor module and camera module mounting said semiconductor module

Multi-chip packages including extra memory chips to define additional logical packages and related devices

Semiconductor package

Power module

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

IO cell with multiple IO ports and related techniques for layout area saving

Methods and systems for packaging integrated circuits

SEMICONDUCTOR DEVICE

Semiconductor package

Semiconductor device and wire bonding method

SEMICONDUCTOR PACKAGE SUBSTRATE INCLUDING FUSES, SEMICONDUCTOR DEVICE PACKAGE, SEMICONDUCTOR MODULE AND ELECTRONIC APPARATUS INCLUDING THE SAME

Semiconductor device having finger electrodes

FLMP buck converter with a molded capacitor and a method of the same

Microelectronic assembly with impedance controlled wirebond and reference wirebond

SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM

Semiconductor device

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Thee-dimensional integrated semiconductor device and method for manufacturing same

Wire loop and method of forming the wire loop

Semiconductor device

Semiconductor Carrier for Multi-Chip Packaging

Semiconductor device which can transmit electrical signals between two circuits

Semiconductor device

Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the same

Semiconductor device

Integrated circuit for driving semiconductor device and power converter

Wire bond interconnection

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Leadless integrated circuit package having standoff contacts and die attach pad

Leadless integrated circuit package having electrically routed contacts

Leadless integrated circuit package having standoff contacts and die attach pad

RF-IC PACKAGING METHOD AND CIRCUITS OBTAINED THEREBY

Light emitting diode chip with electrical insulation element

Semiconductor device having a junction FET and a MISFET for control

Multi-surface IC packaging structures and methods for their manufacture

Semiconductor device having shifted stacked chips

SEMICONDUCTOR DEVICE

Complete power management system implemented in a single surface mount package

Quad flat non-leaded package

Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method

Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board

Electronic device and lead frame

LOW COST BONDING TECHNIQUE FOR INTEGRATED CIRCUIT CHIPS AND PDMS STRUCTURES

Ribbon bonding in an electronic package

Module having a stacked magnetic device and semiconductor device and method of forming the same

Chip and Transmitter for Wireless Communication System

Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Stack package

Systems and methods of tamper proof packaging of a semiconductor device

Electronic device

Reduced-crosstalk wirebonding in an optical communication system

Bidirectional switch module

Lead frame assembly, package structure and LED package structure

Fully reflective and highly thermoconductive electronic module and method of manufacturing the same

Module having a stacked magnetic device and semiconductor device and method of forming the same

Semiconductor device with additional power supply paths

Quad flat package with exposed common electrode bars

Semiconductor device packages with electromagnetic interference shielding

Semiconductor apparatus with decoupling capacitor

Semiconductor device and wire bonding method

Thin film light emitting diode

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Method of manufacturing a semiconductor package with fine pitch lead fingers

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Wireless radio frequency signal transceiving system

III-nitride devices and circuits

Electronic component

Semiconductor device and manufacturing method thereof

Semiconductor device

Power transistor package with integrated bus bar

Layered chip package with wiring on the side surfaces

Semiconductor device and semiconductor memory device

Leadframe structure for electronic packages

Integrated circuit package system including shield